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JP-2026075620-A - Laser processing apparatus and laser processing method

JP2026075620AJP 2026075620 AJP2026075620 AJP 2026075620AJP-2026075620-A

Abstract

[Problem] To provide a laser processing apparatus used for processing semiconductor devices. [Solution] A laser processing apparatus is provided, comprising: at least one laser oscillator that outputs a laser beam; at least one beam adjustment element that adjusts the shape of the laser beam output from the laser oscillator; at least one lens positioned between the beam adjustment element and the workpiece, which adjusts the size of the laser beam whose shape has been adjusted by the beam adjustment element and irradiates the workpiece with it; and a controller that sets the processing line width to be formed on the workpiece, determines the rotation angle of the beam adjustment element according to the set processing line width, and controls the beam adjustment element to rotate with respect to a rotation axis parallel to the normal of the plane of the workpiece according to the determined rotation angle. [Selection Diagram] Figure 1

Inventors

  • リー， ジョン ジュン
  • リー， ダエ ユン
  • パク， キュンスン
  • ユー， ヒュクジュン
  • ジョン， ビョングク

Assignees

  • メーレカンパニー インコーポレイテッド
  • サムスン エレクトロニクス カンパニー リミテッド

Dates

Publication Date
20260508
Application Date
20251021
Priority Date
20241022

Claims (20)

  1. In a laser processing apparatus used for processing semiconductor devices, A laser oscillator that outputs a laser beam, At least one beam adjustment element that adjusts the shape of the laser beam output from the laser oscillator, A lens positioned between the beam adjustment element and the workpiece, which adjusts the size of the laser beam whose shape has been adjusted by the beam adjustment element and irradiates the workpiece with it, A laser processing apparatus comprising: a controller that sets the processing line width to be formed on the workpiece, determines the rotation angle of the beam adjustment element according to the set processing line width, and controls the beam adjustment element to rotate with respect to a rotation axis parallel to the normal of the plane of the workpiece according to the determined rotation angle.
  2. The beam adjustment element is a one-dimensional diffractive optical element that divides the laser beam into a plurality of branched beams in a one-dimensional array. The laser processing apparatus according to claim 1, wherein the controller determines the rotation angle based on the radius of curvature of the branched beam that has passed through the lens and the distance between adjacent branched beams that have passed through the lens.
  3. When a parallel axis (Lt) parallel to the direction in which the plurality of branched beams are arranged linearly and a reference axis (As) parallel to the machining direction that intersects the machining line width are defined, The laser processing apparatus according to claim 2, wherein the rotation angle is selected from 0 degrees, which is defined as the case when the parallel axis (Lt) and the reference axis (As) are parallel, to a range where the parallel axis (Lt) and the reference axis (As) are at an acute angle to each other.
  4. The laser processing apparatus according to claim 1, wherein the beam adjustment element is a diffractive optical element or cylindrical lens for generating a linear beam that adjusts the laser beam into a linear beam.
  5. When a parallel axis (Lt) parallel to the linear beam and a reference axis (As) parallel to the machining direction intersecting the machining line width are defined, The laser processing apparatus according to claim 4, wherein the rotation angle is selected from a range of 0 degrees, defined as the case where the parallel axis (Lt) and the reference axis (As) are parallel, to 90 degrees, defined as the case where the parallel axis (Lt) and the reference axis (As) are perpendicular.
  6. Displaced between the beam adjusting element and the lens, The laser processing apparatus according to claim 1, further comprising a beam limiting element that blocks a portion of the laser beam whose shape has been adjusted by the beam adjustment element.
  7. The laser processing apparatus according to claim 6, wherein the beam limiting element is a slit or an aperture.
  8. The laser processing apparatus according to claim 6, wherein the controller determines the cutoff range of the laser beam based on the rotation angle.
  9. The laser processing apparatus according to claim 1, wherein the lens is an objective lens.
  10. The laser processing apparatus according to claim 9, wherein the controller adjusts the size of the processing line width by adjusting the magnification due to a change in the focal length of the lens.
  11. In a laser processing method for processing a workpiece using a laser processing device used for processing semiconductor devices, The aforementioned laser processing apparatus A laser oscillator outputs a laser beam, The shape of the output laser beam is adjusted by the beam adjustment element. The size of the laser beam, whose shape has been adjusted by the lens, is adjusted and irradiated onto the workpiece. The controller sets the width of the machining line formed on the workpiece. The rotation angle of the beam adjustment element is determined according to the set processing line width. A laser processing method in which the beam adjustment element is controlled to rotate with respect to a rotation axis parallel to the normal of the plane of the workpiece, according to the rotation angle determined above.
  12. The beam adjustment element is a one-dimensional diffractive optical element that divides the laser beam into a plurality of branched beams in a one-dimensional array. The laser processing method according to claim 11, wherein the controller determines the rotation angle based on the radius of curvature of the branched beam that has passed through the lens and the distance between adjacent branched beams that have passed through the lens.
  13. When a parallel axis (Lt) parallel to the direction in which the plurality of branched beams are arranged linearly and a reference axis (As) parallel to the machining direction that intersects the machining line width are defined, The laser processing method according to claim 12, wherein the rotation angle is selected within a range from 0 degrees, which is defined as the case when the parallel axis (Lt) and the reference axis (As) are parallel, to the range when the parallel axis (Lt) and the reference axis (As) are at an acute angle.
  14. The laser processing method according to claim 11, wherein the beam adjustment element is a diffractive optical element or cylindrical lens for generating a linear beam that adjusts the laser beam into a linear beam.
  15. When a parallel axis (Lt) parallel to the linear beam and a reference axis (As) parallel to the machining direction intersecting the machining line width are defined, The laser processing method according to claim 14, wherein the rotation angle is selected from within a range of 0 degrees, defined as the case where the parallel axis (Lt) and the reference axis (As) are parallel, to 90 degrees, defined as the case where the parallel axis (Lt) and the reference axis (As) are perpendicular.
  16. The laser processing method according to claim 11, wherein a beam limiting element is disposed between the beam adjustment element and the lens, and blocks a portion of the laser beam whose shape has been adjusted by the beam adjustment element.
  17. The laser processing method according to claim 16, wherein the beam limiting element is a slit or an aperture.
  18. The laser processing method according to claim 16, wherein the controller controls the beam limiting element in synchronization with the rotation angle.
  19. The laser processing method according to claim 11, wherein the lens is an objective lens.
  20. The laser processing method according to claim 19, wherein the controller adjusts the size of the processing line width by adjusting the magnification due to a change in the focal length of the lens.

