JP-2026074727-A - Thermosetting resin composition and semiconductor device

Abstract

【assignment】 The present invention aims to provide a thermosetting resin composition that exhibits excellent adhesion to metals. [Solution] (A) Thermosetting resin (B) Silane coupling agent represented by the following formula (I) (In formula (I), R1 is an alkyl group having 1 to 8 carbon atoms independently, m is an integer from 1 to 3, n is an integer from 0 to 10, Q is a single bond or an amide bond (-NHCO-), and A is a nitrogen-containing heterocyclic group containing at least two nitrogen atoms, one of which is bonded to a carbon atom of -( CH2 ) n- or -NHCO-) A thermosetting resin composition comprising (C) a curing accelerator and (D) an inorganic filler. [Selection Diagram] None

Inventors

• 堀篭 洋希
• 長田 将一
• 川村 訓史
• 望月 尊生
• 萩原 健司
• 横田 竜平

Assignees

• 信越化学工業株式会社

Dates

Publication Date

20260507

Application Date

20241021

Claims (11)

1. (A) Thermosetting resin (B) Silane coupling agent represented by the following formula (I) (In formula (I), R1 is an alkyl group having 1 to 8 carbon atoms independently, m is an integer from 1 to 3, n is an integer from 0 to 10, Q is a single bond or an amide bond (-NHCO-), and A is a nitrogen-containing heterocyclic group containing at least two nitrogen atoms, one of which is bonded to a carbon atom of -( CH2 ) n- or -NHCO-) A thermosetting resin composition comprising (C) a curing accelerator and (D) an inorganic filler.
2. The thermosetting resin composition according to claim 1, wherein the (B) silane coupling agent is one or more compounds selected from any of the compounds represented by (1) to (4) below. (In formulas (1) to (4), R1 is an alkyl group having 1 to 8 carbon atoms independently of each other, X, Y, and Z are independently a carbon atom or a nitrogen atom, with 1 or 2 of X, Y, and Z being nitrogen atoms, R2 to R6 are independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, m is an integer from 1 to 3, n is an integer from 0 to 10, a, b, and c are 0 or 1, if X is a carbon atom, a is 1, if X is a nitrogen atom, a is 0, if Y is a carbon atom, b is 1, if Y is a nitrogen atom, b is 0, if Z is a carbon atom, c is 1, if Z is a nitrogen atom, c is 0, and d is an integer from 0 to 4).
3. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition contains an optional curing agent, and the amount of component (B) is 0.1 to 10 parts by mass, the amount of component (C) is 0.2 to 8 parts by mass, and the amount of component (D) is 50 to 1,500 parts by mass, based on 100 parts by mass of the total of component (A) and the optional curing agent.
4. The thermosetting resin composition according to claim 1, wherein the amount of component (D) is 30 to 97% by mass of the total mass of the thermosetting resin composition.
5. The thermosetting resin composition according to claim 1, wherein the (A) thermosetting resin is one or more selected from epoxy resins, phenolic resins, maleimide resins, bismaleimide resins, citraconimide resins, cyclic imide compounds, cyanate ester compounds, styrene resins, cyclopentadiene compounds and/or their oligomers, oxetane resins, (meth)acrylate resins, terminal (meth)acrylic group-modified polyphenylene ether resins, unsaturated polyester resins, and diallyl phthalate resins.
6. The thermosetting resin composition according to claim 1, wherein the thermosetting resin (A) is an epoxy resin.
7. The thermosetting resin composition according to claim 6, further comprising a curing agent.
8. The thermosetting resin composition according to claim 6, wherein the epoxy resin is one or more selected from the group consisting of phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, biphenyl type epoxy resin, bisphenol type epoxy resin, triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, and dicyclopentadiene-modified phenol type epoxy resin.
9. The thermosetting resin composition according to claim 7, wherein the curing agent is one or more selected from the group consisting of phenol novolac resin, orthocresol novolac resin, triphenolmethane resin, alkyl-modified triphenolmethane resin, phenol aralkyl resin, biphenyl aralkyl resin, and dicyclopentadiene-modified phenol resin.
10. The thermosetting resin composition according to claim 1, wherein Q is a single bond in formula (I).
11. A semiconductor device having a cured product of a thermosetting resin composition according to any one of claims 1 to 10.

