Search

JP-2026075802-A - Adhesive composition for circuit connection, adhesive film for circuit connection, method for manufacturing a circuit connection structure, and circuit connection structure

JP2026075802AJP 2026075802 AJP2026075802 AJP 2026075802AJP-2026075802-A

Abstract

[Problem] To provide an adhesive composition and adhesive film for circuit connections that can suppress the decrease in adhesive strength associated with narrowing the width, as well as a method for manufacturing a circuit connection structure using the same and a circuit connection structure. [Solution] The adhesive composition for circuit connections contains (A) a thermoplastic resin, (B) a radical polymerizable compound, (C) a radical polymerization initiator, (D) a thiol compound having two or more thiol groups in its molecule, and (E) a nitroxide compound having an aminoxyl group in its molecule. [Selection Diagram] None

Inventors

  • 忍見 祐
  • 工藤 直

Assignees

  • 株式会社レゾナック

Dates

Publication Date
20260511
Application Date
20241023

Claims (12)

  1. A circuit connection adhesive composition containing a thermoplastic resin, a radical polymerizable compound, a radical polymerization initiator, a thiol compound having two or more thiol groups in its molecule, and a nitroxide compound having an aminoxyl group in its molecule.
  2. The circuit connection adhesive composition according to claim 1, wherein the ratio T/N of the content T of the thiol compound to the content N of the nitroxide compound is 1 to 100.
  3. The circuit connection adhesive composition according to claim 1, further containing conductive particles.
  4. A circuit connection adhesive film containing a thermoplastic resin, a radical polymerizable compound, a radical polymerization initiator, another radical polymerization initiator, a thiol compound having two or more thiol groups in its molecule, and a nitroxide compound having an aminooxyl group in its molecule.
  5. The circuit connection adhesive film according to claim 4, wherein the ratio T/N of the content T of the thiol compound to the content N of the nitroxide compound is 1 to 100.
  6. The circuit connection adhesive film according to claim 4, further containing conductive particles.
  7. A method for manufacturing a circuit connection structure, comprising the steps of: heat-pressing together a first circuit member, on which a first circuit electrode is formed on the main surface of a first circuit board, and a second circuit member, on which a second circuit electrode is formed on the main surface of a second circuit board, with a circuit connection adhesive film according to any one of claims 4 to 6 interposed between the first circuit member and the second circuit member; and electrically connecting the first circuit electrode and the second circuit electrode to each other.
  8. A first circuit member having a first circuit electrode formed on the main surface of a first circuit board, A second circuit electrode is formed on the main surface of a second circuit board, and a second circuit member is arranged such that the second circuit electrode and the first circuit electrode face each other. The device comprises a connecting member provided between the first circuit member and the second circuit member, which electrically connects the first circuit member and the second circuit member, A circuit connection structure wherein the connecting member is a cured product of the circuit connection adhesive composition described in any one of claims 1 to 3.
  9. The circuit connection structure according to claim 8, wherein the first circuit board is a glass substrate and the second circuit board is a flexible substrate.
  10. A first circuit member having a first circuit electrode formed on the main surface of a first circuit board, A second circuit electrode is formed on the main surface of a second circuit board, and a second circuit member is arranged such that the second circuit electrode and the first circuit electrode face each other. The device comprises a connecting member provided between the first circuit member and the second circuit member, which electrically connects the first circuit member and the second circuit member, The first circuit electrode is located near one side surface of the first circuit board. The second circuit board extends outward beyond the one side surface of the first circuit board, A circuit connection structure wherein the connecting member has an overhang that contacts a part of one side surface of the first circuit board and a part of the main surface of the second circuit board.
  11. The circuit connection structure according to claim 10, wherein the first circuit board is a glass substrate and the second circuit board is a flexible substrate.
  12. The circuit connection structure according to claim 10, wherein the connecting member is a cured product of the adhesive composition described in any one of claims 1 to 3.

Description

This invention relates to an adhesive composition for circuit connections, an adhesive film for circuit connections, a method for manufacturing a circuit connection structure, and a circuit connection structure. Conventionally, in the fields of semiconductor devices and image display devices, circuit connection materials are used to connect various circuit components. Examples of circuit connection materials include adhesive compositions and anisotropic conductive adhesives containing conductive particles (see, for example, Patent Document 1). The connection of circuit components using anisotropic conductive adhesive is performed by pressing the circuit components together (thermocompression bonding) while heating them, with the adhesive interposed between them. This results in a connection structure where the circuit components are joined together and their electrodes are electrically connected to each other. In recent years, displays in televisions, smartphones, and other devices have been increasingly designed with narrower bezels, creating a demand for image display devices capable of achieving this. For the manufacture of such image display devices, a method known as FOG (Film On Glass) mounting is sometimes applied, where a flexible substrate containing driver ICs and other components is mounted onto the glass substrate that constitutes the display panel. Japanese Patent Application Publication No. 1-251787 This is a schematic cross-sectional view showing one embodiment of a laminated film comprising an adhesive film for circuit connection according to the present invention.This is a schematic cross-sectional view illustrating one embodiment of the method for manufacturing a circuit connection structure according to the present invention.This is a schematic cross-sectional view showing one embodiment of the circuit connection structure according to the present invention. In this specification, numerical ranges indicated using "~" represent a range that includes the numerical values before and after "~" as the minimum and maximum values, respectively. In numerical ranges described stepwise in this specification, the upper or lower limit of one step in the numerical range may be replaced with the upper or lower limit of another step in the numerical range. Also, in numerical ranges described in this specification, the upper or lower limit of that numerical range may be replaced with the values shown in the examples. Furthermore, the upper and lower limits described individually can be combined in any way. In this specification, "(meth)acrylate" means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acryloyl". Furthermore, "(poly)" means both with and without the prefix "poly". Furthermore, "A or B" means that either A or B is included, or both are included. Furthermore, unless otherwise specified, the materials exemplified below may be used individually or in combination of two or more. The content of each component in a composition refers to the total amount of any multiple substances present in the composition, unless otherwise specified. The following describes in detail embodiments for carrying out the present invention (hereinafter referred to as "this embodiment"), with reference to the drawings as appropriate. The present invention is not limited to the following embodiments. <Adhesive composition for circuit connections> The circuit connection adhesive composition of this embodiment contains (A) a thermoplastic resin (hereinafter also referred to as "component (A)"), (B) a radical polymerizable compound (hereinafter also referred to as "component (B)"), (C) a radical polymerization initiator (hereinafter also referred to as "component (C)"), (D) a thiol compound having two or more thiol groups in its molecule (hereinafter also referred to as "component (D)"), and (E) a nitroxide compound having an aminooxyl group in its molecule (hereinafter also referred to as "component (E)"). The circuit connection adhesive composition of this embodiment may further contain (F) conductive particles (hereinafter also referred to as "component (F)"). [Component (A): Thermoplastic resin] (A) The components that can be used include polyvinyl butyral resin, polyvinyl formal resin, polyamide resin, polyester resin, phenolic resin, epoxy resin, phenoxy resin, polystyrene resin, xylene resin, polyurethane resin, polyester urethane resin, etc. These can be used individually or in combination of two or more. The weight-average molecular weight of the above thermoplastic resin may be 1.0 × 10⁴ or greater from the viewpoint of film-forming properties, and may be 1.0 × 10⁴ or greater and less than 1.0 × 10⁶ from the viewpoint of miscibility. The weight-average molecular weight of a thermoplastic resin is determined by gel permeation chromatography (GPC) using a calibration curve based on standard polystyrene, according to the following conditions. [G