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JP-2026075085-A - Manufacturing machine for electronic assembly production lines equipped with "Focus Depth Estimation Method" optical inspection system

JP2026075085AJP 2026075085 AJP2026075085 AJP 2026075085AJP-2026075085-A

Abstract

[Problem] To enable easily implemented and reliable 3D inspection of solder paste deposits and components to be mounted and/or already mounted in an electronic assembly manufacturing line. [Solution] The optical inspection system includes an illumination device (230) for illuminating an object (295), a camera system (240) for capturing a first image of the object illuminated with a first measuring light (242a) and a second image of the object illuminated with a second measuring light (244a), an optical system (250) arranged in the optical paths of the illumination light, the first measuring light and/or the second measuring light, and an image processing unit (260) located downstream of the camera system. The illumination device and the camera system are configured and arranged such that the first image has a first blur and the second image has a second blur, and are configured to determine a three-dimensional elevation map relating to at least a portion of the object based on the first and second images. [Selection Diagram] Figure 2

Inventors

  • ビョルン・オールロゲ
  • カール－ハインツ・ベッシュ

Assignees

  • エーエスエムピーティー・ゲーエムベーハー・ウント・コ・カーゲー

Dates

Publication Date
20260507
Application Date
20251021
Priority Date
20241021

Claims (20)

  1. A manufacturing machine (100) for an electronic assembly manufacturing line, wherein the manufacturing machine (100) is Chassis (102); Manufacturing tools (119) that are attached to the chassis (102) directly or indirectly, in a movable or fixed manner; and, Optical inspection systems (120a, 120b, 220, 320, 420, 520) that are mounted directly or indirectly to the chassis (102) in a movable or fixed manner; Includes, The optical inspection system (120a, 120b, 220, 320, 420, 520) includes an illumination device (230) for illuminating an object (295) with illumination light (230a), a camera system (240, 340, 440, 540) for capturing (i) a first image of the object (295) illuminated using first measurement light (242a, 342a, 442a), and (ii) a second image of the object illuminated using second measurement light (244a, 344a, 444a), and is arranged in the optical path of the illumination light (230a), the first measurement light (242a, 342a, 442a), and/or the second measurement light (244a, 344a, 444a). A manufacturing machine (100) having an optical system (250, 550) and an image processing unit (260) located downstream of the camera system (240, 340, 440, 540), wherein the illumination device (230), the optical system (250, 550) and/or the camera system (240, 340, 440, 540) are configured and arranged such that the first image has a first blur and the second image has a second blur different from the first blur, and the image processing unit (260) is configured to determine a three-dimensional elevation map relating to at least a portion of the object (295) based on the first image and the second image.
  2. The manufacturing machine (100) according to claim 1, wherein the first depth of field region assigned to the first blur of the optical image of the first image and the second depth of field region assigned to the second blur of the optical image of the second image do not overlap.
  3. The manufacturing machine (100) according to claim 1, wherein, along the propagation direction of the illumination light (230a), the first focal plane (F1) assigned to the first image is located in front of the objective plane of the object (295), and the second focal plane (F2) assigned to the second image is located behind the objective plane of the object (295).
  4. The manufacturing machine (100) according to claim 1, wherein at least one of the first or second blur is approximately zero.
  5. The manufacturing machine (100) according to claim 4, wherein the illumination light (230a) strikes the object (295) along the z-axis, and the first measuring light (242a, 342a, 442a) and the second measuring light (244a, 344a, 444a) move away from the object (295) along the z-axis.
  6. The manufacturing machine (100) according to claim 5, wherein the optical inspection system (120a, 120b, 220, 320, 420, 520) includes a first beam splitter (262) that spatially separates a portion of the illumination path of the illumination light (230a) from a portion of the measurement path of the measurement light (246).
  7. In particular, the manufacturing machine (100) according to claim 6, wherein at least one further illumination light (232a) is coupled to the object (295) through reflection at the first beam splitter (262), and the further illumination light (232a) irradiates the object (295) at a different angle than the illumination light (230a).
  8. The manufacturing machine (100) according to claim 7, wherein the illumination light (230a) and the further illumination light (232a) have different light colors.
  9. The manufacturing machine according to claim 1, wherein the optical system (250, 550) has at least substantially no chromatic aberration.
  10. The manufacturing machine (100) according to claim 1, wherein the optical system (250, 550) is a telecentric optical system.
  11. The manufacturing machine (100) according to claim 1, wherein the camera system is configured to capture a third image of the illuminated object using a third measuring light, the illumination device, the optical system, and/or the camera system are configured and arranged such that the third image has a third blur different from both the first and second blurs, and the image processing unit is further configured to determine a three-dimensional (3D) elevation map based on the third image.
  12. The manufacturing machine is a mounting machine (100), the manufacturing tool is a mounting head (119), and the mounting head (119) is (i) Pick up an electronic component (192) from the component pickup position (116) of the component supply device (115), (ii) The picked-up component (192) is transported to the mounting area (110) of the mounting machine (100) where the component carrier (190) to be mounted is located, and (iii) The components transported to the mounting area (110) are placed on the component carrier (190) at predetermined component mounting positions. A manufacturing machine (100) according to claim 1, configured as described above.
  13. The manufacturing machine (100) according to claim 12, wherein the camera system is fixedly attached directly or indirectly to the mounting head.
  14. The manufacturing machine (100) according to claim 12, wherein the camera system (240, 340, 440, 540) is directly or indirectly fixed and mounted to the chassis (102).
  15. The manufacturing machine according to claim 1, wherein the manufacturing machine is a solder paste printing device.
  16. The manufacturing machine (100) according to claim 1, wherein the camera system comprises a first image sensor (242, 442) for capturing the first image and a second image sensor (244, 444) for capturing the second image, and the two image sensors (242, 442; 244, 444) are fixedly positioned relative to the optical system (250) and/or the illumination device (230).
  17. The manufacturing machine (100) according to claim 16, wherein the optical inspection system (120a, 120b, 220) further includes a second beam splitter (264) that spatially separates a portion of the first measurement path of the first measurement light (242a) from a portion of the second measurement path of the second measurement light (244a).
  18. The manufacturing machine (100) according to claim 16, wherein the first image sensor is a transparent image sensor (444) that detects a first measurement light (444a), and the second measurement light (442a) passes through the transparent image sensor (444) in order to be detected by the second image sensor (442).
  19. The manufacturing machine (100) according to claim 1, wherein the camera system has only a single image sensor (342), the image sensor (342) is spatially positionable with respect to the object plane and/or the optical system (250), so that a first image can be captured at a first position of the single image sensor (342), and a second image can be captured at a second position of the single image sensor (342) different from the first position.
  20. The camera system (540) has only a single image sensor (542), the image sensor (542) is fixedly positioned with respect to the objective plane and/or the optical system (550), and the optical system (550) is an adaptive optical system (550) with respect to the focal point, thereby, (i) In the first state, the first image can be captured at the first focal point by a single image sensor (542), (ii) The manufacturing machine (100) according to claim 1, wherein in the second state, the second image can be captured at a second focal point by a single image sensor (542).

