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JP-2026076063-A - Easy-to-dismantle adhesive composition, adhesive sheet, and laminate

JP2026076063AJP 2026076063 AJP2026076063 AJP 2026076063AJP-2026076063-A

Abstract

[Problem] To provide an adhesive composition that can achieve both high heat resistance and easy dismantling. [Solution] An easily disassembled adhesive composition containing a thermosetting resin (A) having an ester skeleton and an acid generator (B). [Selection Diagram] None

Inventors

  • 安藤 秀樹
  • 白岩 寛之

Assignees

  • ニッカン工業株式会社

Dates

Publication Date
20260511
Application Date
20241023

Claims (20)

  1. An easily disassembled adhesive composition containing a thermosetting resin (A) having an ester skeleton and an acid generator (B).
  2. The easily disassembled adhesive composition according to claim 1, further comprising a crosslinking agent (C) that improves the crosslink density by reacting with the functional groups of the thermosetting resin (A) having the ester skeleton.
  3. The easily disassembled adhesive composition according to claim 2, wherein the thermosetting resin (A) having the ester skeleton has a carboxyl group as the functional group.
  4. The easily dismantled adhesive composition according to claim 1, wherein the content of the acid generating agent (B) is 1% by mass or more and 50% by mass or less, when the total solid content of the easily dismantled adhesive composition is considered to be 100% by mass.
  5. The easily dismantled adhesive composition according to claim 2, wherein the equivalent ratio (C equivalent/A equivalent) of the equivalent amount of the crosslinking agent (C) to the equivalent amount of the thermosetting resin (A) having the ester skeleton is 0.5 or more and 6 or less.
  6. The easily disassembled adhesive composition according to claim 1, wherein the thermosetting resin (A) having an ester skeleton is a polyester resin.
  7. The easily dismantled adhesive composition according to claim 2, wherein the crosslinking agent (C) is an epoxy resin.
  8. The easily dismantled adhesive composition according to claim 1, further containing filler (D).
  9. The easily dismantled adhesive composition according to claim 8, wherein the filler (D) is an inorganic filler.
  10. The easily dismantled adhesive composition according to claim 8, wherein the content of the filler (D) is 1% by mass or more and 50% by mass or less, when the total solid content of the easily dismantled adhesive composition is considered to be 100% by mass.
  11. An easily disassembled adhesive sheet formed using the easily disassembled adhesive composition described in any one of claims 1 to 10.
  12. The peel strength when peeling a cured product of the easily disassemblable adhesive sheet, obtained by heat curing the laminated adhesive sheet onto a substrate, from the substrate at 23°C, 50% RH, with a tensile speed of 300 mm/min and a peel angle of 180°, where A1 is the peel strength before heat treatment at 200°C for 1 hour and A2 is the peel strength after heat treatment at 200°C for 1 hour, The easily dismantled adhesive sheet according to claim 11, wherein A1 and A2 satisfy the range of the following formula (1). (A2/A1)×100≧90...(1)
  13. The peel strength when peeling a cured product of the easily disassemblable adhesive sheet, obtained by heat curing the sheet in a laminated state on a substrate, from the substrate at 23°C, 50% RH, with a tensile speed of 300 mm/min and a peel angle of 180°, where A3 is defined as the peel strength after irradiation with energy rays without heat treatment at 200°C, and A4 is defined as the peel strength after heat treatment at 200°C followed by irradiation with energy rays, The easily dismantled adhesive sheet according to claim 12, wherein A3 and A4 satisfy at least one of the following formulas (2) and (3). (A3/A1) × 100 ≤ 10 and (A4/A2) × 100 ≤ 10 ... (2) A3 ≤ 0.3 N/mm and A4 ≤ 0.3 N/mm ... (3)
  14. The easily dismantled adhesive sheet according to claim 11, wherein the cured product of the easily dismantled adhesive sheet, obtained by thermal curing while laminated on a substrate, can be peeled off from the substrate by irradiation with energy rays or heat treatment.
  15. The easily dismantled adhesive sheet according to claim 11, wherein when the cured product of the easily dismantled adhesive sheet, obtained by heat curing while laminated on a substrate, is peeled off the substrate, a portion of the easily dismantled adhesive sheet remaining on the substrate can be removed with an organic solvent.
  16. A laminate comprising a base material and an easily disassembled adhesive sheet laminated on the base material, A laminate in which the easily disassembled adhesive sheet is formed using an easily disassembled adhesive composition according to any one of claims 1 to 10, and the total light transmittance is 85% or more.
  17. The laminate according to claim 16, wherein the haze value is 0.2% or more and 5.2% or less.
  18. A method for producing an easily disassembled adhesive sheet using the easily disassembled adhesive composition described in any one of claims 1 to 10, A method for manufacturing an easily disassembled adhesive sheet, comprising molding and drying an easily disassembled adhesive composition under LED lighting.
  19. A method for manufacturing an article, comprising fixing a workpiece, which is a precursor to the article, with an easily disassembled adhesive sheet, processing the workpiece, and then peeling off the easily disassembled adhesive sheet from the workpiece that was fixed with the easily disassembled adhesive sheet to obtain the processed article, A method for manufacturing an article, wherein the easily dismantled adhesive sheet is as described in claim 11.
  20. A method for dismantling a cured product, comprising curing an easily dismantled adhesive composition containing a thermosetting resin (A) having an ester skeleton and an acid generator (B), and then irradiating the cured product with energy rays or heat-treating the cured product.

