JP-2026514477-A - Integrated testing for improving hybrid bonding yield in advanced semiconductor packaging manufacturing

Abstract

This specification provides a method and apparatus for hybrid bonding with inspection. In some embodiments, the hybrid bonding with inspection method includes: cleaning a substrate in a first cleaning chamber and cleaning a tape frame having a plurality of chiplets in a second cleaning chamber; inspecting the substrate for pre-bonding defects in a first measuring chamber and inspecting the tape frame for pre-bonding defects in a second measuring chamber using a first measuring system; bonding one or more of the plurality of chiplets to the substrate by a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing a post-bonding inspection of the bonded substrate for post-bonding defects using a third measuring chamber with a second measuring system different from the first measuring system. [Selection Diagram] Figure 1

Inventors

• ヴォレティ ヴェンカタカウシク
• タンティウォン カイル
• ヴァエズ－イラヴァニ メフディ

Assignees

• アプライド マテリアルズ インコーポレイテッド

Dates

Publication Date

20260511

Application Date

20240124

Priority Date

20230428

Claims (20)

1. A hybrid bonding method with inspection, The substrate is cleaned using a first cleaning chamber, and the tape frame having multiple chiplets is cleaned using a second cleaning chamber. The first measurement system inspects the substrate for pre-bonding defects in the first measurement chamber and inspects the tape frame for pre-bonding defects in the second measurement chamber. A hybrid bonding process within a bonder chamber is used to bond one or more of the plurality of chiplets to the substrate, thereby forming a bonded substrate. A method comprising performing a post-bonding inspection of the bonded substrates for post-bonding defects using a third measurement chamber with a second measurement system different from the first measurement system.
2. The method according to claim 1, wherein the first measurement chamber, the second measurement chamber, and the third measurement chamber are different chambers.
3. The method according to claim 1, wherein the first measurement chamber, the second measurement chamber, and the third measurement chamber are the same chamber.
4. The method according to claim 1, wherein the method is performed within a single multi-chamber processing tool.
5. The method according to claim 1, wherein the pre-bonding defect includes particles, cracks, or chips larger than a threshold within the substrate or tape frame, and the post-bonding defect includes voids, poor alignment, or delamination.
6. The method according to claim 1, further comprising performing a second cleaning process before bonding if a pre-bonding defect is found on the substrate or the tape frame.
7. The method according to any one of claims 1 to 6, further comprising adjusting the parameters of the bonder chamber using data from the post-bonding inspection in response to the detection of a post-bonding defect on the substrate or the tape frame.
8. The method according to any one of claims 1 to 6, wherein the first measurement system and the second measurement system are optical imaging systems comprising one or more microscopes.
9. The method according to any one of claims 1 to 6, wherein the first measurement system or the second measurement system is configured to acquire weight-based measurements, electric field measurements, radiation measurements, or ultrasonic measurements.
10. A non-temporary computer-readable medium having instructions stored thereon, wherein when the instructions are executed by one or more processors, the method according to any one of claims 1 to 6 is performed.
11. The non-temporary computer-readable medium according to claim 10, further comprising adjusting the parameters of the bonder chamber using data from the post-bonding inspection in response to the detection of a post-bonding defect on the substrate or the tape frame.
12. The non-temporary computer-readable medium according to claim 10, wherein the first measurement system and the second measurement system are optical imaging systems comprising one or more microscopes.
13. The non-temporary computer-readable medium according to claim 10, wherein the first measurement system or the second measurement system is configured to acquire weight-based measurements, electric field measurements, radiation measurements, or ultrasonic measurements.
14. The pre-bonding defect includes particles, cracks, or chips larger than a threshold within the substrate or tape frame, and the post-bonding defect includes voids, poor alignment, or delamination. If a pre-bonding defect is found on the substrate or the tape frame, a second cleaning process is performed. The non-temporary computer-readable medium according to claim 10, further comprising adjusting the parameters of the bonder chamber using machine learning techniques and data from the post-bonding inspection if a post-bonding defect is found on the substrate or the tape frame.
15. A multi-chamber processing tool for bonding chiplets to a substrate, An equipment front-end module (EFEM) having one or more substrate load ports for receiving the substrate and one or more tape frame load ports for receiving a tape frame having multiple chiplets, A plurality of automation modules, each having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules includes a transfer chamber and one or more process chambers coupled to the transfer chamber, the one or more process chambers include a bonder chamber, the transfer chamber includes a buffer configured to hold one or more of the substrates and one or more tape frames, and the transfer chamber includes a transfer robot configured to transfer the substrates and tape frames between the buffer, the one or more process chambers, and a buffer located in an adjacent automation module among the plurality of automation modules, A first measurement system coupled to one of the plurality of automation modules, configured to acquire measurement values of the substrate in a first measurement chamber and acquire measurement values of the tape frame in a second measurement chamber, A multi-chamber processing tool comprising a second measurement system coupled to one of the aforementioned plurality of automation modules, the second measurement system configured to acquire measurement values of a coupled substrate in a third measurement chamber.
16. The multi-chamber processing tool according to claim 15, wherein the first measurement chamber is directly coupled to one of the transfer chambers, and the second measurement chamber is directly coupled to another of the transfer chambers.
17. The multi-chamber processing tool according to claim 15, wherein the first measurement chamber is directly coupled to the bonder chamber.
18. The multi-chamber processing tool according to claim 15, wherein the first measurement system includes an infrared microscope, and the second measurement system includes an optical microscope or an ultraviolet microscope.
19. The multi-chamber processing tool according to any one of claims 15 to 18, wherein the first measurement system is configured to acquire weight-based measurements, electric field measurements, radiation measurements, or ultrasonic measurements.
20. The multi-chamber processing tool according to any one of claims 15 to 18, wherein the second measurement chamber is different from the first measurement chamber.

