JP-2026076295-A - Method for removing temporary fixing tape, apparatus for manufacturing a release member and a component (part), and method for manufacturing a component (part).

Abstract

[Problem] To provide a method for removing temporary fixing tape that is less likely to cause contamination of the material due to adhesive residue and can be efficiently removed from the material in a simple manner, a removal member, a parts manufacturing apparatus equipped with the removal member, and a method for manufacturing parts. [Solution] A method for peeling off a temporary fixing tape 100 to which one or more parts 3 are fixed, wherein the temporary fixing tape has an extendable base material 2 and a temporary fixing layer 1 on one surface of the extendable base material, and is peelable by stretching, the parts are fixed to the temporary fixing layer, and the temporary fixing tape is peeled off from the parts by stretching means in at least one direction. [Selection Diagram] Figure 1

Inventors

• 下岡 澄生
• 渡辺 大亮
• タン シアアー

Assignees

• ＤＩＣ株式会社

Dates

Publication Date

20260511

Application Date

20260209

Priority Date

20221229

Claims (20)

1. A method for removing temporary fixing tape to which one or more parts are fixed, The temporary fixing tape comprises an extendable base material and a temporary fixing layer on one surface of the extendable base material, and is peelable by stretching. A method for peeling off a temporary fixing tape, wherein the component is fixed to the temporary fixing layer, and the temporary fixing tape is peeled off from the component by stretching the temporary fixing tape in at least one direction using a stretching means.
2. The method for peeling off temporary fixing tape according to claim 1, wherein the temporary fixing tape is stretched in two different directions, and the two directions form an angle of approximately 90°.
3. The method for peeling off temporary fixing tape according to claim 1 or 2, wherein the temporary fixing tape is stretched in all directions.
4. The method for peeling off a temporary fixing tape according to any one of claims 1 to 3, wherein the stretching means applies tension horizontally to the adhesive surface between the component and the temporary fixing layer.
5. The method for peeling off a temporary fixing tape according to any one of claims 1 to 4, wherein the stretching means applies tension to the adhesive surface between the component and the temporary fixing layer in a direction opposite to the side on which the component is placed.
6. A method for peeling off temporary fixing tape according to any one of claims 1 to 5, wherein the stretching means includes a stretching member, and the stretching member presses the temporary fixing tape from the side of the temporary fixing tape opposite to the side on which the component is placed, thereby peeling the temporary fixing tape from the component.
7. The method for peeling off temporary fixing tape according to claim 6, wherein the stretched member is annular in plan view, having an outer periphery and a hollow region inside the outer periphery, and a portion of the surface of the outer periphery is covered by a covering portion that is rotatable along the outer periphery surface of the outer periphery.
8. A method for peeling off temporary fixing tape according to any one of claims 1 to 7, wherein when the temporary fixing tape is stretched in one direction by the stretching means, the length of the stretched temporary fixing tape in a direction approximately perpendicular to the one direction is 0.9 or more compared to the length of the temporary fixing tape before stretching in a direction approximately perpendicular to the one direction.
9. The method for peeling off temporary fixing tape according to any one of claims 1 to 8, wherein the temporary fixing layer of the temporary fixing tape is an adhesive layer with numerous recesses formed on its surface.
10. The method for peeling off temporary fixing tape according to any one of claims 1 to 8, wherein the temporary fixing layer of the temporary fixing tape is an adhesive layer.
11. The temporary fixing tape's stress at 50% elongation (50% modulus) is within the range of 0.15 MPa to 20 MPa, and its elongation at break is 200% or more, as described in any of claims 1 to 10.
12. A method for peeling off temporary fixing tape according to any one of claims 1 to 11, wherein the elongation of the temporary fixing tape upon peeling is in the range of 101% to 1500%.
13. A method for peeling off temporary fixing tape according to any one of claims 1 to 12, wherein the aforementioned component is an electronic component.
14. A method for peeling off temporary fixing tape according to any one of claims 1 to 13, wherein the surface area of the part that comes into contact with the temporary fixing tape is 100 mm² or less.
15. A release member used for peeling off a temporary fixing tape that is peelable by stretching, comprising an stretchable base material and a temporary fixing layer on one surface of the stretchable base material, It comprises a holding portion for holding the temporary fixing tape, a hollow portion formed by the holding portion, and an stretching means, The holding portion is arranged such that the temporary fixing tape covers the hollow portion. The stretching means is a release member having the function of stretching the surface of the temporary fixing tape covering the hollow portion in at least one direction.
16. The peeling member according to claim 15, wherein the stretching means is a roll, and the roll is arranged in a first stretching direction.
17. The peeling member according to claim 15, wherein the stretching means is a roll, and the roll is arranged in both a first stretching direction and a second stretching direction that forms an angle of approximately 90° with respect to the first stretching direction.
18. The peeling member according to claim 15, further comprising a stretching member that is capable of moving vertically within the hollow portion and presses a temporary fixing tape covering the hollow portion in the direction of passage.
19. The release member according to claim 18, wherein the stretching member is annular in plan view, having an outer periphery and a hollow region inside the outer periphery, and a portion of the surface of the outer periphery is covered by a rotatable covering portion along the outer periphery.
20. A parts manufacturing apparatus comprising a release member for temporary fixing tape as described in any one of claims 15 to 19.

