JP-2026075792-A - Liquid resin composition and resin-encapsulated power module

Abstract

[Problem] To provide a liquid resin composition for sealing power modules by casting, which has an excellent balance between high-temperature storage characteristics and flame retardancy. [Solution] A liquid resin composition used for sealing a power module by casting, comprising a power module substrate on which a circuit layer is formed, and a power semiconductor element mounted on the circuit layer of the power module substrate, The liquid resin composition, epoxy resin, It contains inorganic fillers and flame retardants, The flame retardant is a halogenated compound having a melting point of 250°C or higher and 600°C or lower. Liquid resin composition. [Selection Diagram] None

Inventors

• 橋本 浩一

Assignees

• 住友ベークライト株式会社

Dates

Publication Date

20260511

Application Date

20241023

Claims (10)

1. A liquid resin composition used for sealing a power module by casting, comprising a power module substrate on which a circuit layer is formed, and a power semiconductor element mounted on the circuit layer of the power module substrate, The liquid resin composition, epoxy resin, It contains inorganic fillers and flame retardants, The flame retardant is a halogenated compound having a melting point of 250°C or higher and 600°C or lower. Liquid resin composition.
2. A liquid resin composition according to claim 1, The flame retardant is a halogenated compound having a 5% decomposition temperature of 300°C to 500°C, in a liquid resin composition.
3. A liquid resin composition according to claim 1, The flame retardant is a halogenated compound having a melting point of 300°C or more and 500°C or less, in a liquid resin composition.
4. A liquid resin composition according to claim 1, The flame retardant is a liquid resin composition which is a brominated compound.
5. A liquid resin composition according to claim 1, The flame retardant is a compound represented by formula (1) and a compound represented by formula (2): A liquid resin composition comprising at least one selected from the following.
6. A liquid resin composition according to claim 1, The epoxy resin is a liquid resin composition containing an alicyclic epoxy resin.
7. The liquid resin composition according to claim 6, The epoxy resin further comprises a liquid bisphenol A type epoxy resin or a liquid bisphenol F type epoxy resin in the liquid resin composition.
8. A liquid resin composition according to claim 1, A liquid resin composition in which the flame retardancy of the cured product is V-0, as measured in accordance with the UL standard UL-94 vertical method (vertical combustion test).
9. A liquid resin composition according to claim 1, A two-component liquid resin composition.
10. A resin-encapsulated power module comprising: a power module substrate on which a circuit layer is formed; a power semiconductor element mounted on the circuit layer of the power module substrate; and a sealing material covering the power module substrate and the power semiconductor element, A resin-encapsulated power module wherein the encapsulating material consists of a cured product of the liquid resin composition described in any one of claims 1 to 9.

Description

This invention relates to a liquid resin composition and a resin-encapsulated power module. More specifically, it relates to a liquid resin composition used for encapsulating a power module by casting, and a resin-encapsulated power module encapsulated with the liquid resin composition. Conventionally, liquid epoxy resin compositions at room temperature have been used to encapsulate semiconductor devices. Examples of such conventional liquid epoxy resin compositions include those containing epoxy resins such as bisphenol-type epoxy resins and alicyclic epoxy resins, curing agents such as acid anhydrides and phenol novolacs, curing accelerators such as imidazoles, and inorganic fillers such as fused silica. Furthermore, halogen compounds, antimony compounds, phosphorus compounds, and metal hydrate compounds are used to ensure the flame retardancy of the liquid epoxy resin composition used as a encapsulant. Among these, the combined use of brominated epoxy resins (a halogen compound) and antimony trioxide (an antimony compound) is effective in ensuring flame retardancy and has been put into practical use. For example, Patent Document 1 describes a liquid epoxy resin composition at room temperature containing epoxy resin, a curing agent, a curing accelerator, a silane coupling agent, an inorganic filler, and antimony trioxide, wherein the epoxy resin includes a brominated epoxy resin. However, when semiconductor devices sealed with conventional epoxy resin compositions were stored at high temperatures, brominated compounds were released from these flame retardant components through thermal decomposition, potentially impairing the reliability of the semiconductor device's junctions. Japanese Patent Publication No. 2002-128992 Embodiments of the present invention will be described below. In this specification, numerical ranges indicated using "~" represent a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described stepwise in this specification, the upper or lower limit of a numerical range in one step can be arbitrarily combined with the upper or lower limit of a numerical range in another step. In numerical ranges described in this specification, the upper or lower limit of that numerical range may be replaced with the values shown in the examples. "A or B" means that either A or B is included, or both are included. Unless otherwise specified, the materials exemplified in this specification can be used individually or in combination of two or more. In this specification, the content of each component in a composition means the total amount of multiple substances corresponding to each component present in the composition, unless otherwise specified. [Liquid resin composition] The resin composition of this embodiment is a liquid resin composition for casting, used to encapsulate power semiconductor elements. More specifically, the resin composition of this embodiment is used to encapsulate a power module comprising a power module substrate on which a circuit layer is formed, and a power semiconductor element mounted on the circuit layer of the power module substrate, by a casting method. The liquid resin composition for casting power modules of this embodiment (which may be simply referred to as "resin composition" in this specification) comprises (A) epoxy resin, (B) inorganic filler, and (C) flame retardant. In this embodiment, the flame retardant is a halogenated compound having a melting point of 250°C to 600°C. The resin composition of this embodiment contains a halogenated compound having a melting point of 250°C to 600°C as a flame retardant. Due to the inclusion of such a flame retardant, the cured product of the resin composition of this embodiment exhibits high flame retardancy and excellent high-temperature storage properties. The components used in the resin composition of this embodiment will be described in detail below. (Epoxy resin (A)) The epoxy resin (A) incorporated into the resin composition of this embodiment can be an epoxy resin commonly used in the field. Specific examples of epoxy resin (A) include, for example, bisphenol-type epoxy resins such as novolac-type epoxy resin, bisphenol A-type epoxy resin, and bisphenol F-type epoxy resin; aromatic glycidylamine-type epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane-type glycidylamine, and aminophenol-type glycidylamine; hydroquinone-type epoxy resin; biphenyl-type epoxy resin; stilbene-type epoxy resin; triphenolmethane-type epoxy resin; and triphenolpropane-type epoxy resin. Examples include epoxy resins; alkyl-modified triphenolmethane type epoxy resins; triazine core-containing epoxy resins; dicyclopentadiene-modified phenol type epoxy resins; naphthol type epoxy resins; naphthalene type epoxy resins; phenol aralkyl type epoxy resins having a phenylene and/or biphenylene skeleton; naphthol aralkyl type epoxy resins having