JP-2026076060-A - Substrate processing apparatus, rotational position adjustment method, and information processing apparatus.

JP2026076060AJP 2026076060 AJP2026076060 AJP 2026076060AJP-2026076060-A

Abstract

[Problem] To provide a technology that reduces the amount of work required by an operator to adjust the rotational position of a rotary table installed inside a chamber for substrate processing. [Solution] A substrate processing apparatus that adjusts the set values of the rotation positions of multiple slots on a rotary table using images taken inside a chamber, comprising: a reference rotation position detection unit that detects a reference rotation position of the rotary table; a provisional determination unit that rotates the rotary table according to the reference rotation position, detects the amount of deviation of the rotation position of a first slot based on an image of the rotary table taken from a window, and provisionally determines the rotation positions of multiple slots including the first slot based on the amount of deviation of the rotation position of the first slot; and a final determination unit that rotates the rotary table to the provisionally determined rotation positions of the multiple slots, detects the amount of deviation of the rotation positions of the multiple slots based on an image of the rotary table, and finally determines the rotation positions of the multiple slots based on the amount of deviation of the rotation positions of the multiple slots. [Selection Diagram] Figure 5

Inventors

松本洋平
菅原克昭
藤尾丹
百々正已

Assignees

東京エレクトロン株式会社

Dates

Publication Date: 20260511
Application Date: 20241023

Claims (8)

A substrate processing apparatus that adjusts the set values of the rotational positions of multiple slots of a rotary table housed in a substrate processing chamber using an image taken from the top surface of the chamber, A reference rotation position detection unit for detecting the reference rotation position of the rotary table, A provisional determination unit rotates the rotary table according to the aforementioned reference rotation position, detects the amount of rotational position deviation of the first slot based on an image of the rotary table captured from the window, and provisionally determines the rotational positions of a plurality of slots, including the first slot, based on the amount of rotational position deviation of the first slot. The rotary table is rotated to the rotation positions of the multiple slots that were provisionally determined, and the amount of deviation in the rotation positions of the multiple slots is detected based on the image of the rotary table captured from the window, and the rotation positions of the multiple slots are final determined from the amount of deviation in the rotation positions of the multiple slots. A substrate processing apparatus having
An inspection unit rotates the rotary table to the rotational positions of the predetermined multiple slots, detects the amount of deviation in the rotational positions of the multiple slots based on an image of the rotary table captured from the window, and uses the detected amount of deviation in the rotational positions of the multiple slots to inspect the rotational positions of the predetermined multiple slots. The substrate processing apparatus according to claim 1, further comprising:
A reflection unit that, after receiving instructions from the operator, reflects the rotational positions of the predetermined multiple slots into the set values of the rotational positions of the multiple slots. The substrate processing apparatus according to claim 2, further comprising the above.
The inspection unit will issue an alarm if the cumulative amount of the rotational position deviation of the detected multiple slots exceeds a threshold. The substrate processing apparatus according to claim 2.
The final determination unit rotates the rotary table multiple times to the rotation positions of the multiple slots that have been tentatively determined, detects the amount of deviation in the rotation positions of the multiple slots based on the image captured by the rotary table, and uses the average value, median, or standard deviation of the amount of deviation in the rotation positions of the multiple slots to finalize the rotation positions of the multiple slots from the tentatively determined rotation positions. A substrate processing apparatus according to any one of claims 1 to 4.
The reference rotation position detection unit detects the reference rotation position of the rotary table using an encoder configured to detect the rotation angle of the rotary axis of the rotary table, or detects the reference rotation position of the rotary table using a laser sensor configured to detect the detected part of the rotary table. A substrate processing apparatus according to any one of claims 1 to 4.
A method for adjusting the rotational position of a substrate processing apparatus, which uses an image taken from a window on the upper surface of the chamber to capture the inside of the chamber, to adjust the set values of the rotational positions of multiple slots on a rotary table housed in the chamber, To detect the reference rotational position of the aforementioned rotary table, The rotary table is rotated according to the aforementioned reference rotation position, and the amount of deviation in the rotational position of the first slot is detected based on the image of the rotary table captured from the window, and the rotational positions of a plurality of slots, including the first slot, are tentatively determined from the amount of deviation in the rotational position of the first slot. The rotary table is rotated to the rotational positions of the aforementioned provisionally determined plurality of slots, and the amount of deviation in the rotational positions of the plurality of slots is detected based on the image of the rotary table captured from the window, and the rotational positions of the plurality of slots are finalized based on the amount of deviation in the rotational positions of the plurality of slots. A method for adjusting the rotational position having the following characteristics.
An information processing device that adjusts the set values of the rotational positions of multiple slots of a rotary table housed in a substrate processing chamber of a substrate processing device using an image taken from a window provided on the upper surface of the chamber, A reference rotation position detection unit for detecting the reference rotation position of the rotary table, A provisional determination unit rotates the rotary table according to the aforementioned reference rotation position, detects the amount of rotational position deviation of the first slot based on an image of the rotary table captured from the window, and provisionally determines the rotational positions of a plurality of slots, including the first slot, based on the amount of rotational position deviation of the first slot. The rotary table is rotated to the rotation positions of the multiple slots that were provisionally determined, and the amount of deviation in the rotation positions of the multiple slots is detected based on the image of the rotary table captured from the window, and the rotation positions of the multiple slots are final determined from the amount of deviation in the rotation positions of the multiple slots. An information processing device having

