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JP-2026075610-A - Method for pre-adjusting the processing surface of a glass substrate for semiconductor packaging.

JP2026075610AJP 2026075610 AJP2026075610 AJP 2026075610AJP-2026075610-A

Abstract

[Problem] To provide a method for pre-adjusting the processed surface of a glass substrate for semiconductor packaging to improve manufacturing efficiency. [Solution] A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package includes the steps of: selecting one material group from among material groups; collecting processing information; confirming whether the transfer equipment attached to the processing equipment that performs the processing is equipped with a flipper; and pre-adjusting the glass substrate by rotating it using other processing equipment equipped with a flipper. [Selection Diagram] Figure 1

Inventors

  • ユン、サンミン
  • キム、ヨンジュン

Assignees

  • アブソリックス インコーポレイテッド

Dates

Publication Date
20260508
Application Date
20251016
Priority Date
20241022

Claims (7)

  1. This is for pre-adjusting the processed surface of a glass substrate for manufacturing a glass substrate semiconductor package so that it corresponds to the processed surface during the manufacturing process. A step of selecting one material group from among material groups in which multiple glass substrates, each possessing an identification code, are placed together in a transport container as a single group, The steps include: using the identification code to collect processing information from process equipment for performing a processing step on a glass substrate belonging to one material group; Using the aforementioned processing information, a step is to confirm whether the transfer equipment attached to the process equipment performing the current processing step, and the transfer equipment attached to the process equipment performing the next processing step, which is the next step in the sequence following the current process, are each equipped with flippers. A method for pre-adjusting the processed surface of a glass substrate for a glass substrate semiconductor package, comprising the steps of: if the process equipment for the current processing step and the next processing step is equipped with a flipper, pre-adjusting the glass substrate by rotating it using the process equipment for the current processing step, depending on whether the current surface of the glass substrate coincides with the processing surface and whether the processing surface of the glass substrate coincides with the discharge surface; and if the process equipment for the current processing step and the next processing step is not equipped with a flipper, pre-adjusting the glass substrate by rotating it using a dispensing device that is in a usable state or other process equipment that is in a usable state and equipped with a flipper.
  2. The aforementioned pre-adjustment step is: The process equipment for the current processing step and the next processing step is equipped with a flipper, and the current surface of the glass substrate does not coincide with the processing surface, Based on the processing information, a step is to determine whether the current surface of the glass substrate and the processed surface coincide. A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package, according to claim 1, characterized in that, if the current surface of the glass substrate does not coincide with the processed surface based on the result of the determination of whether or not they coincide, the glass substrate is rotated using the process equipment of the current processing step so that the current surface of the glass substrate coincides with the processed surface.
  3. The aforementioned pre-adjustment step is: If the process equipment for the current and subsequent processing steps does not include a flipper, and the current surface of the glass substrate does not coincide with the processing surface, Based on the processing information, a step is to determine whether the current surface of the glass substrate and the processed surface coincide. If the result of the determination of whether or not they match does not show that the current surface of the glass substrate and the processed surface do not match, the step is to search for a dispensing device that is in a usable state, or other process device that is in a usable state and is equipped with a flipper. A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 1, comprising the steps of: rotating the glass substrate using the searched distribution equipment or other process equipment so that the current surface of the glass substrate coincides with the processed surface.
  4. The step of rotating the glass substrate is: The steps include transporting the glass substrate to the searched distribution equipment, The steps include rotating the glass substrate using the aforementioned distribution equipment to align the current surface of the glass substrate with the processing surface, A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 3, characterized by comprising the step of transporting the glass substrate, whose current surface coincides with the processed surface, to the process equipment for the current processing step.
  5. The step of rotating the glass substrate is: Before the step of transporting the glass substrate, If the distribution equipment is found as a result of the search, the step of changing the state of the distribution equipment from ready-to-use to in use is included. Between the matching step and the step of transporting to the process equipment, The method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 4, characterized in that it includes a step of changing the state of the distribution equipment from a state of use to a state of readiness.
  6. The step of rotating the glass substrate is: A step of transporting the glass substrate to the other process equipment that has been searched, The steps include rotating the glass substrate using the aforementioned other process equipment to align the current surface of the glass substrate with the processing surface, A method for pre-adjusting the processing surface of a glass substrate for a semiconductor package according to claim 3, characterized by comprising the step of transporting a glass substrate that has been pre-adjusted so that its current surface coincides with the processing surface to the processing equipment for the current processing step.
  7. The aforementioned step of performing the rotation operation is, Before the step of transporting the glass substrate, If the search results indicate that other process equipment has been found, the step of changing the state of the other process equipment from ready-to-use to in use is included. Between the matching step and the step of transporting to the process equipment, The method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 6, characterized in that it includes a step of changing the state of the other process equipment from a state of use to a state of readiness.

