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JP-2026075915-A - Repair device, defect handling system, defect handling device, and repair method

JP2026075915AJP 2026075915 AJP2026075915 AJP 2026075915AJP-2026075915-A

Abstract

[Problem] To increase the density of metal in the repaired area. [Solution] The repair device is a device for repairing defects 94 in a pattern 93 formed on the upper surface 91 of a substrate 9. The substrate holding part holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The application part 32 applies droplet-shaped conductive paste to the defects 94 in the pattern 93. The hardening part 33 hardens the conductive paste by heating and drying it. The compression part 34 presses the hardened conductive paste toward the substrate 9 while heating it. This makes it possible to increase the density of metal in the repair part provided to fill the defects 94. [Selection Diagram] Figure 2

Inventors

  • 木瀬 一夫
  • 永田 泰史

Assignees

  • 株式会社ＳＣＲＥＥＮホールディングス

Dates

Publication Date
20260511
Application Date
20241023

Claims (12)

  1. A repair device for repairing defects in patterns formed on the surface of a substrate, A substrate holding part that holds a substrate on which a pattern is formed on the surface, The application unit applies a droplet-shaped conductive paste to the missing portion of the pattern, A hardened portion which is cured by heating and drying the conductive paste, A compression unit that heats the hardened conductive paste and presses it toward the substrate, A repair device equipped with [a specific feature/feature].
  2. A repair device according to claim 1, A repair device further comprising a removal unit that removes the portion of the conductive paste that has protruded around the defective area after being pressed by the compression unit by irradiating it with a laser.
  3. A repair device according to claim 1, The repair device comprises a hardening section equipped with a gas ejection section that ejects heated gas toward the conductive paste.
  4. A repair device according to claim 3, The aforementioned gas is an inert gas; repair device.
  5. A repair device according to claim 3, The compression section comprises a rod-shaped compressor that directly contacts the conductive paste with its heated tip and presses it toward the substrate. The gas ejection section comprises a gas nozzle arranged around the compressor, A repair device in which the tip of the compressor is heated by the gas ejected from the gas nozzle along the compressor.
  6. A repair device according to claim 1, The compression section comprises a rod-shaped compressor that directly contacts the conductive paste with its heated tip and presses it toward the substrate. The hardening section shares the compressor with the compression section, A repair device in which the heated tip of the compressor is separated from the conductive paste, and the conductive paste hardens due to radiant heat from the tip.
  7. A repair device according to claim 1, The compression section comprises a rod-shaped compressor that directly contacts the conductive paste with its heated tip and presses it toward the substrate. A repair device in which the compressor and the conductive particles contained in the conductive paste are formed from the same type of metal.
  8. A repair device according to claim 1, A repair apparatus in which the application of the conductive paste by the application unit, the curing of the conductive paste by the curing unit, and the pressing of the conductive paste by the compression unit are performed in an inert gas atmosphere.
  9. A repair device according to claim 1, A repair apparatus in which a laser is irradiated near the defective portion of the pattern to perform pretreatment before the conductive paste is applied by the application unit.
  10. A defect processing system that detects and repairs defects in patterns formed on the surface of a substrate, An inspection device for inspecting substrates having patterns on their surface, A repair device according to any one of claims 1 to 9, Equipped with, The inspection device, An image acquisition unit that captures an image of the substrate to obtain an image of the substrate under inspection, A defect detection unit that detects missing parts of the pattern based on the image under inspection, An output unit that outputs the location information of the defective part detected by the defect detection unit to the repair device, Equipped with, The repair device is a defect processing system that repairs the defective part based on the position information of the defective part output from the output unit.
  11. A defect processing device for detecting and repairing defects in patterns formed on the surface of a substrate, A repair device according to any one of claims 1 to 9, The repair device includes an image acquisition unit that captures an image of the substrate held in the substrate holding section of the repair device to acquire an image of the substrate under inspection, A defect detection unit that detects missing parts of the pattern based on the image under inspection, Equipped with, A defect processing device that repairs the defective part based on the location information of the defective part detected by the defect detection unit.
  12. A repair method for repairing defects in a pattern formed on the surface of a substrate, a) A step of applying droplet-shaped conductive paste to the defective areas of a pattern formed on the surface of a substrate, b) A step of curing the conductive paste, c) A step of heating the cured conductive paste and pressing it toward the substrate, A repair method that includes [this feature].

