JP-2026076324-A - Substrate support and plasma processing apparatus

JP2026076324AJP 2026076324 AJP2026076324 AJP 2026076324AJP-2026076324-A

Abstract

[Problem] To provide a technology that suppresses discharge between the substrate mounting stage and the substrate. [Solution] The disclosed substrate support comprises a base and an electrostatic chuck disposed on the base. The electrostatic chuck is a laminate disposed on the base, the laminate having a top surface and side surfaces, the laminate including a first insulating layer, a second insulating layer, and an electrode layer disposed between the first insulating layer and the second insulating layer, the electrode layer being covered by one or both of the first insulating layer and the second insulating layer, the laminate including a first coating layer covering the top surface and side surfaces of the laminate and a second coating layer covering the first coating layer and including a ceramic material. [Selection Diagram] Figure 2

Inventors

多賀敏
佐藤直行
西田辰夫

Assignees

東京エレクトロン株式会社

Dates

Publication Date: 20260511
Application Date: 20260216
Priority Date: 20181227

Claims (13)

Base and, An electrostatic chuck is placed on the base, Equipped with, The electrostatic chuck is, A laminate disposed on the base, the laminate having a top surface and side surfaces, the laminate comprising a first insulating layer, a second insulating layer, and an electrode layer disposed between the first insulating layer and the second insulating layer, the electrode layer being covered by one or both of the first insulating layer and the second insulating layer, the laminate and A first covering layer covering the upper surface and the side surface of the laminate, A second coating layer, which covers the first coating layer and contains a ceramic material, Includes, The first insulating layer comprises a ceramic material or a resin material. The aforementioned resin material is selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The second insulating layer comprises a resin material selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The first coating layer has an annular portion surrounding the side surface of the laminate, and the annular portion has a lower surface in contact with the base. The annular portion has a first inclined surface on its lower surface. Board support.
The substrate support according to claim 1, wherein the second coating layer has a second inclined surface that follows the first inclined surface.
The substrate support according to claim 1, wherein the first inclined surface is inclined at an angle of 45 degrees or less with respect to the lower surface.
Base and, An electrostatic chuck is placed on the base, Equipped with, The electrostatic chuck is, A laminate disposed on the base, the laminate having a top surface and side surfaces, the laminate comprising a first insulating layer, a second insulating layer, and an electrode layer disposed between the first insulating layer and the second insulating layer, the electrode layer being covered by one or both of the first insulating layer and the second insulating layer, the laminate and A first covering layer covering the upper surface and the side surface of the laminate, A second coating layer, which covers the first coating layer and contains a ceramic material, Includes, The first insulating layer comprises a ceramic material or a resin material. The aforementioned resin material is selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The second insulating layer comprises a resin material selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The first coating layer has an annular portion surrounding the side surface of the laminate, and the annular portion has a lower surface in contact with the base. The annular portion has a first curved surface on its lower surface. Board support.
The substrate support according to claim 4, wherein the second coating layer has a second curved surface that conforms to the first curved surface.
The substrate support according to any one of claims 1 to 5, wherein the laminate has a first adhesive layer provided between the first insulating layer and the base.
The substrate support according to claim 6, wherein the laminate has a second adhesive layer provided between the second insulating layer and the first coating layer.
Base and, An electrostatic chuck is placed on the base, Equipped with, The electrostatic chuck is, A laminate disposed on the base, the laminate having a top surface and side surfaces, the laminate comprising a first insulating layer, a second insulating layer, and an electrode layer disposed between the first insulating layer and the second insulating layer, the electrode layer being covered by one or both of the first insulating layer and the second insulating layer, the laminate and A first covering layer covering the upper surface and the side surface of the laminate, A second coating layer, which covers the first coating layer and contains a ceramic material, Includes, The first insulating layer comprises a ceramic material or a resin material. The aforementioned resin material is selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The second insulating layer comprises a resin material selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The laminate has a second adhesive layer provided between the second insulating layer and the first coating layer. Board support.
Base and, An electrostatic chuck is placed on the base, Equipped with, The electrostatic chuck is, A laminate disposed on the base, the laminate having a top surface and side surfaces, the laminate comprising a first insulating layer, a second insulating layer, and an electrode layer disposed between the first insulating layer and the second insulating layer, the electrode layer being covered by one or both of the first insulating layer and the second insulating layer, the laminate and A first covering layer covering the upper surface and the side surface of the laminate, A second coating layer, which covers the first coating layer and contains a ceramic material, Includes, The first insulating layer comprises a ceramic material or a resin material. The aforementioned resin material is selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The second insulating layer comprises a resin material selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The first coating layer comprises a substrate and particulate material dispersed in the substrate. At least a portion of the particulate material is in contact with the second insulating layer and the upper surface of the laminate. Board support.
The aforementioned substrate contains a resin or a silane-based agent. The substrate support according to claim 9, wherein the particulate material includes a ceramic material.
Plasma processing chamber and A substrate support is provided, which is located within the plasma processing chamber and includes a base and an electrostatic chuck positioned on the base. The RF power supply electrically connected to the substrate support, Equipped with, The electrostatic chuck is, A laminate disposed on the base, the laminate having a top surface and side surfaces, the laminate comprising a first insulating layer, a second insulating layer, and an electrode layer disposed between the first insulating layer and the second insulating layer, the electrode layer being covered by one or both of the first insulating layer and the second insulating layer, the laminate and A first covering layer covering the upper surface and the side surface of the laminate, A second coating layer, which covers the first coating layer and contains a ceramic material, Includes, The first insulating layer comprises a ceramic material or a resin material. The aforementioned resin material is selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The second insulating layer comprises a resin material selected from the group consisting of polyimide, silicone, epoxy, and acrylic resin. The first coating layer has an annular portion surrounding the side surface of the laminate, and the annular portion has a lower surface in contact with the base. The annular portion has a first inclined surface on its lower surface. Plasma processing equipment.
The plasma processing apparatus according to claim 11, wherein the RF power supply is configured to generate RF power having a frequency of 3 MHz or less.
The plasma processing apparatus according to claim 11, wherein the RF power supply is electrically connected to the base.

