JP-2026075096-A - Ultrasonic diamond scrubber unit

Abstract

[Problem] To provide an ultrasonic diamond scriber unit that enables deeper extension of vertical cracks necessary for cleaving a workpiece, such as a brittle material, when the workpiece is broken into individual pieces. [Solution] A high-rigidity ultrasonic holder, in which a Langevin-type piezoelectric element, a horn, and a cone are fixed by an outer cylinder, is used to amplified vibrations and scribe the cutting edge of a single-crystal diamond tool 4 attached to the tip of the cone. This provides an ultrasonic diamond scriber unit that enables the promotion of vertical crack propagation. Furthermore, in the scribing process of a workpiece 5 such as a brittle material, this ultrasonic diamond scriber unit utilizes ultrasonic vibrations perpendicular to the single-crystal diamond tool 4 to deepen the vertical cracks generated during scribing. The use of ultrasonic waves has the effect of reducing processing resistance due to load, and is expected to result in cleavage with less damage to the workpiece due to cleavage. [Selection Diagram] Figure 1

Inventors

• 熊倉 賢一

Assignees

• 株式会社クマクラ

Dates

Publication Date

20260507

Application Date

20251229

Claims (3)

1. An ultrasonic diamond scriber unit characterized by applying ultrasonic longitudinal vibrations to a diamond mounted on a shaft, with the tool tip shaped into a cone or pyramidal form, to continuously transfer indentations to the surface of various glass plates, ceramic plates, and compound semiconductor wafers, thereby scribing straight lines and quadratic curves, promoting the propagation of cracks in the vertical direction, and causing fracture.
2. An ultrasonic diamond scribing unit characterized in that the diamond described in claim 1 above is a single crystal or a polycrystalline diamond.
3. An ultrasonic diamond scribing unit characterized in that the diamond described in claims 1 and 2 is a single crystal and its tip has a (111) facet or a (110) facet.

Description

This invention relates to a mechanical processing method for cleaving glass and various ceramics, where conventional methods using carbide wheels are common. This method requires a large load, leaving damage to the substrate due to stress and strain during cleavage, which can cause problems with the quality of the workpiece. This invention applies ultrasonic vibration to the tool tip or wheel to reduce the cutting load, thereby reducing damage and promoting the propagation of vertical cracks. Cutting methods for glass and hard, brittle materials include the so-called mechanical scribe method, where a carbide wheel is loaded onto the workpiece surface to draw a line, and the stress on the scribed line causes cracks to form horizontally and vertically in the workpiece, dividing it. Alternatively, there is the so-called dicing method, where a thin, donut-shaped sintered diamond grinding wheel called a blade (outer blade) is rotated at high speed while water is applied to cut the material. Furthermore, there is the laser scribe method, where a carbon dioxide laser is directed at the workpiece and emitted in a linear pattern to cut by continuously creating tiny holes. However, all of these methods have problems that impair the quality of the workpiece. Conventional mechanical scribes cut by applying a load of several Newtons, leaving residual stress damage to the substrate, which can cause substrate failure due to thermal cycling. Dicing generates chips called kerf, which is the thickness of the outer blade, and cutting while applying water raises environmental concerns such as wastewater treatment. In addition, the application of water raises concerns about the impact on electrical circuits on the substrate. Laser scribing suffers from poor yield due to molten material adhering to the substrate and nearby electrodes, causing problems during chip mounting. Therefore, the ultrasonic-assisted diamond scribing method proposed here is expected to solve these problems and is highly anticipated for practical application. The ultrasonic diamond scriber unit developed in this project is expected to be a groundbreaking method for solving problems in processes such as wheel-based mechanical scribing, laser scribing, and dicing. It consists of a transmitter and an ultrasonic diamond scriber unit. As shown in the figure, the ultrasonic diamond scribing unit of this embodiment consists of a transmitter 1, a Langevin-type piezoelectric element 2, a horn 3, and a single-crystal diamond tool 4. The transmitter 1 applies a voltage to the Langevin-type piezoelectric element 2, generating ultrasonic vibrations. The generated ultrasonic vibrations are amplified by the horn 3, which is connected to the Langevin-type piezoelectric element 2, and propagated to the single-crystal diamond tool 4 attached to the tip of the horn. The tip of the single-crystal diamond tool 4, which is supported by the ultrasonic vibrations, is brought into contact with the upper surface of the workpiece 5, and the single-crystal diamond tool 4 moves horizontally across the upper surface of the workpiece while applying ultrasonic vibrations in the vertical direction.