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JP-2026075230-A - Processing apparatus and exposure apparatus

JP2026075230AJP 2026075230 AJP2026075230 AJP 2026075230AJP-2026075230-A

Abstract

[Problem] To provide a processing apparatus and an exposure apparatus that enable efficient processing. [Solution] A processing apparatus according to one embodiment of this technology comprises a work stage, a holding mechanism, and a drive mechanism. The work stage has a mounting surface on which a workpiece is placed. The holding mechanism has a pin and a frame on which the pin is provided, and is movable in a first direction, and by moving in the first direction, the pin can be positioned to protrude from the mounting surface and not protrude. The drive mechanism has a contact member that abuts against the frame and a drive source that moves the holding mechanism in the first direction by moving the contact member in the first direction. The work stage and the holding mechanism are movable relative to the drive mechanism in a second direction different from the first direction. [Selection Diagram] Figure 2A

Inventors

  • 美濃部 猛

Assignees

  • ウシオ電機株式会社

Dates

Publication Date
20260508
Application Date
20241022

Claims (9)

  1. A work stage having a mounting surface on which a workpiece is placed, A holding mechanism having a pin and a frame on which the pin is provided, which is movable in a first direction, and which can move in the first direction to a state in which the pin protrudes from the aforementioned mounting surface and a state in which it does not protrude, The drive mechanism comprises a contact member that contacts the frame, and a drive source that moves the holding mechanism in the first direction by moving the contact member in the first direction. A machining apparatus in which the work stage and the holding mechanism are movable relative to the drive mechanism in a second direction different from the first direction.
  2. A processing apparatus according to claim 1, The first direction is the vertical direction, The processing apparatus is such that the second direction is the horizontal direction and the direction of rotation in the horizontal plane.
  3. A processing apparatus according to claim 1 or 2, further, The drive mechanism is provided with a base to which it is fixed, A processing apparatus comprising a work stage and a holding mechanism mounted on the base so as to be movable on the base in the second direction.
  4. The processing apparatus according to claim 3, The work stage and the holding mechanism are moved in the second direction by a linear surface motor in the processing apparatus.
  5. A processing apparatus according to claim 1 or 2, The abutting member abuts the frame only when the work stage and the holding mechanism are in a predetermined position in the second direction.
  6. A processing apparatus according to claim 1 or 2, The holding mechanism is a processing apparatus having a spacer that adjusts the inclination of the pin and the frame by being clamped in a predetermined position.
  7. A processing apparatus according to claim 1 or 2, A processing apparatus in which the contact member has an electromagnet and the frame has magnetism.
  8. A processing apparatus according to claim 1 or 2, The contact member is connected to the drive source in such a way that it detaches from the drive source when the holding mechanism collides with the contact member from the second direction.
  9. A light emitting unit that emits exposure light onto the workpiece, A work stage having a mounting surface on which the workpiece is placed, A holding mechanism having a pin and a frame on which the pin is provided, which is movable in a first direction, and which can move in the first direction to a state in which the pin protrudes from the aforementioned mounting surface and a state in which it does not protrude, The drive mechanism comprises a contact member that contacts the frame, and a drive source that moves the holding mechanism in the first direction by moving the contact member in the first direction. An exposure apparatus wherein the work stage and the holding mechanism are movable relative to the drive mechanism in a second direction different from the first direction.

Description

This technology relates to processing equipment and exposure equipment. Patent Document 1 discloses a substrate stage device in which the stage that holds the workpiece moves vertically by receiving the force of a push-down arm, thereby enabling the pins to be positioned in a protruding state and a retracted state from the stage. This device allows for simplification of the stage structure, reduction of the stage's weight, and increased speed of stage operation. Japanese Patent Publication No. 2001-168008 This is a schematic diagram showing an example of the configuration of an exposure apparatus according to one embodiment of this technology.This is a perspective view of the work stage, etc.This is a perspective view of the work stage, etc.This is a side view of a work stage, etc.This is a side view of a work stage, etc.This is a cross-sectional view of the holding mechanism.This is a top view of the frame.This is a side view of a work stage, etc.This is a flowchart related to the exposure process.This is a cross-sectional view showing an example of the configuration of the adjustment mechanism.This is a cross-sectional view showing an example of the configuration of the adjustment mechanism. The embodiments of this technology will be described below with reference to the drawings. This technology can be applied to any processing equipment, such as exposure equipment, laser irradiation equipment, and laser processing equipment. The following description will focus on the case where this technology is applied to an exposure equipment. [Exposure equipment] Figure 1 is a schematic diagram showing an example of the configuration of an exposure apparatus 1 according to one embodiment of this technology. The XYZ coordinates are defined below as shown in the figure. In this example, the Z direction is the vertical direction (direction of gravity), and the X and Y directions are the horizontal directions perpendicular to the vertical direction. In the following explanation, the X direction may be described as the left-right direction (positive side is the right side, negative side is the left side), the Y direction as the depth direction (positive side is the back side, negative side is the front side), and the Z direction as the up-down direction (positive side is the top side, negative side is the bottom side). Of course, the specific orientation in which the exposure device 1 is used is not limited. The vertical direction (Z direction) corresponds to one embodiment of the first direction according to this technology. The horizontal direction (X direction and Y direction) and the rotational direction within the horizontal plane correspond to one embodiment of a second direction different from the first direction related to this technology. The exposure apparatus 1 comprises a light emission unit 2, a mask M, a mask stage 3, a projection lens 4, a workpiece stage 5, a holding mechanism 6, a drive mechanism 7, and a platen 8. The light emission unit 2 includes a lamp 9, a mirror 10, and a lamp housing 11. The lamp 9 is a light source that emits light in all directions. The mirror 10 is capable of reflecting light and is positioned to surround the vertically above the lamp 9. The lamp housing 11 is a casing that houses the lamp 9 and the mirror 10. The mask M has a pattern, such as a circuit pattern, formed on it, which will be transferred to the workpiece W. The mask M corresponds to one embodiment of the exposure mask according to this technology. The mask stage 3 holds the mask M below the light emission unit 2. The projection lens 4 is configured as a reduction optical system that reduces the pattern on the mask M and forms an image on the surface of the workpiece W, and is positioned below the mask M. Figure 1 schematically shows the work stage 5, holding mechanism 6, drive mechanism 7, and platen 8. Detailed configurations of these components will be explained later; only an overview is provided here. The work stage 5 is the mechanism on which the workpiece W is placed. The mounting surface on which the workpiece W is placed has multiple holes, and the pressure inside the work stage 5 is adjusted by a vacuum pump and air introduction unit (not shown), enabling vacuum adsorption of the workpiece W to the mounting surface. While a printed circuit board is placed on the workpiece W, it can be any object to be exposed. For example, a photoresist that is sensitive to exposure light is coated on the workpiece W. The holding mechanism 6 is a mechanism for holding the workpiece W. The workpiece stage 5 and the holding mechanism 6 are mounted on the platen 8 and can move horizontally (X and Y directions) and in a rotational direction (θ direction) within the horizontal plane on the platen 8. The drive mechanism 7 is a mechanism for moving the holding mechanism 6 vertically and is fixed to the platen 8 so as to be immovable. In this embodiment, a workpiece W is placed on the work stage 5, and light is emitted from the