Description

The embodiments of this disclosure generally relate to substrate processing equipment. Substrates undergo various processes during the manufacturing of semiconductor integrated circuit devices. Some of these processes include wafer dicing, where a processed wafer is placed on a dicing tape and cut or separated into multiple dies or chiplets. After dicing the wafer, the chiplets typically remain on the dicing tape until they are extracted and bonded to the substrate, for example, by a hybrid bonding process. Hybrid bonding generally involves stacking one or more dies onto the substrate and electrically connecting them. However, pre-bonding defects such as cracked or chipped dies or microparticles on the bonding surface can lead to post-bonding problems. Furthermore, defects found after bonding, such as poor alignment, voids, or delamination, can negatively impact yield and may require increased tool downtime for identifying and servicing the tools used in the hybrid bonding process. Therefore, the inventors of this invention have provided an improved multi-chamber processing tool for processing substrates using hybrid bonding technology. This specification provides a method and apparatus for hybrid bonding with inspection. In some embodiments, the hybrid bonding with inspection method includes: cleaning a substrate in a first cleaning chamber and cleaning a tape frame having a plurality of chiplets in a second cleaning chamber; inspecting the substrate for pre-bonding defects in a first measuring chamber and inspecting the tape frame for pre-bonding defects in a second measuring chamber using a first measuring system; bonding one or more of the plurality of chiplets to the substrate by a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing a post-bonding inspection of the bonded substrate for post-bonding defects using a third measuring chamber with a second measuring system different from the first measuring system. In some embodiments, a non-temporary computer-readable medium has instructions stored thereon, and when the instructions are executed by one or more processors, a hybrid bonding method with inspection is performed, the method comprising: cleaning a substrate by a first cleaning chamber and cleaning a tape frame having a plurality of chiplets by a second cleaning chamber; inspecting the substrate for pre-bonding defects in the first measuring chamber and inspecting the tape frame for pre-bonding defects in the second measuring chamber by a first measurement system; bonding one or more of the plurality of chiplets to the substrate by a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing a post-bonding inspection of the bonded substrate for post-bonding defects by a third measuring chamber using a second measuring system different from the first measuring system. In some embodiments, a multi-chamber processing tool for bonding chiplets to a substrate comprises an equipment front end module (EFEM) having one or more substrate load ports for receiving substrates and one or more tape frame load ports for receiving tape frames having multiple chiplets, and a plurality of automation modules having a first automation module coupled to the FI, each of the plurality of automation modules comprising a transfer chamber and one or more process chambers coupled to the transfer chamber, one or more process chambers comprising a bonder chamber, the transfer chamber comprising a buffer configured to hold one or more substrates and one or more tape frames, and the transfer chamber comprising a transfer robot configured to transfer the substrates and tape frames between the buffer, one or more process chambers and buffers located in adjacent automation modules of the plurality of automation modules, and a plurality of automation modules. The system includes a first measurement chamber coupled to one of a plurality of automation modules, the first measurement chamber comprising a first measurement system configured to acquire measurement values of a substrate and a motion system configured to position the first measurement system over various parts of the substrate, and a second measurement chamber coupled to one of a plurality of automation modules, the second measurement chamber comprising a second measurement system different from the first measurement system, configured to acquire measurement values of a substrate, and a second motion system configured to position the second measurement system over various parts of the substrate. Other embodiments and additional embodiments of this disclosure are described below. The embodiments of this disclosure, briefly outlined above and discussed in more detail later, can be understood by referring to the exemplary embodiments of this disclosure shown in the accompanying drawings. However, the accompanying drawings only illustrate typical embodiments of this disclosure and should not be considered limiting,