Description

This invention relates to a method for peeling off temporary fixing tape used to temporarily fix components in the manufacturing process of electronic components and the like, a peeling member, and a manufacturing apparatus and method for manufacturing components (components). In the manufacturing process of electronic components such as semiconductor wafers, multilayer ceramic capacitors (MLCCs), and inductors, the electronic components are temporarily fixed to adhesive tape. After various processes such as grinding, processing, transport, and dicing are carried out, the processed electronic components are peeled off the adhesive tape. The tape used to temporarily fix components (materials) in such manufacturing processes is sometimes called "temporary fixing tape" or "processing tape." Temporary fixing tape requires adhesive properties to prevent peeling during component (material) processing, but it must also be easily peeled off the component (material) after processing without contaminating it. For example, Patent Document 1 discloses a method for removing a component (member) by temporarily fixing it to a heat-activated foam release tape and then heating it, thereby reducing the adhesive function of the adhesive layer due to the foaming or expansion of balloons within the adhesive layer (see, for example, Patent Document 1). Patent Document 2 also discloses a method for removing a component (member) by temporarily fixing it to an active energy ray curing release tape and then irradiating it with active energy rays such as UV light, thereby reducing the adhesive function of the adhesive layer due to a curing reaction (see, for example, Patent Document 2). Patent No. 5572418Japanese Patent Publication No. 2015-108044 This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram showing extension in two or more directions.This is a schematic diagram showing one embodiment illustrating the direction of tension in the peeling method of the present disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram illustrating an example of a method for removing the temporary fixing tape of this disclosure.This is a schematic diagram showing one embodiment of the peeling member of the present disclosure.This is a schematic diagram showing one embodiment of the peeling member of the present disclosure.This is a schematic diagram showing one embodiment of the peeling member of the present disclosure.This is a schematic diagram showing one embodiment of the peeling member of the present disclosure.This is a cross-sectional view taken along line A-A' in Figure 15.This is a schematic diagram showing one embodiment of the peeling member of the present disclosure.This is a schematic diagram showing an example of a stretching means (stretching member).This is a schematic diagram showing an example of a stretching means (stretching member).This is a schematic diagram showing one embodiment of the manufacturing method for the component (material) described herein.This is a schematic diagram showing one embodiment of the manufacturing method for the component (material) described herein.This is a schematic diagram illustrating the vertical movement distance of the stretching means (stretching member) (the distance the tape is pushed out by the stretching means) when a component (member) peels off from the temporary fixing tape.This is a schematic diagram illustrating a method for measuring the surface adhesion strength of temporary fixing tape. 1. Method for peeling off temporary fixing tape The method for peeling off temporary fixing tape according to this disclosure (hereinafter sometimes referred to as "this peeling method") is a method for peeling off temporary fixing tape to which one or more parts (members) are temporarily fixed on the surface, wherein the temporary fixing tape has an extendable base material and a temporary fixing layer on one surface of the extendable base material and is peelable by stretching, the parts (members) are temporarily fixed to the temporary fixing layer, and the method involves stretc