JP-7854709-B2 - Resin encapsulation apparatus and resin encapsulation method

Inventors

• 田上 秀作
• 柳澤 誠

Assignees

• ヤマハロボティクス株式会社

Dates

Publication Date

20260507

Application Date

20220531

Claims (5)

1. A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, A resin encapsulation mold for molding a resin material onto the workpiece to resin-encapsulate the electronic component, A workpiece housing section capable of accommodating at least one of the aforementioned workpieces, A transport line for transporting the workpiece supplied from the workpiece storage unit to the resin sealing mold, A measuring unit is provided in the workpiece storage section for measuring the weight of the workpiece, A resin encapsulation device equipped with the following features.
2. The resin sealing apparatus according to claim 1, further comprising a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis, based on the weight of the workpiece obtained by the measurement unit.
3. The measuring unit is provided in the workpiece storage section. The resin sealing apparatus according to claim 1, wherein the measuring unit measures the weight of the workpiece based on the difference in weight of the workpiece storage unit before and after the workpiece is removed from the workpiece storage unit.
4. A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, A resin encapsulation mold for molding a resin material onto the workpiece to resin-encapsulate the electronic component, A transport line for transporting the workpiece to the resin sealing mold, A workpiece housing section capable of accommodating at least one of the aforementioned workpieces, A work support section is provided between the work storage section and the transport line, and supports the work, A pickup device that holds the workpiece supplied from the workpiece storage section onto the workpiece support section and transports it to the transport line, The pickup device is provided with a measuring unit for measuring the weight of the workpiece, A resin encapsulation device equipped with the following features.
5. A resin sealing method for a workpiece including a substrate and electronic components, wherein the electronic components are sealed in resin, (a) A step of supplying a workpiece from a workpiece housing section capable of accommodating at least one workpiece onto a workpiece support section, (b) A step of transporting the workpiece supplied from the workpiece storage unit onto the workpiece support unit to a transport line using a pickup device, (c) A step of transporting the workpiece to a resin sealing mold via the transport line, (d) A step of resin-encapsulating the electronic component by molding a resin material onto the workpiece using the resin-encapsulating mold, Includes, The resin sealing method, wherein (a) or (b) above includes the step of calculating the weight of the workpiece using a measuring unit provided in at least one of the workpiece storage unit or the pickup device.

Description

This invention relates to a resin encapsulation apparatus and a resin encapsulation method. As an example of a resin encapsulation apparatus that melts resin onto a workpiece containing a substrate and electronic components to encapsulate the electronic components, a resin encapsulation apparatus that molds resin onto the workpiece is known. When encapsulating electronic components with resin, by calculating and supplying the amount of resin per workpiece, uniform resin encapsulation can be achieved without waste. Patent Document 1 discloses a technique for resin sealing a workpiece by calculating the amount of resin to be dispensed onto the workpiece based on its appearance information in advance. Specifically, defect information of the workpiece supplied onto a support rail is acquired by a camera, and based on this, the target resin discharge weight is calculated and the resin is dispensed onto the workpiece by a dispenser. Furthermore, the discharged resin weight is calculated from the difference in weight measured before and after resin discharge, and this information, comparing the target discharged resin weight with the discharged resin weight, is used to correct the resin discharge for the next workpiece. Japanese Patent Publication No. 2003-165133 This is a plan view of a resin encapsulation apparatus according to one embodiment of the present invention.This figure shows an example of a cross-section of the workpiece storage section 11 before the workpiece W is removed from the workpiece magazine WM of the resin sealing device 1 according to the first embodiment.This figure shows an example of a cross-section of the workpiece storage section 11 after the workpiece W has been removed from the workpiece magazine WM of the resin sealing device 1 according to the first embodiment.This is a flowchart showing a resin sealing method in a resin sealing apparatus according to the first embodiment.This figure shows an example of a cross-section of the workpiece transfer section 13 before the pickup device 14 of the resin sealing device 1 according to the second embodiment acquires the workpiece W on the workpiece support section WS.This figure shows an example of a cross-section of the workpiece transfer section 13 when the pickup device 14 of the resin sealing device 1 according to the second embodiment acquires a workpiece W on the workpiece support section WS.This figure shows an example of a cross-section of the workpiece transfer section 13 in which the pickup device 14 of the resin sealing device 1 according to the second embodiment acquires and holds the workpiece W from the workpiece support section WS.This figure shows an example of a cross-section of the workpiece transfer section 13 before the pickup device 14 of the resin sealing device 1 according to the third embodiment acquires the workpiece W on the workpiece support section WS.This figure shows an example of a cross-section of the workpiece transfer section 13 when the pickup device 14 of the resin sealing device 1 according to the third embodiment acquires a workpiece W on the workpiece support section WS.This figure shows an example of a cross-section of the workpiece transfer section 13 in which the pickup device 14 of the resin sealing device 1 according to the third embodiment acquires and holds the workpiece W from the workpiece support section WS. The embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of the parts are schematic; therefore, the technical scope of the present invention should not be limited to these embodiments. <First Embodiment> The configuration of the resin encapsulation apparatus 1 according to one embodiment of the present invention will be described with reference to Figures 1, 2A, and 2B. Figure 1 is a plan view of the resin encapsulation apparatus according to one embodiment of the present invention. Figures 2A and 2B are diagrams showing an example of a configuration for measuring the weight of a workpiece W in the resin encapsulation apparatus 1 according to the first embodiment. Figure 2A is a diagram showing an example of a cross-section of the workpiece storage section 11 before the workpiece W is removed from the workpiece magazine WM of the resin encapsulation apparatus 1 according to the first embodiment. Figure 2B is a diagram showing an example of a cross-section of the workpiece storage section 11 after the workpiece W has been removed from the workpiece magazine WM of the resin encapsulation apparatus 1 according to the first embodiment. In the first embodiment, the measuring unit MP1 is provided in the workpiece storage section 11. Note that each drawing is conveniently labeled with directions (front, back, left, right, up, down) to clarify the relationships between each drawing and to help understand the positional relationships of each component. The resin encapsulation appara