Description

This disclosure relates to a substrate processing apparatus, a rotational position adjustment method, and an information processing apparatus. For example, a substrate processing apparatus is known that includes a chamber for processing substrates, and a susceptor with multiple slots is housed within the chamber. During startup or maintenance of the substrate processing apparatus, the operator manually adjusted the rotational position of the susceptor mounted within the chamber. Conventionally, a substrate position detection device is known that can detect the position of a substrate from an image of a predetermined object inside a substrate processing chamber by capturing an image of the predetermined object through a window provided on the upper surface of the chamber (see, for example, Patent Document 1). Patent No. 6118102 This figure schematically shows an example of a substrate processing apparatus according to this embodiment.This figure schematically shows an example of the upper surface of the chamber 1 of the substrate processing apparatus according to this embodiment.This figure shows the arrangement of chamber marks and susceptor marks in an example of a substrate processing apparatus according to this embodiment.This is a functional block diagram of an example of the processing unit according to this embodiment.This is a functional block diagram of an example of a control unit according to this embodiment.This flowchart shows an example of the processing procedure of the control unit according to this embodiment.This flowchart shows an example of the processing procedure for step S10.This is a flowchart of an example of the processing procedure in step S12.This is a flowchart of an example of the processing procedure for step S14.This figure shows an example of data used to adjust the rotation position settings for the susceptor slots S1 to S6.This is an illustrative image of an example screen showing how an operator initiates automatic adjustment of the susceptor's rotational position.This is an illustrative image of an example screen where an operator performs automatic adjustment of the susceptor's rotational position.This is a hardware configuration diagram of an example computer. The following description of this embodiment will be given with reference to the drawings. Figure 1 is a schematic diagram showing an example of a substrate processing apparatus 180 according to this embodiment. The substrate processing apparatus 180 includes a substrate position detection device 170. The substrate position detection device 170 includes a luminaire 120, a luminaire reflector 130, a camera 140, a housing 150, and a processing unit 160. Furthermore, the substrate processing apparatus 180, in addition to the substrate position detection device 170, has a chamber 1, a susceptor 2, a window 110, and a rotating shaft 22 as its main components. The substrate processing apparatus 180 may also include, as necessary, various components within the chamber 1 and various components attached to the chamber 1 for processing the substrate. Figure 1 shows a wafer W, which is an example of a substrate. Chamber 1 is a processing container for processing a substrate such as a wafer W. The chamber 1 of the substrate processing apparatus 180 according to this embodiment is not limited to the content of the substrate processing. Therefore, the substrate processing apparatus 180 can be configured as a device for various substrate processing tasks. In this embodiment, for ease of explanation, an example in which the chamber 1 of the substrate processing apparatus 180 is configured as a film deposition chamber for film deposition processing will be described. Chamber 1 is configured as a sealed container for processing wafers W. Chamber 1 may include a top plate 11 and a container body 12, forming a sealed container as a whole. A hole 16 is provided in a part of the top plate 11 to allow imaging of the inside of Chamber 1 with a camera 140. The hole 16 is an opening leading to the inside of Chamber 1. Chamber 1 becomes sealed by positioning a window 110 to cover the hole 16. Figure 2 is a schematic diagram showing an example of the upper surface of the chamber 1 of the substrate processing apparatus 180 according to this embodiment. The upper surface of the chamber 1 is composed of a top plate 11. A hole 16 is formed in a part of the top plate 11. The top plate 11 is provided with a window 110 that is slightly larger than the hole 16, so as to cover the hole 16. The window 110 is sealed by an O-ring 115, blocking the hole 16. Returning to the explanation of Figure 1, when performing a film deposition process, it is common practice to heat the chamber 1 to a high temperature and supply the reaction gas for film deposition into the chamber 1. Film deposition processes utilize methods such as atomic layer deposition (Atomic Layer Deposition), which forms an atomic layer on the surface of the wafer W, or molecular layer deposi