JP-2026075223-A - Resin supply mechanism, resin molding apparatus, and method for manufacturing resin molded products

JP2026075223AJP 2026075223 AJP2026075223 AJP 2026075223AJP-2026075223-A

Abstract

[Problem] To provide a resin supply mechanism, etc., that can suppress misalignment of the plate. [Solution] The resin supply mechanism comprises a first stage, a first plate, a dispenser, and a measuring device. A first opening is formed in the first stage. The first plate covers the first opening when placed on the first stage. The measuring device supports the first plate from below through the first opening after the first stage moves downward. A first positioning pin and a second positioning pin are formed on one of the first stage and the first plate, and a first insertion hole and a second insertion hole are formed on the other. Compared to before the first stage moves downward, the shortest distance between the outer surface of the first positioning pin and the inner surface of the first insertion hole is longer, and the shortest distance between the outer surface of the second positioning pin and the inner surface of the second insertion hole is longer after the first stage moves downward. [Selection Diagram] Figure 1

Inventors

後藤智行
須江絢

Assignees

ＴＯＷＡ株式会社

Dates

Publication Date: 20260508
Application Date: 20241022

Claims (8)

A resin supply mechanism that supplies resin onto a release film used in resin molding, A first opening is formed, and a plate-shaped first stage moves in the vertical direction, A first plate that covers the first opening when placed on the first stage, A dispenser that supplies resin onto the release film placed on the first plate, After the first stage moves downward, the first plate is supported from below through the first opening, and a weighing device is provided to measure the weight of the resin on the release film placed on the first plate. A first positioning pin and a second positioning pin are formed on either the first stage or the first plate. The other of the first stage and the first plate has a first insertion hole and a second insertion hole formed therein, into which the first positioning pin and the second positioning pin are inserted, respectively. A resin supply mechanism wherein, compared to before the first stage moves downward, the shortest distance between the outer circumferential surface of the first positioning pin and the inner circumferential surface of the first insertion hole is longer, and the shortest distance between the outer circumferential surface of the second positioning pin and the inner circumferential surface of the second insertion hole is longer after the first stage moves downward.
The first positioning pin and the second positioning pin are formed on the first stage. The first plate has a first insertion hole and a second insertion hole formed therein. Each of the first positioning pin and the second positioning pin includes a base portion and a tip portion formed above the base portion. Before the first stage moves downward, at least a portion of the base portion of the first positioning pin and the second positioning pin are located within the first insertion hole and the second insertion hole, respectively. The resin supply mechanism according to claim 1, wherein, after the first stage moves downward, at least a portion of the tip of each of the first positioning pin and the second positioning pin is located inside the first insertion hole and the second insertion hole, respectively, and the base portion of each of the first positioning pin and the second positioning pin is located outside the first insertion hole and the second insertion hole, respectively.
Each of the base portion and the tip portion has a columnar shape, The resin supply mechanism according to claim 2, wherein in a plan view of the first positioning pin and the second positioning pin, the outer peripheral portion of the tip is located inside the outer peripheral portion of the base.
The resin supply mechanism according to claim 2 or 3, wherein each of the first positioning pin and the second positioning pin has a sloping portion formed at the boundary between the base portion and the tip portion, which increases inward as it approaches the tip portion.
A second opening is formed, and a plate-shaped second stage moves vertically, The system further comprises a second plate that covers the second opening when positioned on the second stage, The dispenser supplies resin onto the release film placed on the second plate, The weighing device, after the second stage has moved downward, supports the second plate from below through the second opening and measures the weight of the resin on the release film placed on the second plate. A third positioning pin and a fourth positioning pin are formed on either the second stage or the second plate. The other of the second stage and the second plate has a third insertion hole and a fourth insertion hole formed therein, into which the third positioning pin and the fourth positioning pin are inserted, respectively. The resin supply mechanism according to any one of claims 1 to 4, wherein, compared to before the second stage moves downward, the shortest distance between the outer circumferential surface of the third positioning pin and the inner circumferential surface of the third insertion hole is longer after the second stage moves downward, and the shortest distance between the outer circumferential surface of the fourth positioning pin and the inner circumferential surface of the fourth insertion hole is longer.
The first plate has a rectangular shape, The edge of the first plate closest to the position where the first positioning pin or the first insertion hole is formed is parallel to the edge of the first plate closest to the position where the second positioning pin or the second insertion hole is formed, The resin supply mechanism according to claim 1, wherein the edge of the first plate second closest to the position where the first positioning pin or the first insertion hole is formed on the first plate and the edge of the first plate second closest to the position where the second positioning pin or the second insertion hole is formed on the first plate are parallel to each other.
A resin molding apparatus for molding a pre-molded substrate that has not been molded with resin using resin, A resin supply mechanism according to any one of claims 1 to 6, A resin molding apparatus comprising a mold for performing resin molding of the substrate before molding using the resin supplied onto the release film.
A method for manufacturing a resin molded product using the resin molding apparatus described in claim 7, The release film to which the resin has been supplied, and the pre-molding substrate are placed in the molding die, A method for manufacturing a resin molded product, comprising clamping the mold using the aforementioned mold.

