JP-2026514419-A - Laser heating module, centralized uniform heat dissipation device, laser heating device, and circuit drive box

JP2026514419AJP 2026514419 AJP2026514419 AJP 2026514419AJP-2026514419-A

Abstract

The high-power laser heating module includes a heat dissipation block (1), a drive circuit board (11), a flexible circuit board (12), and a plurality of laser tool components (2). The heat dissipation block (1) has heat conduction bosses (14) formed thereon, the drive circuit board (11) is mounted on the heat dissipation block (1), the flexible circuit board (12) is attached to the heat dissipation block (1), the flexible circuit board (12) has a recess groove (122) formed thereon, and has bent portions (121) extending from the heat dissipation block (1) on both sides, used for electrical connection to the drive circuit board (11). Multiple laser tool components (2) are arranged in an array on the heat conduction bosses (14) of the heat dissipation block (1) and on the flexible circuit board (12). A laser tip (6) is installed inside each laser tool component (2), and the laser tip (6) of the laser tool component (2) is electrically connected to the flexible circuit board (12). The heat conduction bosses (14) are fitted into the fitting grooves (122) of the flexible circuit board (12), and the laser tool components (2) are thermally coupled and connected to the heat dissipation block (1) without going through the flexible circuit board (12). [Selection Diagram] Figure 1

Inventors

肖岩
劉梦雄
王勇
陸升東

Assignees

深▲セン▼市檸檬光子科技有限公司

Dates

Publication Date: 20260511
Application Date: 20240131
Priority Date: 20230327

Claims (20)

It includes a heat dissipation block, a drive circuit board, a flexible circuit board, and multiple laser tool components, Cooling water is installed inside the heat dissipation block, and multiple heat conduction bosses are integrally formed on the upper surface of the heat dissipation block. The drive circuit board is installed on the bottom surface of the heat dissipation block. The flexible circuit board is attached to a heat dissipation block, and the flexible circuit board has a groove through which a heat conduction boss passes. The flexible circuit board has bent portions extending from the heat dissipation block on both sides, and is bent to the bottom surface of the heat dissipation block and electrically connected to the drive circuit board. The plurality of laser tool components are arranged in an array on the heat conduction bosses of the heat dissipation block and on a flexible circuit board, a laser chip is installed inside each laser tool component, the laser chip of each laser tool component is electrically connected to the flexible circuit board, the heat conduction boss is fitted into the fitting groove of the flexible circuit board, and the laser tool components are thermally coupled to the heat dissipation block without going through the flexible circuit board. High-power laser heating module.
The side wall of the heat conduction boss abuts against the side wall of the fitting groove. The high-power laser heating module according to feature 1.
The laser tool component includes a substrate for mounting the laser chip, the substrate being fixedly mounted on a thermal conductive boss. The high-power laser heating module according to feature 1.
A transmission layer is installed between the substrate and the laser chip, and a first pad for electrical connection to a flexible circuit board is fixedly installed on the bottom wall of the substrate. The high-power laser heating module according to feature 3.
The heat conduction boss is aligned with the surface of the flexible circuit board, or is higher than the surface of the flexible circuit board. The high-power laser heating module according to feature 4.
Positioning notches are provided at both ends of the bent portion, and positioning ribs are fixedly installed on the heat dissipation block to engage with the positioning notches. The high-power laser heating module according to feature 1.
A water supply pipe and a water discharge pipe are installed on the heat dissipation block, and the water supply pipe and the water discharge pipe are each connected to a cooling water supply. The high-power laser heating module according to feature 1.
A fin-pin heat dissipation structure is installed in the aforementioned cooling water supply. The high-power laser heating module according to feature 7.
The present invention comprises at least one set of module units, each set of module units comprising a fixed beam and a plurality of the high-power laser heating modules as described in any one of claims 1 to 8, wherein the plurality of laser heating modules are installed along the longitudinal direction of the fixed beam, a mounting block is fixedly installed at the bottom of the heat dissipation block, mounting blocks are installed along both ends of the bent portion of the heat dissipation block in the longitudinal direction, and the mounting blocks are fixedly connected to the fixed beam. Irradiation heating device for surface heating.
The mounting block has a fitting groove, and a fitting block for insertion into the fitting groove is fixedly installed on the fixed beam. The irradiation heating device according to feature 9.
It includes a water supply mechanism, a water discharge mechanism, and at least one multi-channel macrochannel mechanism, The single multi-channel macrochannel mechanism includes one base plate and a plurality of multi-channel macrochannel modules, each of which has one housing chamber, and a plurality of pairs of first water inlets and first water outlets are provided on the base plate, each pair of first water inlets and first water outlets communicating with a housing chamber, and a water channel is provided in the housing chamber such that water flows in from the first water inlets and out from the first water outlets, and the plurality of multi-channel macrochannel modules are distributed symmetrically on the base plate, the orientation of the base plates of the plurality of multi-channel macrochannel mechanisms is the same, and they are in contact with each other side by side. The water supply mechanism and the water discharge mechanism are each used to supply water to and discharge water from the multi-channel macrochannel modules, by communicating with the first water inlet and first water discharge port of a plurality of multi-channel macrochannel modules, respectively. Centralized uniform heat dissipation device.
The first water inlet and first water outlet, which are provided in the bottom plate, are located on both sides of the containment chamber. The centralized uniform heat dissipation device according to feature 11.
The multi-channel macrochannel mechanism further includes a top plate and a plurality of partition plates, the plurality of partition plates mounted vertically on the bottom plate and partitioning a plurality of storage chambers, and the top plate is placed flat on the partition plates and positioned on the side away from the bottom plate of the storage chambers. The centralized uniform heat dissipation device according to feature 11.
Multiple protruding strips are arranged in a row on the top plate, and the protruding strips are located on the surface of the top plate that is separated from the bottom plate. The centralized uniform heat dissipation device according to feature 13.
The water supply mechanism has a first housing, the first housing has two parallel side walls, and on each of the two side walls there are openings for a water inlet and an outlet corresponding to the number of first water inlets, and the outlet communicates with the first water inlet on the bottom plate so that water flows into the water supply mechanism from the water inlet and then further into the multi-channel macrochannel module. The centralized uniform heat dissipation device according to feature 11.
The first housing contains a first water storage chamber and a second water storage chamber arranged side by side, with a communication port between the two water storage chambers. The water supply port communicates with the first water storage chamber, and the second water storage chamber communicates with multiple outlets. The centralized uniform heat dissipation device according to claim 15.
The water discharge mechanism has a second housing, the second housing has two mutually perpendicular side walls, and on each of the two side walls there are openings: a second water outlet and a second water inlet, the same number as the first water outlet. The second water inlet of the water discharge mechanism communicates with the first water outlet of the multi-channel macrochannel module, and the second water outlet discharges water from within the water discharge mechanism. The centralized uniform heat dissipation device according to feature 11.
The second housing contains a third water storage chamber and a fourth water storage chamber arranged side by side, with a connection port between the two water storage chambers. The third water storage chamber communicates with the second water supply port, and the fourth water storage chamber communicates with the second water discharge port. The centralized uniform heat dissipation device according to feature 17.
The number of the aforementioned water discharge mechanisms is at least one pair, and each pair of water discharge mechanisms is distributed symmetrically on both sides of the water supply mechanism. The centralized uniform heat dissipation device according to feature 18.
The aforementioned centralized uniform heat dissipation device further includes a water discharge connection block, the water discharge connection block having a fifth water storage chamber, the water discharge connection block having a drain port and a butt connection port corresponding to the number of water discharge mechanisms, the butt connection port communicating with the second water discharge port and the fifth water storage chamber, and the drain port is used to discharge water from the water discharge connection block. The centralized uniform heat dissipation device according to feature 19.

