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JP-2026075241-A - Pickup preparation method, pickup method, bonding method, and apparatus

JP2026075241AJP 2026075241 AJP2026075241 AJP 2026075241AJP-2026075241-A

Abstract

[Problem] We propose a novel technology for picking up chips from a workpiece in which multiple chips are fixed to a tape. [Solution] A pickup preparation method comprising: a preparation step of preparing a workpiece in which multiple chips are fixed to a tape; a holding step of holding the multiple chips of the workpiece with a holding table; a peeling step of peeling the tape of the workpiece held on the holding table from the multiple chips so that the multiple chips are held on the holding table; and a transfer step of transferring the multiple chips held on the holding table from the holding table to a stage so that the chips on the stage are ready for pickup. [Selection Diagram] Figure 1

Inventors

  • 中村 玲雄

Assignees

  • 株式会社ディスコ

Dates

Publication Date
20260508
Application Date
20241022

Claims (8)

  1. Preparation steps include preparing a workpiece in which multiple chips are fixed to a tape, A holding step of holding the multiple chips of the workpiece in a holding table, A peeling step involves peeling the tape from the workpiece held by the holding table from the plurality of chips, so that the plurality of chips remain held by the holding table. A transfer step involves transferring the multiple chips held in the holding table from the holding table to a stage, and making the chips on the stage ready for pickup. A method for preparing a pickup.
  2. The holding table is an electrostatic chuck table. The pickup preparation method according to feature 1.
  3. A pickup step of picking up the chip that has been passed onto the stage by the pickup preparation method according to claim 1 or claim 2, A pickup method.
  4. A bonding method comprising a bonding step of mounting the chip picked up by the pickup method described in claim 3.
  5. A holding table for a workpiece in which multiple chips are fixed to a tape, A peeling mechanism for peeling the tape of the workpiece held by the holding table from the multiple chips, A stage in which the multiple chips from which the tape has been peeled off by the peeling mechanism are transferred from the holding table and the chips are made ready for pickup, A device equipped with the following features.
  6. The holding table is an electrostatic chuck table. The apparatus according to feature 5.
  7. A pickup mechanism for picking up chips on the stage is provided, The apparatus according to claim 5 or 6, characterized by the features described herein.
  8. The pickup mechanism picks up the chips and transports them to the mounting location, where bonding is performed. The apparatus according to feature 7.

Description

This invention relates to a method for preparing chips for pickup, a pickup method, a bonding method, and an apparatus for picking up chips. Conventionally, as disclosed in, for example, Patent Document 1, methods for picking up chips from divided wafers using die bonders, pickup devices, etc., are known. In this type of pickup method, a push-up pin that moves up and down along the Z-axis pushes up the underside of the tape to detach the chip, and the detached top surface of the chip is then held in place by a collet for pickup. Furthermore, Patent Document 2 describes picking up the chips one by one with a collet and then die-bonding them to the electrode frame. Japanese Patent Publication No. 2011-077098Japanese Patent Publication No. 2004-186430 A diagram illustrating an example of the configuration of a pickup device.A diagram illustrating an example of a workpiece.A diagram illustrating the transfer of a workpiece to a holding table.A flowchart illustrating the steps involved in the pickup method.A diagram illustrating the peeling step.This diagram shows the state in which the chip is held on the holding table after the peeling step.A diagram illustrating an example of the handover steps.A diagram illustrating another example of the handover step.A diagram illustrating another example of the handover step.A diagram explaining the pick-up step. Embodiments of the present invention will be described below with reference to the drawings. Figure 1 shows an example of a pickup device 2 according to one embodiment of the present invention. The pickup device 2 comprises a holding table 10, a peeling mechanism 20, a stage 30, a pickup mechanism 40, and a control unit 4 for controlling each of the moving parts. The holding table 10 holds a workpiece U in which multiple chips C are fixed to a tape T. As shown in Figure 2, the workpiece U is an integrated unit formed by attaching a disc-shaped wafer W and an annular frame F to the tape T; it is also referred to as a frame unit. For example, the back side of the wafer W is attached to the surface of the tape T, while the front side of the wafer W (e.g., the device formation surface) is exposed. The wafer W has been pre-divided into multiple chips C, C by a dicing process, and each chip C, C is attached to tape T. The dicing process for dividing the wafer into chips C may be blade dicing, which uses a cutting blade, or laser dicing, which uses a laser irradiation; it is not particularly limited to these methods. As shown in Figure 3, the holding table 10 has a holding surface 12 that holds the area of the chip C attached to the tape T of the workpiece U, and a plurality of clamping mechanisms 14 that clamp the frame F of the workpiece U. The workpiece U is transported to the holding table 10 by a transport mechanism (not shown) such that the chip C is on the bottom and the tape T is on the top. The holding table 10 is configured, for example, as an electrostatic chuck table with multiple electrodes embedded inside, and is configured to apply a Coulomb force between the holding surface 12 and the chip C, thereby attracting the chip C to the holding surface 12. In this embodiment, the clamping mechanism 14 is provided in four locations and clamps the outer peripheral area of the frame F where the tape T is not applied. However, since the frame F is also held by the holding surface 12, the clamping mechanism 14 may be omitted. As shown in Figure 1, the peeling mechanism 20 is positioned above the holding table 10 and is for peeling the tape T of the workpiece U held by the holding table 10 from multiple chips C, C. The release mechanism 20 comprises a release tape supply mechanism 24, a clamping unit 38 that clamps the release tape 26 fed from the release tape supply mechanism 24, a heat-pressing unit 62 that heat-presses the release tape 26 onto the tape T, and a cutter 70 that cuts the release tape 26. The release tape 26 is made of a resin film such as polyethylene terephthalate, and its adhesive properties are developed upon heating. The width of the release tape 26 is, for example, 50 mm. As shown in Figure 1, the stage 30 is for transferring multiple chips C, C from the holding table 10 after the tape T has been peeled off by the peeling mechanism 20. The stage 30 is composed of, for example, a disc-shaped member that forms a mounting surface 32 on its upper surface for placing the chips C, C. As shown in Figure 1, the pickup mechanism 40 comprises a collet 42 for picking up chips C one by one from the stage 30, and a moving mechanism (not shown) for moving the collet 42. The collet 42 is designed to pick up and transport chips C by suction and holding them using negative pressure at its lower end. The pickup mechanism 40 functions as a so-called die bonder, for example, transporting the picked-up chips C to the lead frame 9 to perform the mounting process. The pickup mechanism 40 can also function as a transport device for transporting chips C to other location