Description

This invention generally relates to the technical field of automated electronic equipment manufacturing. In particular, this invention relates to a manufacturing machine equipped with an optical inspection system for capturing and processing images, especially images of solder paste depots, components, and/or component carriers. Assembles with multiple discontinuous electronic components are typically built on component carriers, such as printed circuit boards. In the field of mass production of electronic equipment, this is generally done using special production lines that have transport equipment for component carriers and multiple manufacturing machines arranged along them. Manufacturing machines on an electronic equipment production line include solder paste printing machines, typically multiple sequentially arranged mounting machines, and soldering machines, all arranged along transport equipment. In a solder paste printing machine, high-viscosity solder paste is applied to a component carrier in the form of individual solder paste depots. This is generally done using screen printing. In a mounting machine, electronic components are placed on component carriers. For this purpose, a mounting machine typically has a mounting head, which (i) picks up the components to be mounted from the component pickup position of a component supply device, (ii) transports the picked-up components to the mounting area of the mounting machine where the component carriers to be mounted are located, and (iii) places the components transported to the mounting area onto the component carriers or associated solder paste depots at their respective designated mounting positions. To pick up components, a typical mounting head uses one or more component holding devices, for example, configured as vacuum grippers. In a soldering machine, the solder paste deposit is melted, and after cooling, the mounted components are soldered to the electrical component connection surface formed on the component carrier in a way that ensures a lasting and conductive bond. To ensure a reliable soldering process, each solder paste depot must contain a predetermined amount of solder paste. If the amount of solder paste in a depot is too small, the corresponding solder joint may be mechanically unstable and/or, in particular, have insufficient conductivity. If the amount of solder paste in a depot is too large, a short circuit may occur between adjacent component connection surfaces when melted in the soldering machine. Patent Document 1 discloses an image processing system for detecting the three-dimensional (3D) structure of a solder paste deposit applied to a component carrier. In this system, based on the principle of "photometric stereo," such a deposit is illuminated from three different lighting angles, and an image is captured from each angle. Each image has a separate intensity distribution dependent on the 3D shape of the deposit. By combining and evaluating three images, it becomes possible to determine the 3D structure of each solder paste deposit, and consequently, its volume or the amount of solder paste contained within. To ensure reliable and accurate mounting, it is necessary to optically capture the component held by the component holder using a camera and determine the precise spatial position of the held component relative to the (tip) of the component holder through appropriate image processing. If a deviation from the relative target position exists, it can be detected and corrected during the mounting process by appropriate positioning of the mounting head and/or rotation of the component holder around its longitudinal axis. Furthermore, it is possible to detect whether the component is held by the component holder in the correct orientation relative to its main face or in the wrong orientation relative to a smaller side (so-called upright position). It is also possible to detect cases where the component is held in an oblique or inclined spatial orientation. Furthermore, it is possible to detect cases where the held component has mechanical defects. Components held in the wrong orientation and defective components cannot be further processed and generally need to be removed from the mounting process. However, for reliable and accurate implementation, it is necessary to determine the precise position of each component carrier on which the components are to be mounted. Only then can it be guaranteed that each component is accurately placed on the component carrier at its designated mounting position. Typically, the position of a component carrier is determined by optically measuring at least one marking present on the component carrier. Capturing not only two-dimensional (2D) images but also three-dimensional (3D) images is desirable for the optical inspection processes of solder paste depots, components, and component carriers described above, and is essential for a rapid, accurate, and reliable manufacturing process. In this