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JP-7854649-B2 - Thermosetting resin compositions, adhesives, cured products, and joints

JP7854649B2JP 7854649 B2JP7854649 B2JP 7854649B2JP-7854649-B2

Inventors

  • 金 津
  • 續 貴徳
  • 山口 敦史

Assignees

  • パナソニックＩＰマネジメント株式会社

Dates

Publication Date
20260507
Application Date
20220603

Claims (7)

  1. The material contains an epoxy resin (A), a curing agent (B), a first elastomer (C) comprising at least one of polyrotaxane and block copolymer, and a component ( D) which is different from the polyrotaxane and block copolymer contained in the first elastomer (C) and comprises a siloxane oligomer. The proportion of the epoxy resin (A) is 13% by mass or more and 55% by mass or less. The proportion of the curing agent (B) is 20% by mass or more and 55% by mass or less. The proportion of the first elastomer (C) is 10% by mass or more and 20% by mass or less. A thermosetting resin composition in which the proportion of the aforementioned component ( D) is greater than 5% by mass and less than or equal to 25% by mass.
  2. The thermosetting resin composition according to claim 1, further comprising a flexible epoxy resin as a second elastomer (E).
  3. The thermosetting resin composition according to claim 1, wherein the curing agent (B) comprises a manifest curing agent (B1) and a latent curing agent (B2).
  4. The thermosetting resin composition according to claim 1, wherein the viscosity measured using an E-type rotational viscometer at 25°C and 1 rpm is less than 30 Pa·s, and the elastic modulus of the cured product is less than 1.5 GPa.
  5. An adhesive comprising the thermosetting resin composition described in any one of claims 1 to 4.
  6. A cured product of the thermosetting resin composition according to any one of claims 1 to 4.
  7. The device comprises a first member, a second member, and a bonding layer interposed between the first member and the second member to join the first member and the second member, The bonding layer comprises a bonded body containing the cured product described in claim 6.

Description

This disclosure relates to thermosetting resin compositions, adhesives, cured products, and joints, and more specifically, to thermosetting resin compositions useful as adhesives and sealing materials, adhesives made from this thermosetting resin composition, cured products of this thermosetting resin composition, and joints containing this cured product. Thermosetting resin compositions used in adhesives and sealing materials require low viscosity so that the cured product obtained after thermosetting exhibits excellent adhesion to the substrate and good applicability. As such a thermosetting resin composition, Patent Document 1 discloses a curing agent composition containing calix(n+m+1)arene and an epoxy resin curing agent with a boiling point of 100°C or higher. Japanese Patent Publication No. 2002-284861 1. Overview The thermosetting resin composition according to this embodiment (hereinafter also referred to as composition (X)) contains an epoxy resin (A), a curing agent (B), a first elastomer (C) containing at least one of a polyrotaxane and a block copolymer, and a component (D) containing a siloxane oligomer. The proportion of epoxy resin (A) is 13% by mass or more and 55% by mass or less. The proportion of curing agent (B) is 20% by mass or more and 55% by mass or less. The proportion of first elastomer (C) is 10% by mass or more and 20% by mass or less. The proportion of component ( D) is more than 5% by mass and 25% by mass or less. As a result of diligent research to solve the above-mentioned problems, the inventors have found that by adding an elastomer to an epoxy resin (A) and a curing agent (B) in a thermosetting resin composition, and by selecting and using in combination a first elastomer (C) containing at least one of polyrotaxane and block copolymer and a component (D) containing a siloxane oligomer, and further by setting the mass ratio of components (A) to (D) to the entire composition (X) within the aforementioned range, it is possible to maintain low viscosity while achieving excellent adhesion, low elasticity, and impact resistance of the cured product, thus completing this disclosure. The composition (X) according to this embodiment exhibits excellent adhesion, low elasticity, and impact reliability of the cured product, and has low viscosity. The reason why composition (X) achieves the above effects by having the above configuration is not entirely clear, but it can be inferred, for example, as follows. That is, by using a first elastomer (C) which tends to have a relatively high viscosity due to containing at least one of polyrotaxane and block copolymer as the elastomer, and a component (D) which tends to have a relatively low viscosity due to containing a siloxane oligomer, and by setting the proportions of components (A) to (D) within the above range, composition (X) can maintain low viscosity while forming a smaller sea-island structure in the phase separation structure formed by curing. As a result, it is thought that the cured product can improve both low elasticity and impact reliability while maintaining adhesion. 2. Details <Thermosetting resin composition> The composition (X) according to this embodiment contains the components (A) to (D) described above. In addition to these, composition (X) may also contain a flexible epoxy resin as a second elastomer (E). Furthermore, it may contain components other than those described above, to the extent that it does not impair the effects of the disclosure. The following describes each component. [Epoxy resin (A)] The epoxy resin (A) is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule. Specific examples of epoxy resin (A) include, for example, bisphenol-type epoxy resins such as biphenyl-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, and bisphenol S-type epoxy resin; hydrogenated bisphenol-type epoxy resins such as hydrogenated bisphenol A-type epoxy resin, hydrogenated bisphenol F-type epoxy resin, and hydrogenated bisphenol S-type epoxy resin; naphthalene ring-containing epoxy resin, anthracene ring-containing epoxy resin, alicyclic epoxy resin, dicyclopentadiene-type epoxy resin, phenol novolac-type epoxy resin, cresol novolac-type epoxy resin, triphenylmethane-type epoxy resin, brome-containing epoxy resin, aliphatic epoxy resin, aliphatic polyether-type epoxy resin, triglycidyl isocyanurate, glycidyl group-containing silicone resin, and glycidylamine-type epoxy resin. Composition (X) may contain one or more of these selected as epoxy resin (A). The epoxy resin (A) is preferably liquid at 25°C. In this case, the viscosity of composition (X) can be lowered, thereby improving its applicability. Furthermore, the epoxy resin (A) and components (B) to (D) become easier to mix, allowing for the preparation of a more uniform composition (X). The epoxy resin (A) preferably contains a bisphenol-type epoxy resin, and more preferably contains at least on