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JP-2026076193-A - Exposure apparatus and exposure method

JP2026076193AJP 2026076193 AJP2026076193 AJP 2026076193AJP-2026076193-A

Abstract

[Problem] To provide an exposure apparatus and exposure method capable of performing high-precision circuit drawing. [Solution] In an exposure apparatus that exposes a substrate with a drawing head (4X) and directly draws a circuit on the substrate, the apparatus comprises a substrate stage on which a substrate having a substrate position mark (10A) is placed, a drawing head having a drawing head coordinate system and moving relative to the substrate stage to draw a circuit on the substrate, a reference mark on a reference mark means (9A) provided integrally with the substrate stage, a substrate position detection means having a substrate position detection coordinate system and reading the substrate position mark on the substrate, and a drawing head position detection means that reads the light beam (4a) from the drawing head by overlapping it with the reference mark, the drawing head position detection means corrects the drawing head coordinate system by reading the reference mark on the reference mark means and the substrate position detection means corrects the substrate position detection coordinate system by reading the reference mark on the reference mark means, thereby making the coordinate systems coincide. [Selection Diagram] Figure 2

Inventors

  • 三宅 健
  • 高木 俊博

Assignees

  • サンエー技研株式会社

Dates

Publication Date
20260511
Application Date
20260106
Priority Date
20200323

Claims (12)

  1. In an exposure apparatus that exposes a substrate (10) with a drawing head (4X) and directly draws a circuit on the substrate, A substrate stage (5) on which a substrate (10) having one or more substrate position marks (10a) is placed, The drawing head (4X) has a drawing head coordinate system and moves relative to the substrate stage (5) in a predetermined direction to draw a circuit on the substrate (10), A reference marking means (9; 9A, 9B) is provided integrally with the substrate stage (5) and has one or more reference marks (9C), A substrate position detection means (6) has a substrate position detection coordinate system and moves relative to the substrate stage (5) at least in the predetermined direction to read the substrate position mark (10a) of the substrate (10), A drawing head position detection means (8) is provided integrally with the substrate stage (5) and reads by superimposing the light beam (4a) from the drawing head (4X) and the reference marks (9C) on the reference mark means (9; 9A, 9B), Equipped with, The drawing head position detection means (8) reads the reference mark (9C) on the reference mark means (9) and the light beam (4a) in superimposition and corrects the drawing head coordinate system based on the result, and the substrate position detection means (6) reads the same reference mark (9C) on the reference mark means (9) that the drawing head position detection means (8) read and corrects the substrate position detection coordinate system based on the result, thereby making the drawing head coordinate system and the substrate position detection coordinate system coincide. Exposure apparatus.
  2. In the exposure apparatus according to claim 1, The drawing head (4X) is fixed in position at least in the predetermined direction, and the substrate stage (5) and the substrate position detection means (6) are movable in the predetermined direction. Exposure apparatus.
  3. In the exposure apparatus according to claim 1, The drawing head (4X) is movable at least in the predetermined direction, and the substrate stage (5) is fixed in position at least in the predetermined direction. Exposure apparatus.
  4. In the exposure apparatus according to any one of claims 1 to 3, The aforementioned correction process is performed each time for a different substrate (10) in the exposure apparatus.
  5. In the exposure apparatus according to any one of claims 1 to 4, An exposure apparatus further provided with height adjustment means (11) that can adjust the height of the substrate surface on the substrate (10) of the substrate stage (5) on which the circuit is drawn and the reference mark (9C) surface on the reference mark means (9) to be the same.
  6. In the exposure apparatus according to any one of claims 1 to 5, The exposure apparatus is configured such that the substrate stage (5) is arranged in a pair (5A, 5B) facing each other in the predetermined direction, with the drawing head (4X) in between.
  7. In an exposure method in which a substrate (10) is exposed by a drawing head (4X) and a circuit is drawn directly on the substrate, A substrate stage (5) is provided on which the substrate (10) having one or more substrate position marks (10a) is placed and which is movable in a predetermined direction. The drawing head (4X) is provided, which has a drawing head coordinate system and moves relative to the substrate stage (5) in a predetermined direction to draw a circuit on the substrate (10). A reference marking means (9; 9A, 9B) is provided integrally with the substrate stage (5) and has one or more reference marks (9C), A substrate position detection means (6) is provided that has a substrate position detection coordinate system and moves relative to the substrate stage (5) at least in the predetermined direction to read the substrate position mark (10a) of the substrate (10) that reads the reference mark (9C) on the reference mark means (9), A drawing head position detection means (8) is provided integrally with the substrate stage (5) and reads the light beam (4a) from the drawing head (4X) and the reference marks (9C) on the reference mark means (9; 9A, 9B) by superimposing them. Equipped with, The drawing head position detection means (8) reads the reference mark (9C) on the reference mark means (9) and the light beam (4a) in superimposition and corrects the drawing head coordinate system based on the result, and the substrate position detection means (6) reads the same reference mark (9C) on the reference mark means (9) that the drawing head position detection means (8) read and corrects the substrate position detection coordinate system based on the result, thereby making the drawing head coordinate system and the substrate position detection coordinate system coincide. Exposure method.
  8. In the exposure method described in claim 7, An exposure method characterized in that the drawing head (4X) is fixed in position at least in the predetermined direction, and the substrate stage (5) and substrate position detection means (6) are movable in the predetermined direction.
  9. In the exposure method described in claim 7, The drawing head (4X) is movable at least in the predetermined direction, and the substrate stage (5) is fixed in position at least in the predetermined direction. Exposure method.
  10. In the exposure method according to any one of claims 7 to 9, The exposure method is characterized in that the correction process is performed each time for each different substrate (10).
  11. In the exposure method according to any one of claims 7 to 10, An exposure method characterized by further comprising the step of providing a height adjustment means (11) that can adjust the height so that the height of the substrate surface on the substrate (10) of the substrate stage (5) on which the circuit is drawn and the height of the reference mark (9C) surface on the reference mark means (9) are the same.
  12. In the exposure method according to any one of claims 7 to 11, The exposure method is such that the substrate stage (5) is arranged in a pair (5A, 5B) facing each other in the predetermined direction with the drawing head (4X) in between.

