Search

JP-2026076120-A - A copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, and a method for manufacturing the same.

JP2026076120AJP 2026076120 AJP2026076120 AJP 2026076120AJP-2026076120-A

Abstract

[Problem] To provide a method for manufacturing a copper foil laminated structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity. [Solution] A method for manufacturing a copper foil laminated structure includes: (a) coating a ceramic ink composition containing ceramic particles using an inkjet printing method to form a ceramic insulating film in which ceramic particles are uniformly distributed; (b) spraying a resin ink composition containing resin onto the top of the ceramic insulating film using an inkjet printing method to impregnate the pores between the ceramic particles with the resin ink composition; (c) heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200°C for 1 to 6 hours to form an insulating substrate; and (d) bonding a copper foil layer onto the insulating substrate to form a copper foil laminated structure, wherein the insulating substrate has a thermal conductivity of 1.92 to 18 W/mK. [Selection Diagram] Figure 1

Inventors

  • キム ジョン ヒ

Assignees

  • シーアールエイチエム カンパニー リミテッド

Dates

Publication Date
20260511
Application Date
20251008
Priority Date
20241023

Claims (11)

  1. (a) A step of coating a ceramic ink composition containing ceramic particles using an inkjet printing method to form a ceramic insulating film in which the ceramic particles are uniformly distributed; (b) A step of spraying a resin ink composition containing resin onto the upper part of the ceramic insulating film using an inkjet printing method, thereby impregnating the resin ink composition into the pores between the ceramic particles; (c) A step of forming an insulating substrate by heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200°C for 1 to 6 hours; and, (d) The step of bonding a copper foil layer onto the insulating substrate to form a copper foil laminated structure; Includes, A method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the insulating substrate has a thermal conductivity of 1.92 to 18 W/mK.
  2. In the above stage (a), A method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the coating by the inkjet printing method is carried out under conditions of 80 to 140°C, as described in claim 1.
  3. In the above stage (a), The method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the ceramic particles include one or more selected from Al₂O₃ , AlN, SiO₂ , BaTiO₃ -based ceramics, SrTiO₃ -based ceramics, PbTiO₃ -based ceramics, ferrite, and Pb(Zr,Ti) O₃ -based ceramics, as described in claim 1.
  4. The method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the ceramic particles have an average diameter of 10 to 1,000 nm, as described in claim 3.
  5. In step (a) above, the ceramic ink composition is ejected at a first speed and a first interval, and in step (b) above, the resin ink composition is ejected at a second speed and a second interval. A method for manufacturing a copper foil laminate structure having low dielectric constant, low dielectric loss, and high thermal conductivity, as described in claim 3, characterized in that the first speed and the second speed are the same, and the second interval is greater than the first interval.
  6. In step (b) above, The aforementioned resins include polyacrylic resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polyphenylene ester resins (PPE), polyphenylene sulfide resins, and cyanate ester resins. A method for manufacturing a copper foil laminate structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity, characterized by comprising one or more selected from among resin and benzocyclobutene (BCB), as described in claim 1.
  7. The method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the insulating substrate after step (c) above contains 5 to 50 vol% of resin, 0 to 40 vol% of pores, and the remaining amount of ceramic particles, relative to the total volume of the insulating substrate.
  8. The method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the insulating substrate after step (d) above has a dielectric constant (Dk) of 4.9 or less, measured at 10 to 100 GHz, and a dielectric loss (Df) of 0.008 or less.
  9. The copper foil laminated structure, after step (d) above, is characterized by being used as a digital substrate by designing a circuit pattern having a line width of 40 μm or less by selectively etching the copper foil layer, as described in claim 1, for a method of manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity.
  10. Insulating substrate and The copper foil layer attached to the insulating substrate, Includes, The insulating substrate contains 5 to 50 vol% of resin, 0 to 40 vol% of pores, and the remaining amount of ceramic particles, based on the total volume of the insulating substrate. The ceramic particles have an average diameter of 10 to 1,000 nm. The insulating substrate is a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized by having a thermal conductivity of 1.92 to 18 W/mK.
  11. The insulator substrate is characterized by having a dielectric constant (Dk) of 4.9 or less, measured at 10 to 100 GHz, and a dielectric loss (Df) of 0.008 or less, as described in claim 10, for a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity.

Description

This invention relates to a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, and to a method for manufacturing the same. More specifically, it relates to a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, which can be used as a digital substrate by laminating an insulating substrate having low dielectric constant, low dielectric loss, and high thermal conductivity with a copper foil layer, and selectively etching a portion of the copper foil layer to create a circuit pattern with a line width of 40 μm or less. There is increasing demand for higher performance, faster transmission speeds, smaller size, lighter weight, and thinner designs in electronic products. In addition to the demand and trends for these electronic products, low-dielectric-constant materials with low signal loss rates are extremely important in the 5G and above communication market, where large amounts of data must be transmitted at high speeds in high-frequency bands. This has led to continued development of substrates with low dielectric constants that can be applied to communication equipment such as antennas for ultra-high-speed communication, as well as server boards. However, FR-4 polymer materials, commonly used as substrate materials, have relatively high dielectric loss, limiting their ability to reduce dielectric loss tangent. Therefore, attempts are being made to use ceramic materials with a dielectric loss tangent less than 1/10th that of polymer materials as an alternative. Relevant prior art includes Japanese Patent Publication No. 2001-348488 (published December 18, 2001), which describes a thermally conductive resin composition, a prepreg, a heat-dissipating circuit board, and a heat-dissipating heat-generating component. Japanese Patent Publication No. 2001-348488 This is a schematic diagram showing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention.Figure 1 is a schematic diagram showing an insulating substrate.This is a step procedure diagram showing a method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention.This is a photograph showing a dielectric constant measuring instrument.This is a photograph showing a thermal conductivity meter.This graph shows the measurement results of the thermal conductivity of a copper foil laminated structure manufactured according to Example 1.This graph shows the measurement results of the thermal conductivity of a copper foil laminated structure manufactured according to Example 2.This graph shows the measurement results of the thermal conductivity of a copper foil laminated structure manufactured according to Example 3.This graph shows the measurement results of the thermal conductivity of a copper foil laminated structure manufactured according to Example 4.This graph shows a comparison of the measurement results of the thermal conductivity of copper foil laminated structures manufactured according to Examples 1 to 4. The aforementioned objectives, features, and advantages will be described in detail below with reference to the accompanying drawings, thereby enabling a person with ordinary skill in the art to readily implement the technical concept of the present invention. In describing the present invention, if a specific description of known technologies related to the present invention is deemed to obscure the gist of the invention, such detailed description will be omitted. Hereafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings are used to indicate identical or similar components. Any matters not described herein that can be reasonably inferred by a person of ordinary skill in this art will be omitted from this specification. In this specification, the placement of any component "above (or below)" or "above (or below)" a component means not only that the component is placed in contact with the upper (or lower) surface of the component, but also that other components may be interposed between the component and any component placed on (or below) it. In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. Terms such as “contain,” “have,” and “include” in this application should not be interpreted as necessarily including all of the various components described in the specification; some components may not be included, or further components may be included. The following describes, with reference to the attached drawings, a preferred embodiment of the present invention, a copper foil laminated structure having low dielectr