JP-2026074692-A - Mounting information management device, mounted circuit board manufacturing system, and trace information creation method

JP2026074692AJP 2026074692 AJP2026074692 AJP 2026074692AJP-2026074692-A

Abstract

[Problem] To provide a mounting information management device, a mounting board manufacturing system, and a method for creating trace information that can obtain trace information including measurement data of components mounted on a substrate. [Solution] A trace information creation method for creating information about components that have been removed from a carrier tape containing components and mounted on a circuit board involves acquiring primary trace information including information about the components mounted on the circuit board or information about the mounting position of the components on the circuit board, and measurement data obtained by measuring the components removed from the carrier tape (ST31), and creating trace information by associating the acquired measurement data with the primary trace information (ST32). [Selection Diagram] Figure 13

Inventors

江口亮司
長瀬和行
工藤良太
高嶋敦志

Assignees

パナソニックＩＰマネジメント株式会社

Dates

Publication Date: 20260507
Application Date: 20241021

Claims (9)

A mounting information management device that manages information about components that have been removed from a carrier containing components and mounted on a circuit board, An information acquisition unit that acquires primary trace information including information about components mounted on the substrate or information about the mounting position of components on the substrate, and measurement data obtained by measuring components removed from the carrier, An implementation information management device comprising: a trace information creation unit that creates trace information by associating the acquired measurement data with the primary trace information;
If the aforementioned measurement data was obtained by taking measurements during the mounting process of mounting components onto the substrate, The mounting information management device according to claim 1, wherein the trace information creation unit creates the trace information by associating the measurement data with the primary trace information of the component mounted on the substrate or the mounting position of the component after measurement.
A mounting board manufacturing system that includes a component mounting device for removing components from a carrier containing components and mounting them onto a substrate, and for manufacturing a mounted substrate with components mounted on the substrate, A primary trace information recording unit creates and records primary trace information including information about components mounted on a substrate by the component mounting device or information about the mounting position of components on the substrate. A measuring unit that measures the parts removed from the carrier by the parts mounting device and creates measurement data including the measurement details, A mounting board manufacturing system comprising: a trace information creation unit that creates trace information by associating the measurement data with the primary trace information.
The mounting substrate manufacturing system according to claim 3, wherein the measurement unit, when an event occurs during the operation of the component mounting device in which the carrier switches to a new carrier or an event in which there is a possibility of a switch to a new carrier, measures the component removed from the carrier immediately thereafter and creates the measurement data.
The mounting substrate manufacturing system according to claim 3, wherein the measuring unit, when a predetermined number of components are removed from the carrier during the operation of the component mounting device, measures the components removed from the carrier immediately afterward to create the measurement data.
The mounting substrate manufacturing system according to claim 3, wherein the measurement unit measures the component immediately after a predetermined time has elapsed since the component was removed from the carrier while the component mounting device was in operation, and generates the measurement data.
If the aforementioned measurement data was obtained by taking measurements in between mounting operations of components onto a circuit board, The mounting substrate manufacturing system according to any one of claims 3 to 6, wherein the trace information creation unit creates the trace information by associating the measurement data with the primary trace information of the component mounted on the substrate or the mounting position of the component after measurement.
A method for creating trace information that generates information about a component that has been removed from a carrier containing the component and mounted on a circuit board, An information acquisition step of acquiring primary trace information including information about components mounted on the substrate or information about the mounting position of components on the substrate, and measurement data obtained by measuring components removed from the carrier, A method for creating trace information, comprising: a step of creating trace information by associating the acquired measurement data with the primary trace information.
If the aforementioned measurement data was obtained by taking measurements during the mounting process of mounting components onto the substrate, The trace information creation method according to claim 8, wherein in the trace information creation step, the measurement data is associated with the primary trace information of a component mounted on the substrate after measurement or the mounting position of the component to create the trace information.

Description

This disclosure relates to a mounting information management device and a mounting substrate manufacturing system for managing information related to components mounted on a substrate, as well as a method for creating trace information. A component mounting device is known that includes a characteristic measurement unit for measuring the characteristics of components, and measures components taken from a carrier tape or the like using the characteristic measurement unit (for example, Patent Document 1). In these component mounting devices, before mounting components onto a substrate, components are taken from the carrier tape and their electrical characteristics are measured using the characteristic measurement unit to determine whether the component to be mounted on the substrate is correct, thereby preventing component mix-ups caused by errors in carrier tape installation, etc. Patent Document 1 discloses that device information, which associates the reel ID of the reel containing the carrier tape with the measurement results of the components, is registered in the mounting management server, and if the device information received by the mounting processing device contains measured information, the component mounting process is executed. International Publication No. 2014/203331 A diagram illustrating the configuration of a printed circuit board manufacturing system according to one embodiment of the present disclosure.A plan view showing the configuration of a key part of a component mounting device included in a mounted substrate manufacturing system according to one embodiment of the present disclosure.A diagram illustrating the configuration of a key component mounting device in a substrate manufacturing system according to one embodiment of the present disclosure.A plan view showing an example of a substrate on which components are mounted in a mounting substrate manufacturing system according to one embodiment of the present disclosure.A diagram illustrating the configuration of the main parts of a measurement unit mounted on a component mounting device in a substrate manufacturing system according to one embodiment of the present disclosure.(a)(b)(c) Diagram illustrating the measurement process by a measurement unit attached to a component mounting device in a substrate manufacturing system according to one embodiment of the present disclosure.An explanatory diagram of a splicing tape feeder used in a component mounting device in a printed circuit board manufacturing system according to one embodiment of the present disclosure.An explanatory diagram of a non-splicing tape feeder used in a component mounting device in a printed circuit board manufacturing system according to one embodiment of the present disclosure.A block diagram showing the configuration of a printed circuit board manufacturing system according to one embodiment of the present disclosure.(a) An explanatory diagram of an example of trace information used in a printed circuit board manufacturing system according to one embodiment of the present disclosure. (b) An explanatory diagram of an example of primary trace information. (c) An explanatory diagram of an example of measurement data.A flowchart of a component mounting method according to one embodiment of the present disclosure.A flowchart of a method for measuring parts according to one embodiment of the present disclosure.A flowchart of a trace information creation method according to one embodiment of the present disclosure. An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations and shapes described below are illustrative examples for illustrative purposes and can be appropriately modified according to the specifications of the mounted substrate manufacturing system, mounted information management device, mounted line, component mounting device, etc. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 2 and some parts described later, the X-axis (left-right direction in Figure 2) and the Y-axis (up-down direction in Figure 2), which are perpendicular to the substrate transport direction, are shown as two mutually orthogonal axes in the horizontal plane. In Figure 3 and some parts described later, the Z-axis (up-down direction in Figure 3) is shown as the height direction perpendicular to the horizontal plane. First, referring to Figure 1, the configuration of the printed circuit board (PCB) manufacturing system 1 will be explained. The PCB manufacturing system consists of a single mounting line L, with the work equipment and mounting information management device 3 connected via a communication network 2. Note that the PCB manufacturing system 1 does not necessarily have to have one mounting line L; it may have two or more. In this case, the mounting information management device 3 will be connected to two or more mou