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JP-2026074587-A - Grinding stone and method for manufacturing grinding stones

JP2026074587AJP 2026074587 AJP2026074587 AJP 2026074587AJP-2026074587-A

Abstract

[Problem] To provide a grinding wheel and a method for manufacturing a grinding wheel that have a low environmental impact. [Solution] The grinding wheels 10 and 20 are formed by bonding abrasive grains A with a binder B. The binder B is solid before processing the workpiece 2, and melts on the workpiece 2 side during processing. As a result, the binder B functions as at least one of a lubricant and a cleaning agent related to processing. Furthermore, the average particle size of the abrasive grains A in the grinding wheels 10 and 20 at locations shallow from the processing surface 11, which is the surface on the workpiece 2 side, is larger than the average particle size of the abrasive grains A at locations deeper from the processing surface 11. [Selection Diagram] Figure 2

Inventors

  • 大西 修
  • 土肥 俊郎

Assignees

  • 国立大学法人 宮崎大学

Dates

Publication Date
20260507
Application Date
20241021

Claims (9)

  1. A grinding wheel formed by the bonding of abrasive grains with a binder, The binder is solid before processing the workpiece, and melts on the workpiece side during processing, thereby functioning as at least one of a lubricant and a cleaning agent related to the processing. A grinding wheel in which the average particle size of the abrasive grains in the area shallow from the workpiece surface is larger than the average particle size of the abrasive grains in the area deeper from the workpiece surface.
  2. A grinding wheel according to claim 1, Regarding the depth direction from the processed surface, the average particle size of the abrasive grains is smaller at depths where the abrasive grains appear on the surface and come into contact with the workpiece at a later time during the processing of the workpiece.
  3. A grinding wheel according to claim 1 or claim 2, A grinding wheel in which the distribution of the average particle size of the abrasive grains in the depth direction from the machined surface is sloped such that the particle size is larger in areas shallower from the machined surface and smaller in areas deeper from the machined surface.
  4. A grinding wheel according to claim 1 or claim 2, It has a first layer, a second layer located deeper than the first layer when viewed from the processed surface, and a third layer located deeper than the second layer when viewed from the processed surface. The average particle size of the abrasive grains in the second layer is smaller than the average particle size of the abrasive grains in the first layer. A grinding wheel in which the average particle size of the abrasive grains in the third layer is even smaller than the average particle size of the abrasive grains in the second layer.
  5. A grinding wheel according to claim 1 or claim 2, The aforementioned binder is water, which is used in the grinding wheel.
  6. A method for manufacturing a grinding wheel, which is a grinding wheel in which abrasive grains are bound together with a binder, Multiple types of abrasive grains, each with a different average particle size, are dispersed in the liquid binder. A method for manufacturing a grinding wheel, comprising bonding multiple types of abrasive grains together by solidifying the binder while the binder is dispersed in a liquid binder.
  7. A method for manufacturing a grinding wheel, which is a grinding wheel in which abrasive grains are bound together with a binder, On the surface of a layer formed by bonding the first type of abrasive grains, which are abrasive grains with an average particle size different from the first type of abrasive grains, with the binder in a solid state, a second type of abrasive grains and the binder in liquid form are supplied. A method for manufacturing a grinding wheel, comprising solidifying the supplied binder to bond the supplied second type of abrasive grains.
  8. A method for manufacturing a grinding wheel according to claim 7, A method for manufacturing a grinding wheel, wherein, after supplying the second type of abrasive grains, and before the liquid binder solidifies, the grains are pressed against the solid binder to create a state in which they are embedded in the solid binder.
  9. A method for manufacturing a grinding wheel according to any one of claims 6 to 8, A method for manufacturing a grinding wheel using water as the binder.