Description

This invention relates to a method for pre-adjusting the processing surface of a glass substrate for a glass substrate semiconductor package, enabling the current surface of the glass substrate to be pre-adjusted to correspond to the processing surface during the manufacturing process of the glass substrate semiconductor package, and then handing it over to the process equipment. Recently, glass substrates have been developed and are being used as an alternative to plastic substrates in the semiconductor packaging field. Such glass substrates are attracting attention as innovative substrate materials that are changing the landscape of semiconductor packaging. In other words, glass substrates have a smooth surface and excellent processability for large rectangular panels, making them suitable for realizing ultra-fine linewidth semiconductor packaging. Furthermore, because they do not require an intermediate substrate, they offer the advantage of reducing substrate thickness and thus power consumption. On the other hand, unlike plastic substrates, which require simultaneous processing of both the top and bottom surfaces, glass substrates have the advantage of allowing for individual processing of the top and bottom surfaces due to their material properties. Due to these characteristics, prior to processing the glass substrate for manufacturing a glass substrate semiconductor package, an upper/lower surface adjustment operation must be performed to rotate the glass substrate so that the upper surface faces upwards or the lower surface faces upwards, depending on whether the processing surface is the upper surface or the lower surface of the glass substrate. Here, the manufacturing equipment for glass substrate semiconductor packages includes process equipment for performing the main processes of processing the glass substrate, and auxiliary equipment that assists the process equipment by allowing the glass substrate to rotate 180° to perform upper and lower surface adjustment. As described above, auxiliary equipment for adjusting the upper and lower surfaces of the glass substrate includes a sorter and an optional EFEM (Electron-Feedable Element) attached to the process equipment. Specifically, the upper and lower surface adjustment of the glass substrate is performed through the flip stage of the sorter and the flipper of the EFEM. However, distribution equipment is limited to only two or three units across the entire semiconductor package manufacturing line, and not all transfer equipment is equipped with flippers; they are selectively fitted. In other words, if the transfer equipment accompanying the current process equipment does not have a flipper, and it is necessary to rotate the glass substrate, the processing step will be delayed, resulting in a decrease in manufacturing efficiency. Therefore, in order to shorten process time and improve manufacturing efficiency, process improvement technology is needed that allows for the pre-adjustment of the current surface of the glass substrate to match the processing step using available distribution equipment and other transfer equipment equipped with flippers, before handing it over to the processing equipment. Republic of Korea Registered Patent No. 10-2548820 (Publication Date: June 28, 2023)Republic of Korea Registered Patent No. 10-0984279 (Publication Date: 2010.09.30)Republic of Korea Published Patent No. 10-2021-0141698 (Publication Date: November 23, 2021) This flowchart shows a method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to a preferred embodiment of the present invention.This is a diagram showing a process control server for performing a pre-adjustment method for the processed surface of a glass substrate for a semiconductor package according to a preferred embodiment of the present invention. This invention relates to a method for pre-adjusting the processing surface of a glass substrate for a glass substrate semiconductor package, for pre-adjusting the current surface of the glass substrate used in the glass substrate semiconductor package to correspond to the processing steps. In particular, a key feature of the pre-adjustment method for the processed surface of a glass substrate for a glass substrate semiconductor package according to the present invention is that, when the current processing step and the process equipment for the next processing step are not equipped with flippers, the pre-adjustment of the processed surface of the glass substrate to correspond to the manufacturing process is performed using a distribution equipment capable of rotating the glass substrate and other transfer equipment equipped with flippers. This allows for rapid pre-adjustment of the glass substrate, thereby significantly improving the manufacturing efficiency of glass substrate semiconductor packages. A preferred embodiment of the present invention, a method for pre-preparing the processed surface of