Description

<Related applications> This application claims priority to the following Chinese patent applications filed on March 27, 2023, application number 2023206365973, titled "High-Power Laser Heating Module and Irradiation Heating Device for Surface Heating"; to the following Chinese patent applications filed on June 1, 2023, application number 2023213849567, titled "Concentrated Uniform Heat Dissipation Device for High-Power Multi-Module Chips"; to the following Chinese patent applications filed on June 26, 2023, application number 2023216379385, titled "Laser Heating Device"; and to the following Chinese patent applications filed on September 11, 2023, application number 2023224690395, titled "Circuit Drive Box and Laser Module," the entire contents of which are incorporated into this application by reference. This application relates to the field of laser application technology, and more particularly to laser heating modules, centralized uniform heat dissipation devices, laser heating devices, and circuit drive boxes. With the development of laser devices such as semiconductor lasers and vertical cavity surface-emitting lasers, the need for heating with high-power lasers is increasing. However, factors such as high power consumption, difficulty in heat dissipation, and large volume are limiting product development, and the industry is urgently seeking integrated and simplified product solutions that take these factors into consideration. The high-power laser heating module includes a heat dissipation block, a drive circuit board, a flexible circuit board, and multiple laser tool components. Cooling water is installed inside the heat dissipation block, and multiple heat conduction bosses are integrally formed on the upper surface of the heat dissipation block. The drive circuit board is installed on the bottom surface of the heat dissipation block. The flexible circuit board is attached to a heat dissipation block, and the flexible circuit board has a groove through which a heat conduction boss passes. The flexible circuit board has bent portions extending from the heat dissipation block on both sides, and is bent to the bottom surface of the heat dissipation block and electrically connected to the drive circuit board. The plurality of laser tool components are arranged in an array on the heat conduction bosses of the heat dissipation block and on the flexible circuit board, a laser chip is installed inside each laser tool component, the laser chip of each laser tool component is electrically connected to the flexible circuit board, the heat conduction boss is fitted into the fitting groove of the flexible circuit board, and the laser tool components are thermally coupled to the heat dissipation block without going through the flexible circuit board. The irradiation heating device for surface heating includes at least one set of module units, each set of module units including a fixed beam and a plurality of high-power laser heating modules as described above. The plurality of laser heating modules are installed along the longitudinal direction of the fixed beam, and mounting blocks are fixedly installed at the bottom of the heat dissipation block. Mounting blocks are installed along both ends of the bent portion of the heat dissipation block in the longitudinal direction, and the mounting blocks are fixedly connected to the fixed beam. The centralized uniform heat dissipation device includes a water supply mechanism, a water discharge mechanism, and at least one multi-channel macrochannel mechanism. The single multi-channel macrochannel mechanism includes one base plate and a plurality of multi-channel macrochannel modules, each of which has one housing chamber, and a plurality of pairs of first water inlets and first water outlets are provided on the base plate, each pair of first water inlets and first water outlets communicating with a housing chamber, and a water channel is provided in the housing chamber such that water flows in from the first water inlets and out from the first water outlets, and the plurality of multi-channel macrochannel modules are distributed symmetrically on the base plate, the orientation of the base plates of the plurality of multi-channel macrochannel mechanisms is the same, and they are in contact with each other side by side. The water supply mechanism and the water discharge mechanism are each used to supply water to the multi-channel macrochannel modules and to discharge water from the multi-channel macrochannel modules, by communicating with the first water inlet and first water outlet of the multi-channel macrochannel modules, respectively. The centralized uniform heat dissipation device for the high-power multi-module chip described in claim 1 is configured such that the first water inlet and first water outlet, which are opened in the bottom plate, are located on both sides of the housing chamber. The laser heating device includes a housing, a laser component, and a heat d