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JP-2026074631-A - electronic equipment

JP2026074631AJP 2026074631 AJP2026074631 AJP 2026074631AJP-2026074631-A

Abstract

[Problem] To provide an electronic device that can suppress the occurrence of ion migration. [Solution] The electronic device 20 includes a substrate 30, a coupling inductor 40 having a plurality of coils 42 arranged in the X direction on a core 41, and solder for joining the coils 42 to the lands 35. The coils 42 have terminals 421 and 422 located on the substrate side of the lower surface of the core 41. The terminals 421 and 422 have mounting portions 421a and 422a that overlap with the corresponding lands 35 in a plan view, and non-mounting portions 421b and 422b that are the parts excluding the mounting portions 421a and 422a and are arranged to overlap with the core 41. The substrate 30 is provided so as to overlap with a portion of the non-mounting portions 421b and 422b, and has a support portion 37 that protrudes toward the coupling inductor side relative to the lands 35 and supports the coupling inductor 40. [Selection Diagram] Figure 4

Inventors

  • 真田 圭

Assignees

  • 株式会社デンソー

Dates

Publication Date
20260507
Application Date
20241021

Claims (14)

  1. A substrate (30) having an insulating substrate (31) and a plurality of lands (35) arranged on one surface of the insulating substrate, An inductor component (40) having a core (41) and a plurality of coils (42) arranged on the core and aligned in a predetermined direction perpendicular to the thickness direction of the substrate, A solder (70) that joins the coil and the land, Equipped with, Each of the coils has external connection terminals (421, 422) located on the substrate side of the core that faces the substrate, The terminal has a mounting portion (421a, 422a) provided so as to overlap with the corresponding land in a plan view in the thickness direction of the plate, and a non-mounting portion (421b, 422b) which is the portion excluding the mounting portion and is arranged so as to overlap with the core in a plan view. The substrate is provided so as to overlap with a portion of the non-mounted portion of at least one of the terminals in the plan view, and has a support portion (37) that protrudes toward the inductor component side relative to the land and supports the inductor component via the non-mounted portion, in an electronic device.
  2. The electronic device according to claim 1, wherein the support portion includes a support conductor (371) positioned at a location separate from the land on the surface.
  3. The electronic device according to claim 2, wherein the support portion includes a resist (372) arranged to cover the support conductor.
  4. The electronic device according to claim 3, wherein the support conductor is electrically isolated from all of the lands joined to the coil.
  5. The electronic device according to claim 1, wherein the substrate has a plurality of support portions provided to support one of the inductor components.
  6. The multiple support parts are arranged in the predetermined direction, The electronic device according to claim 5, wherein adjacent support portions are arranged apart in the predetermined direction such that the terminals that do not overlap with the support portions are located between adjacent support portions.
  7. The electronic device according to claim 5, wherein the plurality of support portions are provided directly below the coil, positioned closer to the end of the inductor component than to the center of the inductor component in the predetermined direction.
  8. The electronic device according to claim 7, wherein the plurality of support portions are provided directly below the coils located at both ends in the predetermined direction.
  9. The core has a plurality of core portions (411) individually provided with respect to the coil and on which the corresponding coil is wound, a first end portion (412) to which one end of the plurality of core portions is connected, and a second end portion (413) arranged between the first end portion and the plurality of core portions in an orthogonal direction perpendicular to both the thickness direction and the predetermined direction, to which the other ends of the plurality of core portions are connected. The core portion is divided into multiple parts in the orthogonal direction and has gaps (411g) between them. The electronic device according to any one of claims 1 to 3, wherein the support portion is arranged to overlap with at least a portion of the gap in the plan view.
  10. Each of the coils has, as terminals, a first terminal (421) and a second terminal (422) that is spaced apart from the first terminal and aligned in the predetermined direction. The electronic device according to claim 9, wherein the support portion is arranged in the portion of the gap that overlaps with the region between the first terminal and the second terminal in the plan view.
  11. The electronic device according to claim 10, wherein the support portion is arranged to overlap with all of the gaps in one of the core portions.
  12. The electronic device according to claim 9, wherein the support portion is arranged to overlap with at least a portion of each of the gaps between the plurality of core portions.
  13. The circuit board is mounted and includes a switching device (50) and a capacitor (60) that, together with the inductor component, constitute a multiphase power supply. In an orthogonal direction perpendicular to both the plate thickness direction and the predetermined direction, the inductor component is arranged between the switching device and the capacitor. The electronic device according to claim 2, wherein the support conductor is a ground wire that electrically connects the capacitor and the switching device.
  14. The electronic device according to claim 1, wherein the inductor component is arranged on the surface of the core opposite to the surface facing the substrate, and has a cover (43) that covers the core and the plurality of coils.

