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JP-2026076254-A - Low dielectric constant low dielectric loss tangent laminate containing an aerogel layer

JP2026076254AJP 2026076254 AJP2026076254 AJP 2026076254AJP-2026076254-A

Abstract

[Problem] To provide a copper-clad laminate having an ultra-low dielectric constant suitable for use in printed circuit boards (PCBs). [Solution] The laminates 10b and 10c include one or more conductive layers 14 and one or more electrically insulating layers 18 bonded to the conductive layers. Each conductive layer may contain at least 90% by weight of copper. Each electrically insulating layer may include a layer of polymer aerogel. For at least one of the opposing front and rear surfaces of the laminate, at least a portion of the surface is defined by one of the conductive layers. [Selection Diagram] Figure 2

Inventors

  • カグンバ ラウィノ
  • ベンキン バイタリー
  • ポー ギャレット

Assignees

  • ブルーシフト マテリアルズ インコーポレイテッド

Dates

Publication Date
20260511
Application Date
20260122
Priority Date
20200515

Claims (20)

  1. One or more conductive layers, each containing at least 90% by weight of copper, A laminate comprising one or more electrically insulating layers bonded to a conductive layer, each of which comprises a polymer aerogel layer, At least one of the opposing front and rear surfaces of the laminate is defined by one of the conductive layers. Laminated structure.
  2. The conductive layer comprises two or more conductive layers. At least a portion of the front surface of the laminate is defined by one of the first conductive layers, and at least a portion of the rear surface of the laminate is defined by one of the second conductive layers. The laminate according to claim 1.
  3. The laminate according to claim 1 or 2, wherein at least one of the conductive layers has a thickness of 0.5 mil to 3.0 mil or 0.5 mil to 0.9 mil.
  4. The laminate according to claim 3, wherein at least one of the conductive layers has a thickness of about 0.7 mils.
  5. The laminate according to any one of claims 1 to 4, wherein at least one of the conductive layers has a surface density of 0.35 to 3.0 ounces (oz/ ft² ) or 0.35 to 0.75 oz/ ft² .
  6. The laminate according to claim 5, wherein at least one of the conductive layers has a surface density of about 0.5 oz/ ft² .
  7. The laminate according to any one of claims 1 to 6, wherein at least one of the electrical insulating layers comprises a polymer aerogel layer with an open-cell structure.
  8. The laminate according to any one of claims 1 to 7, wherein at least one of the electrical insulating layers comprises a polymer aerogel layer with micropores, mesopores, and/or macropores.
  9. For at least one of the electrical insulation layers, A polymer aerogel layer has a pore volume, and micropores occupy at least 10%, at least 50%, at least 75%, or at least 95% of the pore volume. The laminate according to claim 8.
  10. For at least one of the electrical insulation layers, A polymer aerogel layer has pore volume, and mesopores occupy at least 10%, at least 50%, at least 75%, or at least 95% of the pore volume. The laminate according to claim 8.
  11. For at least one of the electrical insulation layers, A polymer aerogel layer has pore volume, and macropores occupy at least 10%, at least 50%, at least 75%, or at least 95% of the pore volume. The laminate according to claim 8.
  12. For at least one of the electrical insulation layers, A polymer aerogel layer has pore volume, and at least 10%, at least 50%, at least 75%, or at least 95% of the pore volume is occupied by micropores and/or mesopores. The laminate according to claim 8.
  13. A laminate according to any one of claims 1 to 7, wherein at least one of the electrical insulating layers is a polymer aerogel layer having an average pore diameter of 2.0 nm to 50 nm.
  14. A laminate according to any one of claims 1 to 7, wherein at least one of the electrical insulating layers is a polymer aerogel layer having an average pore diameter of 50 nm to 5,000 nm.
  15. The laminate according to claim 14, wherein the average pore diameter is 100 nm to 800 nm, 100 nm to 500 nm, 150 nm to 400 nm, 200 nm to 300 nm, or 225 nm to 275 nm.
  16. The laminate according to any one of claims 1 to 15, wherein at least one of the electrical insulating layers comprises a polymer aerogel layer containing at least 90% by weight of an organic polymer.
  17. The laminate according to any one of claims 1 to 15, wherein at least one of the electrical insulating layers comprises a polymer aerogel layer containing at least 90% by weight of polyimide, polyamide, polyaramid, polyurethane, polyurea, and/or polyester.
  18. The laminate according to claim 17, wherein at least one of the electrical insulating layers comprises a polymer aerogel layer containing at least 90% by weight of polyimide.
  19. The laminate according to any one of claims 1 to 18, wherein at least one of the electrical insulating layers has a polymer aerogel layer with a thickness of 20 mils or less.
  20. The laminate according to claim 19, wherein at least one of the electrical insulating layers has a polymer aerogel layer with a thickness of 12 mils or less.