Description

This invention relates to a thermosetting resin composition and a semiconductor device having a cured product thereof. With the recent trend towards miniaturization and weight reduction of electronic devices, high-density mounting of electronic components onto circuit boards is becoming increasingly important. Compared to conventional pin-insertion type packages, surface-mount packages require less circuit board space for mounting, thus enabling miniaturization and weight reduction. In surface mount packages, the entire package is exposed to high temperatures during the reflow oven process when soldering to the circuit board. If the package has absorbed moisture, the rapid expansion of the moisture can cause delamination between the insert (such as the component or lead frame) and the encapsulant, resulting in package cracks. Therefore, the encapsulant must be able to absorb moisture and maintain good adhesion to the insert after reflow. Patent Document 1 investigates epoxy group-containing silane coupling agents, amino group-containing silane coupling agents, and thiol group-containing silane coupling agents, but their adhesion to nickel and nickel/palladium/gold was insufficient. Japanese Patent Publication No. 2007-063549 The present invention will be described in more detail below. [(A) Thermosetting resin] The thermosetting resin composition of the present invention contains (A) a thermosetting resin. The thermosetting resin can be, for example, a resin containing one or more selected from epoxy resins, phenolic resins, maleimide resins, bismaleimide resins, citraconimide resins, cyclic imide compounds, cyanate ester compounds, styrene resins, cyclopentadiene compounds and/or their oligomers, oxetane resins, (meth)acrylate resins, terminal (meth)acrylic group-modified polyphenylene ether resins, unsaturated polyester resins, and diallyl phthalate resins. Among these, epoxy resins are preferred. The blending ratio of (A) thermosetting resin in the thermosetting resin composition of the present invention is 3 to 60% by mass of the thermosetting resin relative to the total composition, preferably 5 to 50% by mass. The epoxy resin is not particularly limited, but examples include epoxy resins conventionally used in the field of epoxy resin compositions for semiconductor encapsulation. Such epoxy resins include crystalline epoxy resins such as phenol novolac type epoxy resins, orthocresol novolac type epoxy resins, naphthol novolac type epoxy resins, biphenyl type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, and dihydroanthracenediol type epoxy resins; polyfunctional epoxy resins such as triphenolmethane type epoxy resins and alkyl-modified triphenolmethane type epoxy resins; phenol aralkyl type epoxy resins having a phenylene skeleton; biphenyl aralkyl type epoxy resins having a biphenylene skeleton; and phenylene skeleton-containing epoxy resins. Examples of epoxy resins include aralkyl epoxy resins such as phthol aralkyl epoxy resins and naphthol biphenylaralkyl epoxy resins having a biphenylene skeleton; naphthol epoxy resins such as dihydroxynaphthalene epoxy resins and epoxy resins obtained by glycidyl etherification of dihydroxynaphthalene dimers; triazine core-containing epoxy resins such as triglycidyl isocyanurate and monoallyl diglycidyl isocyanurate; and cyclic hydrocarbon compound-modified phenol epoxy resins such as dicyclopentadiene-modified phenol epoxy resins. These may be used individually or in combination of two or more. Among these, phenol novolac epoxy resins, orthocresol novolac epoxy resins, biphenyl epoxy resins, bisphenol epoxy resins, triphenolmethane epoxy resins, alkyl-modified triphenolmethane epoxy resins, phenol aralkyl epoxy resins, biphenyl aralkyl epoxy resins, and dicyclopentadiene-modified phenol epoxy resins are preferred due to their excellent moldability and cured properties. Epoxy resins can be used in combination with a curing agent. Suitable curing agents include phenolic resins, acid anhydrides, amines, and activated esters. Among these, phenolic resins are preferred due to their heat and moisture resistance. Examples of phenolic resins include phenol novolac resin, orthocresol novolac resin, triphenolmethane resin, alkyl-modified triphenolmethane resin, phenol aralkyl resin, biphenyl aralkyl resin, dicyclopentadiene-modified phenolic resin, naphthalene ring-containing phenolic resin, biphenyl-type phenolic resin, alicyclic phenolic resin, heterocyclic phenolic resin, naphthalene ring-containing phenolic resin, bisphenol A-type phenolic resin, and bisphenol F-type phenolic resin. These may be used individually or in combination of two or more. Of these, phenol novolac resin, orthocresol novolac resin, triphenolmethane resin, alkyl-modified triphenolmethane resin, phenol aralkyl resin, biphenyl aralkyl resin, and dicyclopentadiene-modified phenolic resin are preferred due to their excellent moldability and cured properties. The mixing rati