Description

This invention relates to a technique for repairing defects in patterns formed on the surface of a substrate. Traditionally, in the production process of printed circuit boards (PCBs), the wiring patterns formed on the board surface are inspected, and boards deemed defective are repaired. For example, if a portion of the wiring is missing, causing a break in the connection, the break is repaired by applying conductive paste to the missing portion of the wiring and firing it. On the other hand, Patent Document 1 discloses a method for repairing defects in wiring on a substrate for liquid crystal displays. In this repair method, a transfer member, having a metal film of a low-melting-point metal on the underside of a substrate such as polyimide, is brought into close contact with the defects in the wiring. Then, by irradiating the contact area with laser light through the substrate, the metal film is melted, forming an alloy layer of the metal film and the wiring to repair the defects. Japanese Patent Publication No. 2009-251119 This is a side view showing the configuration of the repair device according to the first embodiment.This diagram shows the internal structure of the repair head.This diagram shows an example of the repair process for a damaged area.This is a side view showing a magnified portion of the repair head.This is a side view showing a magnified portion of the repair head.This is a plan view showing a portion of the circuit board.This is a side view showing a magnified portion of the repair head.This is a side view showing a magnified portion of the repair head.This is a plan view showing a portion of the circuit board.This is a side view showing a magnified portion of the repair head.This is a side view showing a magnified portion of the repair head.This is a side view showing the configuration of the defect processing system.This is a diagram showing the configuration of the control unit.This is a block diagram showing the functions of the control unit.This is a side view showing the configuration of a defect processing device according to the second embodiment. Figure 1 is a side view showing the configuration of a repair device 1 according to the first embodiment of the present invention. The repair device 1 is a device for repairing defects in a pattern formed on the surface of a substrate 9. In Figure 1, three mutually orthogonal directions are indicated by arrows as the X, Y, and Z directions. In the example shown in Figure 1, the X and Y directions are mutually perpendicular horizontal directions, and the Z direction is the vertical direction (i.e., up and down direction). The same applies to the other figures. The substrate 9 is, for example, a roughly rectangular flat printed circuit board. On the substrate 9, a circuit pattern formed of a metal such as copper is provided on the surface of a roughly rectangular flat substrate made of a composite material including glass and resin. The type and shape of the substrate 9 can be varied. The repair device 1 comprises a substrate holder 21, a moving mechanism 22, a repair head 3, and a control unit 8. The control unit 8 has the configuration of a typical computer system, including a CPU, GPU, ROM, RAM, a fixed disk, a display, an input unit, a reader, a communication unit, and a bus. The control unit 8 controls the moving mechanism 22, the repair head 3, and other components. The substrate holder 21, the moving mechanism 22, and the repair head 3 are arranged on a roughly rectangular base 11. Specifically, the first moving mechanism 23 (described later) of the moving mechanism 22 is fixed to the upper surface of the base 11 (i.e., the main surface on the (+Z) side), and the substrate holder 21 is supported from below (i.e., the (-Z) side) by the first moving mechanism 23. A gate-shaped support section 12 (a so-called gantry) is erected on the upper surface of the base 11, straddling the substrate holder 21 and the first moving mechanism 23. The repair head 3 is mounted so as to be movable in the X direction to the beam section 13 extending in the X direction of the support section 12. In other words, the support section 12 supports the repair head 3 so as to be movable in the X direction. The substrate holding section 21 is, for example, a roughly rectangular flat stage, positioned at a distance from the repair head 3 on the (-Z) side (i.e., downward side). The substrate holding section 21 holds the substrate 9 by contacting the main surface (i.e., the bottom surface) on the (-Z) side of the substrate 9 and supporting it from below. The substrate holding section 21 includes, for example, a vacuum chuck (not shown) that holds the bottom surface of the substrate 9 by suction. The substrate holding section 21 may also include a holding structure other than a vacuum chuck (e.g., a mechanical chuck). The main surface (hereinafter also referred to as the "upper surface 91") on the (+Z) side of the substrate 9 held by the substrate holding secti