Description

This application, which cross-references related applications , claims priority to U.S. Provisional Patent Application No. 63/025,947, filed on 15 May 2020, which is incorporated herein by reference in its entirety without any waiver of rights. A. Field of Invention The present invention generally relates to copper-clad laminates for use in high-frequency (e.g., 10 to 300 GHz) electrical applications such as communication systems, antenna systems, electrical amplifiers, and radar systems. B. Description of Related Technologies Copper-clad laminates are often used in printed circuit boards (PCBs). Traditionally, a copper-clad laminate comprises one or more thin (e.g., less than 1 inch (mil) of 4.5 × 1000) copper layers, at least one of which defines the outer surface of the laminate, and one or more insulating substrates that can provide structural support to the copper layers. To fabricate a PCB, each of the copper layers can be etched to define separate conductive lines or "traces" that allow electricity to flow between different components bonded to the PCB. The substrate properties of a copper-clad laminate can affect the durability and electrical performance of the PCB. For example, the laminate may heat up when components are soldered to the PCB or during the PCB's use. Thermal expansion of the substrate, especially when its temperature rises above the glass transition temperature (Tg), can cause delamination of the copper layer and/or damage to the joints connecting the components to the PCB. In addition, the speed at which a signal can propagate through the PCB and the amount of electromagnetic energy of the signal wasted on the PCB are affected by the dielectric constant (D k ) and dielectric loss tangent (D f ) of the laminate. The substrates used in PCBs include glass fiber woven or nonwoven fabrics dispersed in epoxy resin, polytetrafluoroethylene (PTFE), and paper impregnated with phenol-formaldehyde resin (e.g., phenolic paper). Copper-clad laminates incorporating one or more such substrates often have relatively low dielectric loss tangents (e.g., 0.0009–0.0018 at 10 GHz), which can reduce dielectric loss, but their dielectric constants exceed 2.0. For example, copper-clad laminates on PTFE substrates typically have a dielectric constant of 2.2–2.3 at 10 GHz. When the dielectric constant exceeds 2.0, PCBs using conventional copper-clad laminates may not be able to propagate signals at speeds sufficient to maintain signal integrity in high-frequency applications such as 5G communication systems and high-speed digital circuits. Therefore, there is a need in the art for copper-clad laminates with ultra-low dielectric constants suitable for use in PCBs. To address this need in the art, some of the laminates of the present invention include one or more conductive layers, each containing at least 90% by weight of copper, and one or more electrically insulating layers bonded to the conductive layers. In some aspects, at least one of the electrically insulating layers may contain a porous material. In some aspects, each of the electrically insulating layers may independently contain a porous material. In certain aspects, the porous material may be an open-cell porous material. In certain other aspects, the porous material may be a closed-cell porous material. In certain aspects, the porous material may be a foam. In certain aspects, the foam may be an organic or silicone foam. Non-limiting examples of organic foams may include polyurethane, polystyrene, polyvinyl chloride, (meth)acrylic polymers, polyamides, polyimides, polyaramids, polyureas, polyesters, polyolefins (e.g., polyethylene, polypropylene, ethylene propylene diene monomer (EPDM) foams, etc.), polyethylene terephthalate, polybutylene terephthalate, polyvinyl chloride, polyvinyl acetate, ethyl vinyl alcohol (EVOH), ethylene vinyl acetate (EVA), polymethyl methacrylate, polyacrylate, polycarbonate, polysulfonate, or synthetic rubber foams, or any combination thereof. In certain aspects, the foam may be a polyurethane foam. In certain aspects, the porous material may be an aerogel. In some laminates, the electrical insulating layer may each include a polymer aerogel layer. Such aerogel layers can give the laminate an ultra-low dielectric constant (e.g., less than 2.0 at 10 GHz, e.g., 1.7 or less) and an ultra-low dielectric loss tangent (e.g., less than 0.002 at 10 GHz), making it suitable for high-frequency electrical applications. The composition of the aerogel layer can enhance the heat resistance of the laminate, making it suitable for use in PCBs. For example, in some embodiments, for at least one of the electrical insulating layers, the polymer aerogel layer has a thermal decomposition temperature of at least 400°C, 450°C, or 500°C. In some embodiments, for at least one of the electrical insulating layers, the polymer aerogel layer contains at least 90% by weight of an organic polymer, and/or at least 90% by weight of polyimide, polyami