Description

The exemplary embodiments of this disclosure relate to a substrate mounting platform and a substrate processing apparatus. A substrate (wafer) placed on a mounting table can be held by an electrostatic chuck. The electrostatic chuck electrostatically attracts the wafer to the mounting table using electrostatic force. The mounting apparatus disclosed in Patent Document 1 comprises a mounting body and an electrostatic chuck. The mounting body is on which the workpiece is placed. The electrostatic chuck comprises an insulating layer and an electrode layer embedded in the insulating layer. In the electrostatic chuck, an electrostatic force is generated between the electrode layer and the workpiece when a voltage is applied to the electrode layer, causing the workpiece to electrostatically attract to the surface of the insulating layer. The electrostatic chuck layer, which is the insulating layer on the surface side of the electrode layer, is a yttrium oxide sprayed layer with a thickness of 200-280 μm formed by plasma spraying. The surface roughness of the electrostatic chuck layer is formed to depend on the particle size of the sprayed yttrium oxide. Japanese Patent Publication No. 2008-117982 This figure shows an example of the configuration of a substrate mounting stand according to an exemplary embodiment.This figure shows an example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows an example of a part of the configuration of the substrate mounting stand shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.These figures 2 to 5 illustrate the methods for forming the coating layers shown in each of them.This figure shows an example of the configuration of a substrate processing apparatus equipped with a substrate mounting platform as shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1.This figure shows another example of the configuration of the end portion of the substrate mounting platform shown in Figure 1. The following describes various exemplary embodiments. In an exemplary embodiment, a substrate mounting stand is provided. The substrate mounting stand comprises a base and an electrostatic chuck provided on the base. The electrostatic chuck comprises a laminated portion, an intermediate layer, and a coating layer. The laminated portion is provided on the base. The intermediate layer is provided on the laminated portion. The coating layer is provided on the intermediate layer. The laminated portion comprises a first layer, an electrode layer, and a second layer. The first layer is provided on the base. The electrode layer is provided on the first layer. The second layer is provided on the electrode layer. The intermediate layer is provided between the second layer and