Description

An application for application of Article 30, Paragraph 2 of the Patent Law was filed. This was explained at the 26th "Current Status and Future of Tribo-Coating" Symposium on February 22, 2024. This disclosed technology relates to a grinding wheel formed by bonding abrasive grains with a binder, and to a method for manufacturing a grinding wheel. Grinding wheels are generally manufactured by binding abrasive grains together with a binder. For example, Patent Document 1 discloses a method for manufacturing grinding wheels by filling a mixed powder of abrasive grains and a binder into a mold, molding it, and then firing it. Patent No. 7262864 This figure shows a processing apparatus capable of processing a workpiece using a grinding wheel according to the embodiment.This is a schematic diagram of a cross-section of a grinding wheel according to the first embodiment.This is a diagram illustrating the manufacturing method of a grinding wheel according to the first embodiment.This is a schematic diagram of a cross-section of a grinding wheel according to the second embodiment.This is a diagram illustrating the manufacturing method of a grinding wheel according to the second embodiment.This figure shows abrasive particles supplied onto the surface of a solid binder.This diagram shows the state in which abrasive particles supplied onto the surface of a solid binder become embedded in the solid binder. The embodiments of the disclosed technology will be described in detail below with reference to the attached drawings. First, the first embodiment will be described, followed by other embodiments different from the first embodiment. <First Embodiment> First, with reference to Figure 1, a processing apparatus 1 capable of grinding and polishing a workpiece 2 using a grinding wheel 10 according to this embodiment will be described. The grinding wheel 10 of this embodiment used in the processing apparatus 1 is plate-shaped. The grinding wheel 10 has a circular outer circumference. The grinding wheel 10 has a processing surface 11 and a base surface 12. The processing surface 11 and the base surface 12 are the end faces in the thickness direction of the plate-shaped grinding wheel 10, respectively. The processing surface 11 is the surface facing the workpiece 2. The grinding wheel 10 can grind and polish the workpiece 2 by bringing the workpiece 2 into contact with the processing surface 11. The base surface 12 is the back surface opposite to the processing surface 11. The processing apparatus 1 comprises a grinding wheel holder 3, a workpiece holder 4, a rotation drive unit 5, and a pressing unit 6. The grinding wheel holder 3 holds the grinding wheel 10 on its base surface 12. In this embodiment, the grinding wheel holder 3 holds the grinding wheel 10 with its processing surface 11 facing upwards. The workpiece holder 4 holds the workpiece 2. The rotational drive unit 5 can rotate the grinding wheel holder 3. This moves the machining surface 11 of the grinding wheel 10, held by the grinding wheel holder 3, so that it slides against the workpiece 2. The pressing unit 6 can press the workpiece holder 4 downwards with a predetermined pressure. This presses the workpiece 2, held by the workpiece holder 4, against the machining surface 11 of the grinding wheel 10. The processing device 1 can process the workpiece 2 by rotating the grinding wheel 10 at a predetermined peripheral speed and pressing the workpiece 2 against the processing surface 11 of the grinding wheel 10. Furthermore, the processing device 1 can remove the workpiece 2 from the workpiece holder 4 by releasing its grip. This allows the processing device 1 to process multiple workpieces 2 while replacing them. Additionally, the processing device 1 can remove the grinding wheel 10 from the grinding wheel holder 3 by releasing its grip. This allows the processing device 1 to process workpieces 2 while replacing worn-out grinding wheels 10. Figure 2 is a schematic cross-sectional view of the grinding wheel 10 of this embodiment. Figure 2 shows the initial state of the grinding wheel 10 before machining the workpiece 2. As shown in Figure 2, the grinding wheel 10 is composed of abrasive grains A and a binder B. The abrasive grains A are formed by bonding the abrasive grains A with the binder B. Specifically, as abrasive grains A, for example, diamond abrasive grains, CBN (cubic boron nitride) abrasive grains, alumina-based abrasive grains, silicon carbide-based abrasive grains, silicon oxide-based abrasive grains, cerium oxide-based abrasive grains, zirconia-based abrasive grains, chromium oxide-based abrasive grains, etc., as well as polymer/resin particle-based abrasive grains, etc. The type of abrasive used in the grinding wheel 10 can be determined according to the material of the workpiece 2 and the purpose of the machining. The binder B in this embodiment can be a solid before processing the workpiece 2, and melts on the workpiece 2 side during processing, t