JP-2026075416-A - Light-emitting device and method for manufacturing a light-emitting device

Abstract

[Problem] To provide a light-emitting device in which a light-emitting element is hermetically sealed by a lid member, which prevents cracking of the light-transmitting member that serves as the lid member and allows for high-yield manufacturing. [Solution] A package body on which light-emitting elements are mounted in a predetermined mounting area is covered with a lid member that transmits light emitted by the light-emitting elements. The package body and the lid member are joined using a bonding layer arranged to surround the mounting area. Before or after this bonding process, the portion of the lid member directly above the bonding layer is cut to make the thickness of the portion directly above the bonding layer thinner than the thickness of the portion above the mounting area. [Selected Figure] Figure 1

Inventors

• 斎藤 千寿
• 荒谷 方生
• 柳澤 崚

Assignees

• スタンレー電気株式会社

Dates

Publication Date

20260508

Application Date

20241022

Claims (12)

1. The package comprises a package body, a light-emitting element mounted in a predetermined mounting area on the upper surface of the package body, a lid member covering the area on the package body on which the light-emitting element is mounted and transmitting light emitted by the light-emitting element, and a bonding layer joining the upper surface of the package body and the lower surface of the lid member around the mounting area of the package body, and hermetically sealing the space around the light-emitting element. The bonding layer is made of metal and is arranged to surround the mounting area with a predetermined width. The light-emitting device is characterized in that the thickness of the portion directly above the bonding layer is thinner than the thickness of the portion above the mounting area of the lid member.
2. A light-emitting device according to claim 1, The aforementioned lid member is a plate-shaped member, The light-emitting device is characterized in that the upper surface of the lid member has a groove or step provided at least on the upper surface of the upper part of the bonding layer, and the thickness of the portion directly above the bonding layer is reduced to the thickness of the portion above the mounting area.
3. A light-emitting device according to claim 2, The groove or step on the upper surface of the lid member is arranged to surround the mounting area. A light-emitting device characterized in that the inner circumference of the groove or step is located closer to the center of the lid member than the inner circumference of the bonding layer.
4. A light-emitting device according to claim 3, A light-emitting device characterized in that the outer circumference of the groove or step on the upper surface of the lid member is located closer to the periphery of the lid member than the outer circumference of the bonding layer.
5. A light-emitting device according to claim 1, A recess is provided on the upper surface of the package body. The light-emitting device is characterized in that the mounting area on which the light-emitting element is mounted is the bottom surface of the recess, and the bonding layer is arranged on the upper surface of the package body at the edge of the recess.
6. A light-emitting device according to claim 1, The light-emitting device is characterized in that the lid member is made of a material having a smaller coefficient of thermal expansion than the bonding layer.
7. A light-emitting device according to claim 5, The bonding layer includes an AuSn-containing layer, The light-emitting device is characterized in that the lid member is made of glass or quartz glass.
8. A light-emitting device according to claim 2, The light-emitting device is characterized in that the surface of the portion of the lid member in which the groove or step is provided has irregularities smaller than the width of the groove or step.
9. A light-emitting device according to claim 8, The light-emitting device is characterized in that the irregularities have a longitudinal direction along the longitudinal direction of the groove or step.
10. A light-emitting device according to claim 2, The light-emitting device is characterized in that the groove or step of the cover member has a curved corner.
11. A light-emitting device according to claim 1, The light-emitting element is characterized in that it is an element that emits deep ultraviolet light.
12. A method for manufacturing a light-emitting device, comprising the steps of covering a package body on which light-emitting elements are mounted in a predetermined mounting area with a lid member that transmits light emitted by the light-emitting elements, and joining the package body and the element using a bonding layer arranged to surround the mounting area, A method for manufacturing a light-emitting device, characterized by having a step, either before or after the joining step, of cutting the portion of the lid member directly above the joining layer, so that the thickness of the portion directly above the joining layer is thinner than the thickness of the portion above the mounting area.

