JP-2026075301-A - Temperature sensor
Abstract
[Problem] To provide a temperature sensor that has high thermal responsiveness, mechanical strength, mechanical durability, and dielectric strength, and can be made low-profile. [Solution] The device comprises a strip-shaped flexible substrate 2 on which a heat-sensitive element is installed on the upper surface of the tip portion 2a, a metal case 4 that covers at least the upper and lower surfaces of the tip portion together with the heat-sensitive element, an upper insulating portion 5 made of insulating resin that is filled on the upper side of the tip portion within the metal case and seals the heat-sensitive element, and a lower insulating portion 6 made of insulating resin that is provided on the lower side of the tip portion within the metal case, wherein the metal case is formed in a flattened shape with its upper surface 4a and lower surface 4b being parallel to the tip portion and being flat surfaces. [Selection Diagram] Figure 1
Inventors
- 飯田 詩織
- 杉山 達雄
- 本多 洋樹
Assignees
- 三菱マテリアル株式会社
Dates
- Publication Date
- 20260508
- Application Date
- 20241022
Claims (3)
- A strip-shaped flexible substrate with a heat-sensitive element installed on the upper surface of the tip, A metal case that covers at least the upper and lower surfaces of the tip portion together with the thermal sensing element, An upper insulating portion made of insulating resin is filled into the upper surface of the tip portion within the metal case and seals the heat-sensitive element, The metal case comprises a lower insulating portion made of insulating resin, which is provided on the lower side of the tip portion, A temperature sensor characterized in that the metal case is formed in a flattened shape with its upper and lower surfaces being parallel to the tip and flat.
- In the temperature sensor according to claim 1, A temperature sensor characterized in that the lower insulating portion is a sheet-like resin that is in close contact with the lower surface of the tip portion and the lower surface of the metal case.
- In the temperature sensor according to claim 1 or 2, A pair of lead wires connected to the base end of the flexible substrate extending outward from the metal case, The system includes an insulating heat-shrinkable tube that covers the connection portion between the base end and the pair of lead wires, A temperature sensor characterized in that the heat-shrinkable tube is formed in a flattened shape.
Description
This invention relates to a temperature sensor with excellent thermal responsiveness. Conventionally, temperature sensors are known that have a heat-sensitive element such as a thermistor mounted on a flexible printed circuit board (FPC). For example, Patent Document 1 describes a temperature sensor comprising a flexible substrate which is an insulating film on which patterned wiring is provided, a heat-sensitive element provided on the flexible substrate, a metal case which is a crimp terminal to which the flexible substrate is bonded together with the heat-sensitive element, and a sealing resin which seals the heat-sensitive element on the flexible substrate. Japanese Patent Publication No. 2021-156864 This is a perspective view showing one embodiment of the temperature sensor according to the present invention.This embodiment is a perspective view of the temperature sensor showing its internal structure.This embodiment is a plan view of a temperature sensor showing its internal structure through a transparent lens.This embodiment is an enlarged view taken from the tip side showing the temperature sensor. An embodiment of the temperature sensor according to the present invention will be described below with reference to Figures 1 to 4. As shown in Figures 1 to 4, the temperature sensor 1 of this embodiment comprises a strip-shaped flexible printed circuit board (FPC) 2 on which a heat-sensitive element 3 is installed on the upper surface of the tip portion 2a, a metal case 4 that covers at least the upper and lower surfaces of the tip portion 2a together with the heat-sensitive element 3, an upper insulating portion 5 made of insulating resin that is filled on the upper side of the tip portion 2a within the metal case 4 and seals the heat-sensitive element 3, and a lower insulating portion 6 made of insulating resin that is provided on the lower side of the tip portion 2a within the metal case 4. The metal case 4 described above is formed in a flattened shape, with its upper surface 4a and lower surface 4b being parallel to the tip portion 2a and having flat surfaces. The lower insulating portion 6 described above is a sheet-like resin that is in close contact with the lower surface of the tip portion 2a and the lower surface of the metal case 4. Furthermore, the temperature sensor 1 of this embodiment includes a pair of lead wires 7 connected to the base end 2b of a flexible substrate 2 that extends outward from a metal case 4, and an insulating heat-shrinkable tube 8 that covers the connection portion 7a between the base end 2b and the pair of lead wires 7. The heat shrinkable tube 8 described above is formed in a flattened shape. Preferably, the heat shrinkable tube 8 has an insulating sealing resin in the inner layer of the tube so that insulation can be ensured even when the area around the connection portion 7a is exposed to a high humidity environment. The above-mentioned heat-sensitive element 3 is, for example, a chip thermistor and is sealed with a sealing resin 3a made of epoxy resin or the like. Furthermore, a flake-type thermistor or a thin-film thermistor may be used as the heat-sensitive element 3. The flexible substrate 2 described above has a pattern of copper foil or the like (not shown) formed on an insulating film such as epoxy resin. The tip of the pattern wiring is connected to the thermal element 3, and the base end is connected to the lead wire 7. The above-mentioned metal case 4 is formed of a metal such as Al, Cu, or SUS. The upper insulating portion 5 described above is made of a resin such as epoxy, polyimide, or silicone, and is formed by injecting and filling it in liquid form into the space between the upper surface of the flexible substrate 2 and the metal case 4, and then embedding it together with the heat-sensitive element 3 while covering it with a sealing resin 3a, and then allowing it to harden. The lower insulating portion 6 is formed of a sheet-like (plate-like) resin such as polyimide, epoxy, or silicone. When manufacturing the temperature sensor 1 of this embodiment, for example, the metal case 4 is pre-processed into a flattened shape, and then the lower insulating part 6 and the tip 2a of the flexible substrate 2 are inserted and bonded into the metal case 4, while the resin of the upper insulating part 5 is filled into the metal case 4. The above-mentioned metal case 4 is manufactured, for example, by bending a strip of metal sheet into a ring shape to create a flat shape with a thickness of 2 mm. Alternatively, before processing the metal case 4 into a flattened shape, the lower insulating portion 6 and the tip portion 2a of the flexible substrate 2 may be inserted and bonded into the annularly shaped metal case 4, and the resin of the upper insulating portion 5 may be applied to the tip portion 2a of the flexible substrate 2. The temperature sensor 1 may then be manufactured by processing the metal case 4 into a flattened shape before the resin hardens. The p