JP-3255744-U - Secondary injection molded rubber coated IC tray

JP3255744UJP 3255744 UJP3255744 UJP 3255744UJP-3255744-U

Abstract

[Problem] To provide a secondary injection-molded rubber-coated IC tray for use in the field of electronic component packaging equipment. [Solution] The secondary injection-molded rubber-coated IC tray includes a receiving base 1 and a soft rubber portion 2. The soft rubber portion is fixed above the receiving base by secondary injection molding and is used to receive electronic products. A housing portion 11 is formed as a recess in the receiving base, and the soft rubber portion is located within the housing portion. The secondary injection molding process forms an integrated structure between the soft rubber portion and the receiving base, causing molecular-level fusion at the bonding interface between the soft rubber portion and the receiving base, significantly improving the bonding strength. The strip-shaped pad layer 21 and limiting protrusions 22 of the soft rubber portion work together to form an elastic support system. The horizontal pad layer can absorb lateral impact energy, the vertical limiting protrusions can suppress displacement of the electronic product, and the soft rubber assemblies provided at the corners form a three-dimensional buffer network. [Selection Diagram] Figure 1

Inventors

董慶春
周振路

Assignees

江蘇智舜電子科技有限公司

Dates

Publication Date: 20260507
Application Date: 20260305
Priority Date: 20250310

Claims (7)

A secondary injection molded rubber-coated IC tray including a receiving base, It further includes a soft rubber part and multiple housing parts, The aforementioned receiving section is formed by a recess on the top surface of the receiving base, and the soft rubber portion is fixed inside the receiving section by secondary injection molding, and is used to receive electronic products, characterized in that it is a secondary injection molded rubber-coated IC tray.
The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that the soft rubber portion includes four sets of corner cushioning assemblies, each set of cushioning assemblies includes two strip-shaped pad layers perpendicular to each other, and each pad layer has a restricting projection on its outer circumference that adheres tightly to the pad layers.
The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that a partition is provided on the receiving base, the receiving base is divided into different storage sections by the partition, and each storage section is used to receive one electronic product.
The secondary injection-molded rubber-coated IC tray according to claim 3, characterized in that a recess for stress relief is provided at the end of the partition portion.
The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that a misinsertion prevention groove is provided on the side wall of the housing portion, this misinsertion prevention groove is located on one side in the longitudinal direction of the housing portion, and its opening direction is aligned with the mounting direction of the electronic product.
The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that side lugs are provided at both ends in the longitudinal direction of the receiving base, a label area is provided on the surface of the side lugs, and the label area is a planar area formed by a recess in the surface of the side lug.
The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that a plurality of through grooves are provided within the housing portion, and the arrangement of the through grooves is either a circumferential arrangement or an array arrangement.

Description

This invention relates to the technical field of electronic component packaging equipment, and more specifically to a secondary injection-molded rubber-coated IC tray. As electronic components become smaller and more highly integrated, the demands for protection during the transportation, storage, and assembly processes of precision electronic components are becoming increasingly stringent. Conventional electronic component trays are mostly made of rigid plastic using a single injection molding process, and their groove structure is used to secure and receive components. However, such trays lack effective cushioning mechanisms against vibrations during transportation and accidental drops, making them susceptible to fracture of solder joints and deformation of leads. In particular, in the field of precision devices such as 5G communication modules and microsensors, potential damage due to impact is one of the main causes of reduced product yield. The industry is strongly demanding the development of new protective carriers that combine structural strength with dynamic cushioning performance. Existing improvement methods primarily focus on two areas: material composites and structural optimization. Method 1 involves adding independent rubber pads to a rigid receiving base and achieving localized cushioning through an adhesive process; however, this method is susceptible to interfacial delamination due to adhesive degradation. Method 2 employs a honeycomb-like vibration damping structure, dispersing impact forces by creating a hollow lattice within the receiving base; however, this reduces the overall bending rigidity of the tray by more than 40%. These methods universally suffer from shortcomings such as insufficient bonding strength between the cushioning unit and the base, a single dimension of vibration damping, and low functional integration, making it difficult to meet the protection requirements for all aspects of precision electronic components. This is a schematic diagram of the overall structure of the secondary injection-molded rubber-coated IC tray of the present invention.This is a schematic cross-sectional view of the secondary injection-molded rubber-coated IC tray of the present invention. The present invention will be described in further detail below with reference to the attached drawings and embodiments. Referring to Figure 1, the secondary injection-molded rubber-coated IC tray includes a receiving base 1 and a soft rubber portion 2. The soft rubber portion 2 is integrated with the receiving base 1 by the secondary injection molding process and is fixed above the receiving base 1, used to receive electronic products. The elastic cushioning properties of the soft rubber portion 2 effectively absorb the impact energy received by the bottom of the electronic product, preventing damage to electronic components due to vibration or dropping. In one embodiment, the receiving base is made of a hard plastic material, and the soft rubber portion is made of TPE or TPU material; in other embodiments, the soft rubber portion may be made of rubber or other soft rubber material. Referring to Figure 1, a concave storage section 11 is formed on the receiving base 1 and is used to restrict the placement of electronic products. In one embodiment, a partition section 12 is provided in the center of the receiving base 1, dividing the storage section 11 into two symmetrically arranged independent receiving areas, allowing the tray to stably support two electronic products simultaneously and improving space utilization. Multiple through grooves 111 are provided within the storage section 11, optimizing the material distribution of the receiving base 1. This reduces the overall weight while ensuring structural strength, thereby lowering material costs and transportation energy consumption. Referring to Figure 2, there are two embodiments for the arrangement of the through grooves 111. Embodiment 1 is a circumferential arrangement, where the through grooves 111 are distributed at equal intervals along the inner wall of the housing section 11, forming a continuous lightweight structure. Embodiment 2 is an array arrangement, where the outermost layer of through grooves 111 maintains equal spacing with the inner wall of the housing section 11, ensuring the structural integrity of the edge of the receiving base 1. Both arrangements achieve a balance between weight reduction and structural rigidity through a rational groove design. A U-shaped misinsertion prevention groove 112 is provided on the side wall of the housing section 11, and its opening direction is aligned with the specific structure of the electronic product, guiding the electronic product to the only correct placement direction through physical constraints and completely preventing misoperation such as reverse insertion. A recess 13 is provided at the end of the partition section 12, releasing internal stress on the receiving base 1 through a localized st