JP-2026074512-A - Methods for separating compositions, adhesives, cured products, and components, methods for manufacturing components, and methods for manufacturing components for processing.

JP2026074512AJP 2026074512 AJP2026074512 AJP 2026074512AJP-2026074512-A

Abstract

[Problem] To provide a composition with excellent peelability and decomposition properties. [Solution] A composition comprising (A) a polyfunctional ester-type thiol compound having two or more ester-type thiol groups in its molecule, (B) a reactive compound having a group that reacts with the ester-type thiol group in its molecule, and (C) one or more film-forming aids selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol, wherein the ratio of the number of ester-type thiol groups in the (A) polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol group in the (B) reactive compound is 1.5:1 to 3.0:1, the content of (C) film-forming aids is 10 to 80 parts by mass when the content of the (B) reactive compound in the composition is 100 parts by mass, and the (B) reactive compound contains an epoxy resin. [Selection Diagram] None

Inventors

平健二郎
竹下樹
木村朋子

Assignees

株式会社ADEKA

Dates

Publication Date: 20260507
Application Date: 20241021

Claims (10)

A composition comprising (A) a polyfunctional ester-type thiol compound having two or more ester-type thiol groups in its molecule, (B) a reactive compound having a group that reacts with the ester-type thiol group in its molecule, and (C) one or more film-forming aids selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol, In the composition, the ratio of the number of ester-type thiol groups in (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups in (B) the reactive compound is 1.5:1 to 3.0:1. When the content of (B) reactive compound in the composition is 100 parts by mass, the content of (C) film-forming aid is 10 to 80 parts by mass. (B) A composition in which the reactive compound contains an epoxy resin.
(A) The composition according to claim 1, wherein the polyfunctional ester-type thiol compound is a polyfunctional ester-type thiol compound having 3 to 6 ester-type thiol groups in the molecule.
In the composition, the ratio of the number of ester-type thiol groups in (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups in (B) the reactive compound is 1.6:1 to 2.4:1. The composition according to claim 1, wherein the content of (C) film-forming aid is 20 to 50 parts by mass when the content of (B) reactive compound in the composition is 100 parts by mass.
The composition according to claim 1, for use as an easily peelable and dismantled adhesive.
An adhesive containing the composition described in claim 1.
A cured product of the composition described in claim 1.
A method for separating members, comprising the step of separating a first member and a second member by exfoliating and dismantling the adhesive layer contained in a laminate formed by laminating a first member, an adhesive layer containing a cured product of the composition described in claim 1, and a second member in this order, by contacting the laminate with an alkaline solution.
The method for separating a member according to claim 7, wherein the step of separating the first member and the second member is to separate the first member and the second member by exfoliating and dismantling the adhesive layer by contacting it with an alkaline solution at 20 to 90°C for 10 seconds to 720 minutes.
A method for manufacturing a component, comprising the step of separating the first component and the second component by exfoliating and disassembling the adhesive layer contained in a laminate formed by laminating a first component, an adhesive layer containing a cured product of the composition described in claim 1, and a second component in this order, by contacting the laminate with an alkaline solution.
A method for manufacturing a processing member, comprising the step of separating the processing member and the protective film by exfoliating and dismantling the protective film contained in a laminate formed by laminating a processing member and a protective film containing a cured product of the composition described in claim 1, by contacting the protective film with an alkaline solution.

Description

This invention relates to a composition with excellent peelability and delamination properties, an adhesive containing the same, a cured product of the composition, a method for separating components, a method for manufacturing components, and a method for manufacturing components for processing. Epoxy resins exhibit excellent thermal, mechanical, and electrical properties, leading to their increasing application in various fields such as electrical and electronic equipment materials, mechanical materials, civil engineering and construction materials, and everyday goods. Furthermore, in developing epoxy resins for various applications, the use of thiol compounds as curing agents has been proposed to achieve desired properties depending on the purpose. For example, Patent Document 1 describes a corrosion inhibitor used for corrosion protection of insulated wires, characterized by comprising epoxy resin as the main component and containing a thiol-based curing agent. Patent Document 2 describes a process for forming an elastic polymer by curing a reaction mixture containing a specific polyepoxide-terminated polyether, a specific polythiol compound as a curing agent, and a base catalyst. On the other hand, in the field of manufacturing electronic components such as semiconductor-related parts and various substrate materials, manufacturing methods have been proposed that use adhesives that can be easily removed by solution treatment after curing, etc., for the temporary bonding of parts required for manufacturing or the temporary protection of specific parts. For example, Patent Document 3 describes a method for manufacturing a diffused wafer, comprising the steps of: creating an ingot by bonding a plurality of silicon wafers with an adhesive; bonding the ingot to a base member using an adhesive; cutting the central part of each of the double-sided diffused silicon wafers constituting the ingot; and removing the adhesive applied between the silicon wafers and the adhesive applied between the ingot and the base member to obtain a single-sided diffused wafer. Furthermore, Patent Document 4 describes a method for manufacturing a semiconductor device, characterized by comprising the steps of forming an element on the main surface of a semiconductor wafer, forming a protective member on the main surface of a semiconductor wafer, performing a processing treatment on the back surface of a semiconductor wafer, and removing the protective member. Japanese Patent Publication No. 2013-67847Special Publication No. 2016-501970Japanese Unexamined Patent Publication No. 7-29837Japanese Patent Publication No. 2000-232085 (A) Polyfunctional ester-type thiol compounds The polyfunctional ester-type thiol compounds used in the present invention are polyfunctional thiol compounds having two or more ester-type thiol groups in the molecule, and specifically, compounds having two or more ester-type thiol groups represented by the following general formula (1) in the molecule. In the formula, R represents a linear alkylene group having 1 to 4 carbon atoms or a branched alkylene group having 2 to 4 carbon atoms. Examples of such groups include a methylene group, an ethylene group, a propylene group, a butylene group, a branched ethylene group, a branched propylene group, and a branched butylene group. In the present invention, by using a polyfunctional ester-type thiol compound having such a structure in combination with a reactive compound and a film-forming aid described later, a composition that can be peeled off with an alkaline solution even after curing can be obtained. In the present invention, from the viewpoint of obtaining a composition with superior peelability, it is preferable that the polyfunctional ester-type thiol compound has an ester-type thiol group in the molecule in which R in general formula (1) is a methylene group, an ethylene group, a propylene group, or a butylene group, more preferably an ester-type thiol group in which R is a methylene group or an ethylene group, and even more preferably an ester-type thiol group in which R is an ethylene group. Furthermore, two or more polyfunctional ester-type thiol compounds with different R groups in general formula (1) may be used. For example, a polyfunctional ester-type thiol compound having an ester-type thiol group where R in general formula (1) is a methylene group and a polyfunctional ester-type thiol compound having an ester-type thiol group where R in general formula (1) is an ethylene group may be used. The number of ester-type thiol groups represented by general formula (1) in the polyfunctional ester-type thiol compound used in the present invention is not particularly limited as long as there are two or more, and can be appropriately adjusted according to the purpose. From the viewpoint of obtaining a composition with superior peelability, it is preferable to use a polyfunctional ester-type thiol compound having 2 to 8 ester-type thiol groups represented by g