JP-2026075399-A - Imaging device

Abstract

[Problem] To provide an imaging device that can sufficiently dissipate the heat generated by the image sensor. [Solution] The imaging device comprises a lens that transmits light, a lens barrel that holds the lens, a substrate having a front surface and a back surface and having thermal vias extending from the front surface to the back surface, an image sensor that receives the light, is fixed to the front surface, is placed on the thermal vias, and has a side opposite to the side on which the substrate is placed, a heat sink placed on the back surface and in contact with the thermal vias, a dam structure placed on the opposite side, a holder that holds the lens barrel, is placed on the front surface and has a space formed therein for housing the image sensor and the dam structure, and a filler that fills the space and in contact with the image sensor and the holder. [Selection Diagram] Figure 1

Inventors

• 土田 卓洋
• 久戸瀬 智
• 杵渕 太一郎

Assignees

• シャープセンシングテクノロジー株式会社

Dates

Publication Date

20260508

Application Date

20241022

Claims (13)

1. A lens that transmits light, A lens barrel that holds the aforementioned lens, A substrate having a front surface and a back surface, and comprising thermal vias extending from the front surface to the back surface, An image sensor that receives the aforementioned light, is fixed to the surface, is placed on the thermal via, and has an opposite side that is on the side opposite to the side on which the substrate is placed, A heat sink is placed on the back surface and in contact with the thermal via, A dam structure positioned on the opposite side, A holder that holds the lens barrel, is positioned on the surface, and has a space formed therein for housing the image sensor and the dam structure, A filler material that fills the space and contacts the image sensor and the holder, An imaging device equipped with the following features.
2. The opposite side has an inner region located inside the dam structure and an outer region located outside the dam structure. The inner region includes a light-receiving region that receives the light, The imaging apparatus according to claim 1, wherein the filler is in contact with the outer region.
3. The thermal via is a first thermal via, The substrate is provided with a second thermal via extending from the front surface to the back surface, The heat sink contacts the second thermal via, The imaging apparatus according to claim 1 or 2, wherein the packing material is in contact with the second thermal via.
4. The substrate is equipped with a first electrode, The image sensor is equipped with a second electrode, The first electrode and the second electrode are electrically connected to each other by a wire, The aforementioned space accommodates the wire, The imaging apparatus according to claim 1 or 2, wherein the filler is in contact with the wire.
5. The second electrode is covered by the dam structure. The imaging device according to claim 4, wherein the entire wire is embedded in the dam structure and the filler.
6. The imaging apparatus according to claim 4, wherein the second electrode is covered by the filler and the entire wire is embedded in the filler.
7. The optical member that transmits the aforementioned light is provided, The dam structure supports the optical member, The imaging apparatus according to claim 1 or 2, wherein the filler is separated from the optical member.
8. The imaging apparatus according to claim 1 or 2, wherein the filler is separated from the lens.
9. The imaging apparatus according to claim 1 or 2, wherein the filling material has a thermal conductivity higher than that of the dam structure.
10. The imaging apparatus according to claim 1 or 2, wherein the holder is made of metal.
11. The substrate is equipped with a first electrode, The image sensor is equipped with a second electrode, The first electrode and the second electrode are electrically connected to each other by a wire, The dam structure includes a portion that is placed on the second electrode, The imaging device according to claim 1 or 2, wherein the dam structure is a hardened product of a fluid dam agent.
12. The substrate is equipped with a first electrode, The image sensor is equipped with a second electrode, The first electrode and the second electrode are electrically connected to each other by a wire, The second electrode is positioned outside the dam structure. The imaging device according to claim 1 or 2, wherein the dam structure is a molded product of resin or metal.
13. The imaging apparatus according to claim 1 or 2, wherein the filler is a cured product of a fluid filler.

Description

This disclosure relates to an imaging device. Patent Document 1 discloses an image sensor package. In this image sensor package, an image sensor chip is mounted on a substrate. Bonding terminals are patterned on the substrate. The image sensor chip is electrically connected to the bonding terminals by wires. A support is bonded to the periphery of the substrate by an adhesive portion. The adhesive portion seals the wires and bonding terminals. The support supports an optical component. (Paragraphs 0013, 0015, 0016, and 0019). Patent No. 5541088 This is a schematic cross-sectional view illustrating the imaging device of the first embodiment.This is a schematic top view illustrating the substrate, image sensor, adhesive layer, multiple wires, and dam structure provided in the imaging device of the first embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the first embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the first embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the first embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the first embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the first embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the first embodiment.This is a schematic cross-sectional view illustrating the imaging device of the second embodiment.This is a schematic top view illustrating the substrate, image sensor, adhesive layer, multiple wires, and dam structure provided in the imaging device of the second embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the second embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the second embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the second embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the second embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the second embodiment.This is a schematic cross-sectional view illustrating the imaging device of the third embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the third embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the third embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the third embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the third embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the third embodiment.This is a schematic cross-sectional view illustrating the imaging device of the fourth embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the fourth embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the fourth embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the fourth embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during the manufacturing process of the imaging device according to the fourth embodiment.This is a schematic cross-sectional view illustrating an intermediate product manufactured during