Description

This invention relates to an easily disassembled adhesive composition, an adhesive sheet formed using the easily disassembled adhesive composition, and a laminate. Adhesive compositions that possess a certain level of adhesive strength while also being able to easily peel (disassemble) by reducing the adhesive strength at a desired time are in high demand for applications such as the separate collection of dissimilar materials, the repair and replacement of defective parts, and the improvement of productivity through temporary bonding in manufacturing processes. For example, as described in Patent Document 1, an easily disassembled adhesive composition has been proposed for temporarily fixing a sheet material or protective substrate to a product during processing, such as grinding, for semiconductor products like semiconductor wafers, or capacitors and optical products. Furthermore, in the field of recycling (reuse or separate waste disposal), to recycle adhesive substrates, easily dismantled adhesive compositions have been proposed that can be easily peeled off (dismantled) when no longer needed. These compositions allow for easy peeling by irradiating the laminate with energy such as heat or light, enabling the reuse of the substrate (Patent Documents 2-4). Patent No. 5552365Patent No. 4775622Japanese Patent Publication No. 2023-108960Japanese Patent Publication No. 2003-286464 The present invention will be described in detail below, but the present invention is not limited thereto. The easily disassembled adhesive composition according to this embodiment is used, for example, to obtain an adhesive sheet for temporary fixing used in the manufacturing process of electronic components. The adhesive sheet formed by this easily disassembled adhesive composition can be cured at a desired timing by heat, and the cured adhesive sheet can be easily peeled off the adherend by disassembling the cured material at a desired timing by irradiation with energy rays. <Easily disassembled adhesive composition> The easily disassembled adhesive composition according to this embodiment contains, for example, a thermosetting resin (A) having an ester skeleton and an acid generator (B). The thermosetting resin (A) having an ester skeleton includes not only resins generally known as thermoplastic resins, but also resins that possess thermosetting properties due to having thermosetting functional groups. For example, it is one or more resins selected from the group consisting of polyester resins, polyester urethane resins, thermosetting polycarbonate resins, vinyl ester resins, polyester-modified epoxy resins, and rosin esters. Examples of polyester resins include Toyobo's "Byron (registered trademark, hereinafter the same) 200 (Mn: 17000, Tg: 67℃, hydroxyl value: 6 mg KOH/g, acid value: <2 mg KOH/g)", "Byron 220 (Mn: 3000, Tg: 53℃, hydroxyl value: 50 mg KOH/g, acid value: <2 mg KOH/g)", "Byron 226 (Mn: 8000, Tg: 65℃, hydroxyl value: 20 mg KOH/g, acid value: <2 mg KOH/g)", "Byron 296 (Mn: 14000, Tg: 71℃, hydroxyl value: 7 mg KOH/g, acid value: 6 mg KOH/g)", and "Byron 550 (Mn: 28000, Tg: -15℃, water Acid value: 4 mg KOH/g, Acid value: <2 mg KOH/g) "Byron 560 (Mn: 3000, Tg: 7°C, Hydroxyl value: 8 mg KOH/g, Acid value: <2 mg KOH/g)""Byron 822 (Mn: 15000, Tg: 68°C, Hydroxyl value: 3 mg KOH/g, Acid value: 5 mg KOH/g)""Byron GK150 (Mn: 13000, Tg: 20°C, Hydroxyl value: 7 mg KOH/g, Acid value: 5 mg KOH/g)""Byron GK150 (Mn: 13000, Tg: 20°C, Hydroxyl value: 7 mg KOH/g, Acid value: 5 mg KOH/g)""Byron GK360 (Mn: 16000, Tg: 56°C, Hydroxyl value: 7 "Byron GK570 (Mn: 19000, Tg: 0℃, hydroxyl value: 6mgKOH/g, acid value: <2mgKOH/g)", "Byron GK780 (Mn: 11000, Tg: 36℃, hydroxyl value: 11mgKOH/g, acid value: 3mgKOH/g)", "Byron GK810 (Mn: 6000, Tg: 46℃, hydroxyl value: 19mgKOH/g, acid value: 5mgKOH/g)", "Byron BX1001 (Mn: 28000, Tg: -18℃, hydroxyl value: 8mgKOH/g, acid value: 2mgKOH/g)" Mitsubishi Chemical Corporation "Nichigo Polyester (registered trademark, same hereinafter) TP Examples include "-217 (Tg: 40℃, hydroxyl value: <7 mg KOH/g, acid value: <3 mg KOH/g)", "Nichigo Polyester TP-220 (Tg: 70℃, hydroxyl value: 3-8 mg KOH/g, acid value: <3 mg KOH/g)", "Nichigo Polyester TP-290 (Tg: 10℃, hydroxyl value: 2-6 mg KOH/g, acid value: <4 mg KOH/g)", "Nichigo Polyester LP-011 (Tg: 4℃, hydroxyl value: 4-8 mg KOH/g, acid value: <3 mg KOH/g)", and "Nichigo Polyester LP-033 (Tg: 15℃, hydroxyl value: 4-8 mg KOH/g, acid value: <1 mg KOH/g)". In addition to these commercially available polyester resins, polyester resins manufactured by known methods may also be used. For example, polyester resins having any molecular weight, Tg (glass transition temperature), and acid value can be produced by methods such as polycondensation of dicarboxylic acid and glycol, or reaction of polyester polyol and tetracarboxylic dianhydride. The glass transition temperature (Tg) of each resin can be determined by differential scanning calorimetry (DSC) in accordance with JIS K