JP-2026075598-A - Heat treatment apparatus having curved substrate-facing surfaces

Abstract

[Problem] To provide a heat treatment chamber that can be used in combination with semiconductor processing tools such as imprint lithography tools and inkjet-based adaptive planarization tools. [Solution] The heat treatment chamber 10 comprises a heat source 42, a curved structure (inner curved structure 80A and outer curved structure 80B) having a curved support surface and a flat bottom surface, with the flat bottom surface facing the surface of the heat source, and a retaining plate 90 including a first surface placed on the surface of the heat source, a second surface opposite to the first surface, and a retaining feature, wherein the curved structure is positioned within the retaining feature, at least a portion of the curved support surface extends above the second surface of the retaining plate, and the retaining feature has a surface that restricts the movement of the curved structure away from the heat source. [Selection Diagram] Figure 3

Inventors

• セス ジェイ バーメスバーガー
• ビュン－ジン チョイ

Assignees

• キヤノン株式会社

Dates

Publication Date

20260508

Application Date

20250917

Priority Date

20241022

Claims (20)

1. Heat source and A curved structure having a curved support surface and a flat bottom surface, wherein the flat bottom surface faces the surface of the heat source, The heat source comprises a first surface placed on the surface, a second surface opposite to the first surface, and a retaining plate including a retaining feature, The curved structure is positioned within the retaining feature, and at least a portion of the curved support surface extends above the second surface of the retaining plate. The support system is characterized in that the retaining feature has a surface that restricts the movement of the curved structure in a direction away from the heat source.
2. The retaining feature is a through-hole that penetrates the retaining plate, which is either a countersunk through-hole or a recessed through-hole. The support system according to claim 1, characterized in that the curved support surface passes through the smaller end of the through hole.
3. The support system according to claim 1, characterized in that the support system includes a plurality of retaining features corresponding to a plurality of curved structures in the retaining plate.
4. The retaining plate further comprises a plurality of outwardly curved structures arranged around its periphery, The support system according to claim 1, characterized in that the height of each of the plurality of outer curved structures is greater than the height of the curved structure.
5. The support system according to claim 1, characterized in that the curved support surface has a surface roughness of 0.3 Ra or less.
6. The support system according to claim 1, characterized in that the curved support surface has a convex shape.
7. The support system according to claim 1, characterized in that the curved structure can move within the constraints imposed by the holding feature.
8. The support system according to claim 1, characterized in that the surface of the retaining feature that restricts the movement of the curved structure away from the heat source is curved or chamfered.
9. A heat source having a flat surface, A first curved structure, wherein the first curved structure has a curved surface and a flat bottom surface, and the flat bottom surface is in close proximity to the heat source, The heat source comprises a first surface placed on the flat surface, a second surface opposite to the first surface, and a retaining plate including a first retaining feature, The distance between the flat surface of the heat source and the portion of the curved surface furthest from the flat surface of the heat source is greater than the distance between the second surface of the holding plate and the flat surface of the heat source. The support system is characterized in that the first holding feature has a curved or chamfered surface that restricts the movement of the first curved structure away from the flat surface of the heat source.
10. The support system according to claim 9, characterized in that none of the portions of the retaining plate are positioned between the flat surface of the heat source and the first curved structure.
11. The first retaining feature is a through hole that penetrates the retaining plate, The support system according to claim 9, characterized in that the width of the through hole in the vicinity of the first surface is greater than the width of the through hole in the vicinity of the second surface.
12. Further comprising a second curved structure, The second curved structure has a curved surface and a flat bottom surface, the flat bottom surface facing the flat surface of the heat source, The retaining plate further includes a second retaining feature, The second curved structure is positioned within the second retaining feature, The distance between the second retaining feature and the nearest outer edge of the retaining plate is greater than the distance between the first retaining feature and the nearest outer edge of the retaining plate. The distance between the flat surface of the heat source and the portion of the curved surface of the second curved structure that is furthest from the flat surface of the heat source is smaller than the distance between the flat surface of the heat source and the portion of the curved surface of the first curved structure that is furthest from the flat surface of the heat source. The support system according to claim 9, characterized in that the second retaining feature has a surface that restricts the movement of the second curved structure away from the flat surface of the heat source.
13. The support system according to claim 9, characterized in that the curved surface has a convex shape.
14. The support system according to claim 13, characterized in that the convex shape is a dome.
15. The support system according to claim 9, characterized in that the first curved structure can move relative to the flat surface of the heat source within the constraints imposed by the first retaining feature.
16. The support system according to claim 9, characterized in that, within the constraints imposed by the first retaining feature, when the first curved structure is at its maximum distance from the flat surface of the heat source, (i) the portion of the curved surface located in a region where the width of the first curved structure is smaller than the maximum width of the first curved structure and (ii) the contact between the curved surface or chamfered surface of the first retaining feature prevents the first curved structure from moving further away from the flat surface of the heat source.
17. A heat source having a flat surface, A curved structure having a curved surface and a flat bottom surface, wherein the flat bottom surface is close to the flat surface of the heat source, The heat source comprises a first surface placed on the flat surface, a second surface opposite to the first surface, and a retaining plate including a first retaining feature, A support system characterized in that the distance between the flat surface of the heat source and the portion of the curved surface furthest from the flat surface of the heat source is greater than the distance between the second surface of the holding plate and the flat surface of the heat source.
18. The first retaining feature restricts the movement of the curved structure away from the flat surface of the heat source, The support system according to claim 17, characterized in that the contact between the flat bottom surface and the flat surface of the heat source prevents the curved structure from rotating about any axis parallel to the flat surface of the heat source.
19. The process includes supporting a substrate on a support system, The support system is Heat source and A curved structure having a curved support surface and a flat bottom surface, wherein the flat bottom surface faces the surface of the heat source, The heat source comprises a first surface placed on the surface, a second surface opposite to the first surface, and a retaining plate including a retaining feature, The curved structure is positioned within the retaining feature, and at least a portion of the curved support surface extends above the second surface of the retaining plate. The method is characterized in that the retaining feature has a surface that restricts the movement of the curved structure in a direction away from the heat source.
20. A step of performing a plurality of pretreatment steps on the substrate so as to add one or more films to the substrate before supporting the substrate, A step of removing the substrate from the support system, A process of manufacturing multiple articles by further processing the aforementioned substrate, The method according to 19, further comprising:

Description

This application generally relates to a heat treatment chamber that can be used in combination with semiconductor processing tools such as imprint lithography tools and inkjet-based adaptive planarization tools. Many processes performed in semiconductor processing expose semiconductor wafers or other such substrates to very high temperatures (e.g., high-temperature processing, high-temperature processes). Heating to high temperatures is used in various processes to induce physical reactions (e.g., chemical reactions) to improve the physical, optical, electrical, or chemical properties of the wafer, for example, to enhance the performance or quality of the resulting integrated circuit or semiconductor device. High-temperature processing may be required after or during processes such as patterning, plasma etching, coating, cleaning, and ion implantation. In a typical processing procedure, wafers are transferred by a robotic wafer handler from a room-temperature storage device to a processing or reaction chamber, where they are exposed to high-temperature processing, and then transferred by the wafer handler from the high-temperature chamber to a cooling chamber, or returned to the same storage device, or transferred to a separate storage device for the processed wafers. The cooling chamber cools the wafer to a specific temperature. The support system of several embodiments comprises a heat source, a curved structure having a curved support surface and a flat bottom surface, the flat bottom surface facing the surface of the heat source, and a retaining plate including a first surface resting on the surface of the heat source, a second surface opposite to the first surface, and a retaining feature. The curved structure is positioned within the retaining feature, and at least a portion of the curved support surface extends above the second surface of the retaining plate. The retaining feature also has a surface that restricts the movement of the curved structure away from the heat source. The support system of several embodiments comprises a heat source having a flat surface, a first curved structure having a curved surface and a flat bottom surface, the flat bottom surface being close to the heat source, and a retaining plate including a first surface placed on the flat surface of the heat source, a second surface opposite to the first surface, and a first retaining feature. The distance between the flat surface of the heat source and the portion of the curved surface furthest from the flat surface of the heat source is greater than the distance between the second surface of the retaining plate and the flat surface of the heat source. Furthermore, the first retaining feature has a curved or chamfered surface that restricts the movement of the first curved structure away from the flat surface of the heat source. The support system of several embodiments comprises a heat source having a flat surface; a curved structure having a curved surface and a flat bottom surface, the flat bottom surface being close to the flat surface of the heat source; and a retaining plate including a first surface placed on the flat surface of the heat source, a second surface opposite to the first surface, and a first retaining feature. The distance between the flat surface of the heat source and the portion of the curved surface furthest from the flat surface of the heat source is greater than the distance between the second surface of the retaining plate and the flat surface of the heat source. Some embodiments of the method include supporting a substrate on a support system. The support system comprises a heat source; a curved structure having a curved support surface and a flat bottom surface, the flat bottom surface facing the surface of the heat source; and a retaining plate having a first surface resting on the surface of the heat source, a second surface opposite to the first surface, and a retaining feature, wherein the curved structure is positioned within the retaining feature, at least a portion of the curved support surface extends above the second surface of the retaining plate, and the retaining feature has a surface that restricts the movement of the curved structure away from the heat source. Figure 1A is a schematic diagram of an exemplary embodiment of a substrate processing system. Figure 1B shows an exemplary embodiment of a heat treatment chamber in the open position. Figure 2 shows an exemplary embodiment of the upper member. Figure 3 shows cross-sectional views of the upper and lower members when the heat treatment chamber is in the open position. Figure 4 shows cross-sectional views of the upper and lower members when the heat treatment chamber is in the closed position. Figure 5 shows an exploded cross-sectional view of the heat source, the retaining plate, and the multiple curved structures. Figure 6A shows an exemplary embodiment of the inwardly curved structure. Figure 6B shows an exemplary embodiment of th