Description

This invention relates to a laser processing apparatus and a laser processing method used for processing semiconductor devices. When processing semiconductor devices, laser patterning can be performed using a laser to precisely form a desired pattern on the workpiece. Furthermore, laser grooving can be performed to form precise grooves in the workpiece during semiconductor chip dicing and chip packaging processes. In laser processing equipment, the shape of the laser beam irradiated onto the workpiece must also change depending on the type of workpiece, the specifications and patterns of the processing shape, and the processing method. Therefore, the type and size of the optical unit included in the laser processing equipment must also change accordingly. However, changing the optical unit according to various processing specifications presents not only technical limitations but also challenges such as reduced production yield, decreased processing quality, increased processing defects, and cost issues. The configuration of an optical unit is very complex, and changing and manipulating the multiple elements contained within the optical unit to meet various processing specifications results in aberrations caused by these elements, leading to a decrease in processing quality and processing defects, which in turn reduces production yield. This figure shows a laser processing apparatus according to one embodiment of the present invention.Figure 1 is a flowchart illustrating a laser processing method using a laser processing apparatus.This is an explanatory diagram illustrating a laser processing method when the beam adjustment element is a one-dimensional diffractive optical element that splits a laser beam into multiple branched beams in a one-dimensional array.This is an explanatory diagram illustrating a laser processing method when the beam adjustment element is a diffractive optical element for linear beam generation.This is an explanatory diagram illustrating a laser processing method when the beam adjustment element is a cylindrical lens.Figure 3 is a photograph showing the shape of a workpiece after it has been processed by the rotation angle determined by the controller when the beam adjustment element is a one-dimensional diffractive optical element.Figure 3 is an explanatory diagram illustrating the operation of the controller in setting the rotation angle when the beam adjustment element is a one-dimensional diffractive optical element.This figure shows a laser processing apparatus according to another embodiment of the present invention.This is an explanatory diagram illustrating a laser processing method using a laser processing apparatus that includes a beam limiting element. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings, so that they can be easily implemented by a person with ordinary skill in the art to which the present invention pertains. However, the present invention can be realized in a variety of different forms and is not limited to the embodiments described below. In the figures, parts unrelated to the explanation have been omitted in order to clearly illustrate the present invention, and similar parts throughout the specification are denoted by similar reference numerals. In the following embodiments, terms such as "first," "second," etc., are not intended to have a restrictive meaning, but are used to distinguish one component from another. In the following embodiments, a singular expression shall include plural expressions unless the context clearly indicates otherwise. In the following embodiments, terms such as "includes" or "has" mean that the features or components described in the specification are present, and do not preclude the possibility of the addition of one or more other features or components. In the following embodiments, a part such as a film, region, or component being above or above another part includes not only cases where it is directly above the other part, but also cases where another film, region, or component is interposed between them. In the diagrams, the size of the components may be exaggerated or reduced for illustrative purposes. For example, the dimensions and thicknesses of each component shown in the drawings are arbitrary for illustrative purposes, and the present invention is not necessarily limited to those shown. In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes on the Cartesian coordinate system, but can be interpreted in a broader sense that includes them. For example, the x, y, and z axes may be orthogonal to each other, but they may also point in different directions that are not orthogonal to each other. Where other implementations of a particular embodiment are possible, certain steps may be performed in an order different from that described. For example, two steps described consecutively may be performed substantially simul