Description

The disclosures in this specification relate to electronic devices. Patent Document 1 discloses an electronic control device comprising a printed circuit board and a QFN-type semiconductor package. The contents of the prior art document are incorporated by reference as explanations of the technical elements in this specification. International Publication No. 2022/145094 This is a circuit diagram showing a multiphase power supply to which the electronic device according to the first embodiment is applied.This figure shows an example of an ECU equipped with a multiphase power supply.This is a plan view showing an example of an electronic device.Figure 3 shows the view with the coupled inductor transparent.This is a perspective view showing a coupled inductor.This is a plan view of the coupled inductor, seen from above.This is a plan view of a coupled inductor seen from the bottom.This is a perspective view showing the core.This is a perspective view showing a coil.This is a cross-sectional view along the line X-X in Figure 3.This is a cross-sectional view along the line XI-XI in Figure 3.This is a floor plan showing an example.This is a cross-sectional view along the line XIII-XIII in Figure 12.This is a cross-sectional view showing another example.This is a plan view showing an electronic device according to the second embodiment.This is a cross-sectional view along the line XVI-XVI in Figure 15.This is a plan view showing an electronic device according to the third embodiment.This is a cross-sectional view along the line XVIII-XVIII in Figure 17.This diagram shows the effect of substrate distortion in the example.This is a plan view of a coupled inductor, one of the electronic devices according to the fourth embodiment, as seen from the bottom.This diagram shows the leakage magnetic flux in a reference example where no support structure is provided.This is a cross-sectional view along the line XXII-XXII in Figure 21.This diagram shows the arrangement of the core gap, coil terminals, and support parts.This is a cross-sectional view along the line XXIV-XXIV in Figure 23.This is a plan view illustrating a modified example.This is a plan view illustrating a modified example.This is a plan view showing an electronic device according to the fifth embodiment.This is a plan view illustrating a modified example. The following describes several embodiments based on the drawings. Note that in each embodiment, corresponding components are denoted by the same reference numerals, and redundant explanations may be omitted. If only a portion of the configuration is described in each embodiment, the configuration of other embodiments described earlier can be applied to the remaining parts of that configuration. Furthermore, not only are the configurations explicitly stated in the description of each embodiment possible, but configurations from multiple embodiments can also be partially combined, even if not explicitly stated, as long as there are no particular problems with the combination. (First Embodiment) The electronic device according to this embodiment includes an inductor component containing multiple coils (inductors), as described later. The inductor component is, for example, a coupled inductor. Such an electronic device can be applied to various electronic circuits, such as power supply circuits and high-frequency circuits. The electronic device can be used, for example, to reduce size and cost in a configuration using multiple inductors. An example of its application to a multiphase power supply will be described below. <Multiphase power supply> Figure 1 is a circuit diagram showing an example of a multiphase power supply to which the electronic device according to this embodiment is applied. For convenience, some drivers are shown in a simplified manner in Figure 1. The multiphase power supply 10 shown in Figure 1 is a step-down DC-DC converter. The multiphase power supply 10 steps down the input voltage Vin to a predetermined voltage and outputs it as an output voltage Vout. The multiphase power supply 10 comprises multiple drivers 11, multiple inductors 12 corresponding to the drivers 11, and capacitors 13. The multiphase power supply 10 has multiple phases. Phases are sometimes referred to as stages, channels, etc. The driver 11 has switching elements 11H and 11L. The switching elements 11H and 11L are connected in series between the power supply line to which the input voltage Vin is input and the ground (GND) line, with switching element 11H on the high side. The switching elements 11H and 11L may be, for example, MOSFETs or IGBTs. The switching elements 11H and 11L may also be bipolar transistors. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. IGBT is an abbreviation for Insulated Gate Bipolar Transistor. One end of the inductor 12 is connected to the connection point (midpoint) of the switching elements 11H and 11L. The other end of the inductor 12 is connected to the