Description

This invention relates to a light-emitting device in which the light-emitting device is hermetically sealed. To hermetically seal light-emitting elements and other electronic components, packages are known in which these are mounted on a substrate, covered with a lid, and the substrate and lid are hermetically sealed with a metal bonding layer or the like. For example, Patent Document 1 discloses a small package in which electronic components such as optical elements are mounted on a mounting area of a wiring board and hermetically sealed with a lid. A metal frame is arranged on the wiring board to surround the mounting area, and a frame-shaped metal film is arranged on the lid. The metal frame and metal film are joined by a metal bonding material, thereby hermetically sealing the electronic components. On the other hand, Patent Document 2 discloses a method in which the light extraction efficiency is improved by forming a fine uneven structure with a period corresponding to the wavelength of light emitted by the light-emitting element on the surface of a translucent substrate covering the package of the light-emitting element. Japanese Patent Publication No. 2022-186944Japanese Patent Publication No. 2009-177099 (a) is a cross-sectional view of the light-emitting device 1 according to Embodiment 1 of the present invention, (b) is a top view of the package body 20 of the light-emitting device 1, and (c) is a top view of the lid member 30 of the light-emitting device 1.This is a cross-sectional view of the bonding layer 40 of the light-emitting device 1 of Embodiment 1.(a) is a graph showing the relationship between the thickness of the quartz glass and the stress, and (b) is a table showing the relationship between the thickness of the quartz glass and the stress.(a) is a top view and cross-sectional view showing the location of stress concentration when the lid member is uniform, and (b) is a top view and cross-sectional view showing the location of stress concentration in the light-emitting device 1 of the lid member 30 having a step 33 in Embodiment 1.This is a flowchart showing the manufacturing process of the light-emitting device 1 of Embodiment 1.(a) is a cross-sectional view of the light-emitting device 1 of Embodiment 2, and (b) and (c) are cross-sectional views of a modified lid member 30.(a) is a top view of the lid member 30 of the light-emitting device 1 of Embodiment 2, and (b) is an explanatory diagram showing the reflection of light in the groove 53 in the light-emitting device 1 of Embodiment 2.This table shows the crack occurrence rate of the light-emitting device 1 manufactured in the example and the lid member 30 of the light-emitting device in the comparative example. An embodiment of the present invention will be described below with reference to the drawings. The scope of this invention is not limited to the embodiments described herein, and various modifications can be made without departing from the spirit of the invention. <<Embodiment 1>> Figure 1(a) is a cross-sectional view of the light-emitting device 1 according to Embodiment 1 of the present invention, Figure 1(b) is a top view of the package body 20, and Figure 1(c) is a top view of the package body of the light-emitting device 1. Figure 2 is a cross-sectional view of the bonding layer 40 of the light-emitting device 1 according to Embodiment 1. As shown in Figures 1(a) to 1(c), the light-emitting device 1 of the present invention comprises a package body 20, a light-emitting element 10 mounted on a predetermined mounting area 21 on the upper surface of the package body 20, a lid member 30, and a bonding layer 40. <Light-emitting element 10> The light-emitting element 10 is a deep ultraviolet light-emitting element (DUV-LED) that emits light in the deep ultraviolet wavelength region of 210 nm to 310 nm. The light-emitting element 1 is a semiconductor light-emitting element having a known structure (for example, a structure in which a light-emitting layer that emits deep ultraviolet light, electrodes, etc. are stacked on a ceramic substrate such as aluminum nitride (AlN) or sapphire, using an AlN layer as a template layer). The light-emitting layer of the light-emitting element 1 is composed of, for example, an AlGaN-based material. The light-emitting element 10 shown in Figure 1(a) is equipped with a pair of element electrodes (not shown) on its lower surface. <Package body 20> In this embodiment, the package body 20 is made of Si and its surface is covered with a thermal oxide film 24. However, the material of the package body 20 is not limited to Si and may be made of other materials. For example, the package body 20 can be made of any of LTCC (Low Temperature Co-fired Ceramics), Al₂O₃ , and AlN, or a composite material of two or more of these. The package body 20 has a recess 25 for positioning the light-emitting element 10. A mounting area 21 for the light-emitting element 10 is provided on the bottom surface of the rece