JP-2026076195-A - Dual-dosing polishing composition for glass substrates

Abstract

[Problem] To provide an improved polishing composition and method for polishing memory or rigid disks. [Solution] A chemically mechanical polishing composition is provided, comprising or substantially comprising a liquid carrier, abrasive particles within the liquid carrier, a pyrophosphate compound, and a sulfonate compound or a compound containing a quaternary ammonium group. [Selection Diagram] None

Inventors

• リー， トン

Assignees

• シーエムシー マテリアルズ リミティド ライアビリティ カンパニー

Dates

Publication Date

20260511

Application Date

20260109

Priority Date

20220324

Claims (20)

1. A chemically mechanical abrasive composition, liquid carrier, Abrasive particles in liquid carrier, A chemically mechanical polishing composition containing a pyrophosphate compound and a sulfonate compound containing a sulfonate anionic surfactant, or an anionic polymer containing a sulfonic acid group.
2. The composition according to claim 1, wherein the abrasive particles include colloidal silica particles.
3. The composition according to claim 1, wherein the abrasive particles have an average particle size in the range of approximately 15 nm to approximately 40 nm.
4. The composition according to claim 1, which contains approximately 5% to approximately 15% by weight of abrasive particles when used.
5. The composition according to claim 1, wherein the pyrophosphate compound comprises tetrapotassium pyrophosphate (TKPP) or tetrasodium pyrophosphate (TSPP).
6. When used, approximately 0.01% to approximately 0.2% by weight of the pyrophosphate compound, and approximately 0.01% to approximately 0.2% by weight of the sulfonate compound. The composition according to claim 1, comprising:
7. The composition according to claim 6, wherein the sulfonate compound comprises a disulfonate anionic surfactant.
8. The composition according to claim 7, wherein the sulfonate compound comprises an alkyldiphenyl oxide disulfonate anionic surfactant.
9. The composition according to claim 1, wherein the pH is in the range of approximately 1.5 to approximately 3.
10. The composition according to claim 1, further comprising an anionic polymer.
11. The composition according to claim 10, wherein the anionic polymer is a polyacrylate polymer or a polymethacrylate polymer.
12. A chemically mechanical abrasive composition, liquid carrier, Abrasive particles in liquid carrier, Pyrophosphate compounds, A chemically mechanical abrasive composition containing a compound with a quaternary ammonium group.
13. When used, approximately 0.01% to approximately 0.2% by weight of the pyrophosphate compound, and approximately 0.01% to approximately 0.2% by weight of the compound containing a quaternary ammonium group, The composition according to claim 12, comprising:
14. The composition according to claim 12, wherein the abrasive particles include colloidal silica particles.
15. The composition according to claim 14, wherein the abrasive particles have an average particle size in the range of approximately 15 nm to approximately 40 nm.
16. The composition according to claim 14, which contains approximately 5% to 15% by weight of abrasive particles when in use.
17. The composition according to claim 12, wherein the pyrophosphate compound comprises tetrapotassium pyrophosphate (TKPP) or tetrasodium pyrophosphate (TSPP).
18. The composition according to claim 12, wherein the compound containing a quaternary ammonium group comprises a tetramethylammonium group, a tetraethylammonium group, a tetrabutylammonium group, a benzyltributylammonium group, or a mixture thereof.
19. The composition according to claim 18, wherein the compound containing the quaternary ammonium group is tetraethylammonium hydroxide.
20. The composition according to claim 12, wherein the pH is in the range of approximately 1.5 to approximately 3.

Description

The embodiments disclosed herein relate to chemically mechanical polishing compositions for polishing glass substrates, and more specifically, to compositions comprising a pyrophosphate compound and a sulfonate compound or a quaternary amine. The hard disk drive industry continues to demand increased storage capacity and smaller size. This creates a corresponding demand for smaller memory or rigid disks with higher storage (or data) density, requiring improved processes for polishing such memory or rigid disks. As used herein, the term “memory or rigid disk” refers to any magnetic disk, hard disk, rigid disk, or memory disk used to hold information in an electromagnetic form. These memory or rigid disks are referred to here simply as disks or boards, and are generally one of two types: (i) Nickel-phosphorus plated aluminum disc, or (ii) glass disc. During manufacturing, these discs are polished to strict surface finish tolerances, and then the magnetic material used for final data storage is deposited onto them. As is well known, the data storage industry is constantly under pressure to lower prices, sometimes to an extreme degree. To maintain economically viable processes, high processing capacity (throughput) is generally required, which necessitates high material removal rates during polishing. However, increasing the removal rate increases surface roughness or waviness. While chemical mechanical polishing (CMP) compositions and methods for polishing nickel-phosphorus and/or glass discs are commercially available, there is an unmet demand for improved polishing compositions to enhance processing capacity and enable increased storage density. In particular, there is an unmet demand for polishing compositions that offer improvements in surface finish (e.g., reduction of surface roughness and surface waviness) and high material removal rates. Summary of the Invention A chemically mechanical abrasive composition is disclosed. The composition comprises, or substantially comprises, a liquid carrier; abrasive particles within the liquid carrier; a pyrophosphate compound; and a sulfonate anionic surfactant or a sulfonate compound containing polysulfonic acid. In another embodiment, the disclosed abrasive composition comprises, or substantially comprises, a liquid carrier; abrasive particles within the liquid carrier; a pyrophosphate compound; and a cationic compound containing a quaternary ammonium cation. Detailed Description of the Invention A chemically mechanical abrasive composition is disclosed. The composition comprises, or substantially comprises, a liquid carrier, abrasive particles in the liquid carrier, a pyrophosphate compound, and a sulfonate anionic surfactant, or an anionic polymer containing a sulfonic acid group, or a compound containing a quaternary ammonium group. In certain embodiments, the composition comprises, or substantially comprises, a liquid carrier, abrasive particles in the liquid carrier, and a synergistic combination of a pyrophosphate compound and a sulfonate anionic surfactant, or an anionic polymer containing a sulfonic acid group, or a synergistic combination of a pyrophosphate compound and a compound containing a quaternary ammonium group. While the disclosed embodiments are not limited in this respect, the disclosed compositions are advantageously usable for polishing glass substrates (e.g., those used in the construction of memory or rigid disks in hard disk drives). As will be illustrated in more detail below, the disclosed polishing compositions involve synergistic combinations of chemical additives, which have been found to advantageously result in a significantly improved polishing speed. Certain embodiments of the disclosed embodiments have also been found to yield equivalent, or even improved, surface finishes (e.g., surface undulation). The term “synergistic” (or “synergistic effect”) will be understood to be used according to the definition of the term in standard dictionaries. Synergy is defined as the interaction of multiple elements such that the combined effect is greater than the sum of their individual effects (Dictionary of Science and Technology, Academic Press, 1992). In the disclosed embodiments, it has been found that combinations of pyrophosphate compounds with sulfonate compounds (e.g., disulfonate anionic surfactants) or quaternary ammonium compounds increase the removal rate in polishing glass substrates beyond the sum of the individual contributions of the pyrophosphate and sulfonate compounds. Furthermore, as will be described in detail in the following examples, it has been found that adding sulfonate compounds or quaternary ammonium compounds to compositions containing pyrophosphate compounds unexpectedly increases the removal rate (contrary to the expected decrease in removal rate). The disclosed polishing compositions generally contain polishing particles dispersed or suspended in a liquid carrier. The liquid carrier is used to facilitate the ap