Description

This invention relates to a resin supply mechanism, a resin molding apparatus, and a method for manufacturing resin molded products. Japanese Patent Publication No. 2024-74488 (Patent Document 1) discloses a resin molding apparatus. In this resin molding apparatus, a plate is placed on a stage having through holes, and a release film is placed on the plate. As the stage descends, a weighing device supports the plate through the through holes. The weight of the resin supplied to the release film on the plate is measured by the weighing device, and the release film with the desired amount of resin is conveyed from the plate to the molding die by a conveying mechanism. Japanese Patent Publication No. 2024-74488 This is a schematic plan view of a resin molding apparatus.This is a schematic partial cross-sectional view showing a part of the first transport mechanism from the side.This is a schematic front view showing the release film placement area.This is a schematic plan view showing the release film placement area.This diagram illustrates the characteristics of the stage and plate.This figure schematically shows the VI-VI section of Figure 5.This diagram schematically shows a cross-section of the resin molded section (before mold clamping).This diagram illustrates an example of a problem that can occur if the plate is not properly positioned relative to the stage.This diagram illustrates the relationship between the stage and the plate in the state before the stage descends.This diagram illustrates the relationship between the stage and the plate after the stage has descended.This diagram illustrates the relationship between the positioning pin and the insertion hole after the stage has been lowered.This is a diagram illustrating other examples of positioning pins and insertion holes.This diagram schematically shows the positioning pins in another example. The following describes in detail, with reference to the drawings, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment"). In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions are not repeated. Furthermore, for ease of understanding, each drawing is schematic, with parts omitted or exaggerated as appropriate. [1. Configuration of the resin molding apparatus] Figure 1 is a schematic plan view showing a resin molding apparatus 1 according to this embodiment. The resin molding apparatus 1 is configured to manufacture a resin molded product by applying resin encapsulation to a substrate on which electronic components such as semiconductor chips are mounted. In the resin molding apparatus 1, the component mounting surface of the substrate on which the electronic components are mounted is resin-encapsulated. Examples of substrates include semiconductor substrates such as silicon wafers, lead frames, printed circuit boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate may also be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate may or may not have pre-installed wiring. As shown in Figure 1, the resin molding apparatus 1 includes a first module 10, a second module 20, a third module 30, a fourth module 40, a first transport mechanism 50, a second transport mechanism 60, and a control unit 70. The control unit 70 includes, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The control unit 70 is configured to control each of the first module 10, the second module 20, the third module 30, and the fourth module 40 according to a control program. Each of the first module 10, second module 20, third module 30, and fourth module 40 is detachable and interchangeable with the other modules. Furthermore, in the resin molding apparatus 1, each of the first module 10, second module 20, third module 30, and fourth module 40 can be increased or decreased in number. The first module 10 includes a release film supply unit 100. The first module 10 is configured to supply the release film. As the material for the release film, a resin material having properties such as heat resistance, release properties, flexibility, and stretchability is used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, or polyvinylidene chloride can be used. The release film supply unit 100 includes, for example, a roll of release film, a film mounting table, a film gripper, and a cutter (none of which are shown). A long piece of release film is drawn from the roll of release film by the film gripper and placed on the film mounting table. The release film placed on the film mounting table is cut into a desired shape (e.g., rectangular or circular) by the cutter, thereby