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JP-2026074739-A - Photosensitive resin composition

JP2026074739AJP 2026074739 AJP2026074739 AJP 2026074739AJP-2026074739-A

Abstract

[Problem] To provide a photosensitive resin composition that can be repurposed as a photoresist and facilitates the formation of a high-resolution wavelength conversion layer. [Solution] A photosensitive resin composition comprising a photopolymerizable compound, a dispersant consisting of a first unit represented by general formula (1) and a second unit represented by a specific formula, a solvent, and perovskite phosphor particles. [Selection Diagram] None

Inventors

  • 手島 隆行

Assignees

  • キヤノン株式会社

Dates

Publication Date
20260507
Application Date
20241021

Claims (11)

  1. Photopolymerizable compounds, Dispersant and Solvent and, The dispersant comprises perovskite phosphor particles dispersed in the photopolymerizable compound, The dispersant comprises a first unit and a second unit, The first unit includes a unit represented by the following general formula (1): The second unit includes a unit represented by the following general formula (2): A part of the unit represented by the general formula (1) has a side chain C having a zwitterionic portion consisting of a combination of A and B, A photosensitive resin composition characterized in that the side chain R2 of the unit represented by the general formula (2) has a hydrogen atom, or a part of the molecular chain of the side chain R2 has one functional group selected from the group consisting of a carboxyl group, a sulfate group, a phosphate group, and a hydroxyl group. (In the above general formulas (1) and (2), R1 represents a hydrogen atom or a methyl group, A represents a dialkylammonium diyl group, or a group represented by the following formula (3): B represents one selected from the group consisting of sulfonate groups, carboxhlate groups, and quaternary ammonium groups. k, l, m, and n each represent an integer.
  2. The photosensitive resin composition according to claim 1, wherein the photopolymerizable compound is alkali-soluble.
  3. The photopolymerizable compound comprises an acrylate monomer having a carboxyl group or a hydroxyl group, as described in claim 1, for the photosensitive resin composition.
  4. The photosensitive resin composition according to claim 1, wherein the number-average molecular weight of the dispersant is 1,000 or more and 50,000 or less.
  5. The photosensitive resin composition according to claim 1, wherein the unsensitive portion of the photosensitive resin composition is an alkali-soluble, alkali-developable negative-type resist.
  6. The photosensitive resin composition according to claim 1, wherein the solvent comprises one or more selected from the group consisting of toluene, xylene, and mesitylene.
  7. The photosensitive resin composition according to claim 1, wherein n/m, which is the value obtained by dividing n by m, is greater than 0.25 and less than 20.
  8. The photosensitive resin composition according to claim 1, wherein k is 2 or more and 3 or less.
  9. The photosensitive resin composition according to claim 1, wherein l is 2 or more and 4 or less.
  10. The photosensitive resin composition according to claim 1, wherein when the amount of the photopolymerizable compound is 100 parts by mass, the amount of the perovskite phosphor particles is 0.5 parts by mass or more and 10 parts by mass or less.
  11. The dispersant comprises a third unit, The photosensitive resin composition according to claim 1, wherein the third unit comprises (meth)acrylate.

Description

This invention relates to a photosensitive resin composition. In recent years, the application of quantum dots as wavelength conversion materials to display elements has been investigated. One proposed display element using quantum dots is a color filter with a wavelength conversion layer containing quantum dots, placed between partitions on an organic light-emitting pixel array that serves as the light source. In this color filter with a wavelength conversion layer, wavelength conversion layers containing quantum dots with different emission wavelengths are arranged adjacent to each pixel within the region of each pixel. The wavelength conversion layer containing quantum dots is formed by curing an ink made of a photocurable composition. Patent Document 1 discloses a photocurable composition in which fluorescent particles containing a perovskite compound are dispersed in a photopolymerizable compound with a dispersant such as a phosphoric acid compound or a carboxylic acid compound. Furthermore, Patent Document 2 discloses an inkjet ink that uses a photocurable composition as the ink, and to adjust the surface tension and ensure the wettability of the ink on the printing substrate, a surfactant is added. In addition, Patent Document 3 discloses an ink composition that ensures dispersibility in a dispersion medium by using a ligand that forms a zwitterionic bond with the perovskite. Japanese Patent Publication No. 2020-70444Japanese Patent Publication No. 2020-45440Japanese Patent Publication No. 2023-81339 <One Embodiment> The embodiments of the present invention will be described in detail below. The photosensitive resin composition according to an embodiment of the present invention has the following characteristics. The photosensitive resin composition of the present invention is Photopolymerizable compounds, Dispersant and Solvent and, The dispersant comprises perovskite phosphor particles dispersed in the photopolymerizable compound, The dispersant comprises a first unit and a second unit, The first unit includes a unit represented by the following general formula (1): The second unit includes a unit represented by the following general formula (2): A part of the unit represented by the general formula (1) has a side chain C having a zwitterionic portion consisting of a combination of A and B, The side chain R2 of the unit represented by the general formula (2) is characterized in that it has a hydrogen atom, or a part of the molecular chain of the side chain R2 has one functional group selected from the group consisting of a carboxyl group, a sulfate group, a phosphate group, and a hydroxyl group. (In the above general formulas (1) and (2), R1 represents a hydrogen atom or a methyl group, A represents a dialkylammonium diyl group, or a group represented by the following formula (3): B represents one selected from the group consisting of sulfonate groups, carboxhlate groups, and quaternary ammonium groups. k, l, m, and n each represent an integer. Furthermore, the structure can be confirmed using a nuclear magnetic resonance (NMR) spectrometer. Embodiments of the present invention will be described below with reference to the drawings. The photosensitive resin composition of this embodiment comprises a photopolymerizable compound, a dispersant, a solvent, and perovskite phosphor particles dispersed in the photopolymerizable compound by the dispersant. A specific example of the photopolymerizable compound in this embodiment includes a base polymer having a photopolymerizable crosslinking portion and a photopolymerization initiator. In addition to these, the photopolymerizable compound may also contain a polymerizable crosslinking agent. In this embodiment, the photosensitive resin composition preferably contains an alkali-soluble photopolymerizable compound. By imparting alkali solubility to the photopolymerizable compound, a photosensitive resin composition capable of alkali development is obtained. A suitable method for imparting alkali solubility to the photopolymerizable compound is to introduce hydroxyl and carboxyl groups into the molecule. Here, alkali solubility in the present invention refers to dissolution in a general alkaline developer. Specifically, it refers to dissolution in a widely used 2.38% aqueous solution of tetraammonium hydroxide (TMAH). The mechanism of dissolution is that the H + (proton) of any of the carboxyl group, sulfate group, phosphate group, and hydroxyl group forms a salt with the alkaline cation, becoming a soluble group in the alkaline aqueous solution and dissolving. In this embodiment, it is preferable that the unexposed portion (unphotosensitive area) of the photosensitive resin composition is an alkali-developable negative-type resist that is alkali-soluble. To use the photosensitive resin composition of this embodiment as a photoresist, either a positive type, where the exposed portion dissolves easily in the developer compared to the unexposed portion, or a n