Description

This invention relates to an exposure apparatus and exposure method capable of performing high-precision circuit drawing. Conventionally, to form conductive patterns on the exposure surface of a substrate having a photosensitive layer on its surface, a widely used exposure method has been employed in which the substrate and a photomask on which the pattern is drawn are placed on top of each other, and light is irradiated onto the substrate through the photomask to transfer the pattern to the photosensitive layer on the substrate surface. In contrast, a maskless exposure (direct exposure) method has been proposed that directly forms a predetermined pattern on the substrate without using a photomask (for example, Patent Document 1 below). This maskless exposure method is considered cost-effective because a photomask is unnecessary, and it is also said to enable high-precision exposure. Japanese Patent Publication No. 2006-250982 This is a perspective view of the schematic configuration of an exposure apparatus as one embodiment of the present invention.Figure 1 is a front view of the main components of the exposure apparatus shown.Figure 2 shows an enlarged front view of the left-side substrate stage portion.Figure 1 is a front view showing the first process of the main part of the exposure apparatus.The same as above, this is a front view showing the second process.The same as above, this is a front view showing the third process.The same as above, this is a plan view showing all the processes.Figures 8(A) and 8(B) are enlarged front views showing the components of the substrate position detection camera and the reference mark member, and the components of the drawing head and the reference mark member, respectively.This is a perspective view showing the substrate position detection camera and the reference mark member.This diagram shows the misalignment between the light beam from the drawing head and the reference mark on the reference standard.This is a time chart for board stages 5A and 5B, where the vertical axis shows the operation steps and the horizontal axis shows time. Figures 1 to 3 are a perspective view of the schematic configuration of an exposure apparatus as one embodiment of the present invention, a front view of the main part of the exposure apparatus shown in Figure 1, and an enlarged front view of the left substrate stage in Figure 2. In Figure 1, the exposure apparatus 1 includes a drawing head unit 4 (having multiple drawing heads 4X in directions perpendicular to the directions of arrows A and B) mounted on a bed 3 (extending in directions of arrows A and B) on a frame 2, a pair of substrate stages 5A and 5B on both sides of the drawing head unit 4 in directions of arrows A and B (on which substrates 10A and 10B are placed respectively), and a pair of substrate position detection camera units 6A and 6B on both sides (each having, for example, three substrate position detection cameras 6AX and 6BX in the aforementioned perpendicular directions). Furthermore, the drawing head 4X is equipped with a drawing head coordinate system for drawing circuits on the substrate 10, and the substrate position detection cameras 6AX and 6BX are equipped with a substrate position detection coordinate system for detecting their position on the substrate 10. As will be described later, the drawing head 4X can move back and forth not only in the directions of arrows A and B (main scanning direction) but also in the direction orthogonal thereto (sub-scanning direction). The substrate stages 5A and 5B (mounted on carriages 7A and 7B, respectively) and the substrate position detection camera units 6A and 6B are reciprocally movable in the directions of arrows A and B, respectively. Note that the substrate position detection cameras 6AX and 6BX may also be reciprocally movable in the direction perpendicular to arrows A and B in order to detect their position on the substrate 10. In Figure 2, 8A and 8B are a pair of drawing light beam detection cameras (sensors) integrally mounted on the left and right substrate stages 5A and 5B, respectively. Each of the five drawing heads 4X has five drawing light beam detection cameras 8A and 8B. (See Figure 9) Furthermore, 9A and 9B are reference standards integrally attached to the left and right carriages 7A and 7B, respectively, and have multiple reference marks 9C (see Figure 9). In Figure 3, 11 is a height adjustment mechanism for adjusting the height of the left substrate stage 5A. A drive shaft 14, transmitted from an electric motor 12 via a reduction gear 13, passes through a vertically elongated hole (not shown) in the flange portion 5a of the substrate stage 5A and has an eccentric cam 15. When the eccentric cam 15 is rotationally driven, the substrate stage 5A is pressed, allowing for fine height adjustments in the vertical direction. A similar height adjustment mechanism is provided for the right substrate stage 5B. Next, the operation of the exposure apparatus 1