JP-7854770-B2 - Parameter correction device, parameter correction method, and computer program

Inventors

• 木村 崇也
• 岡本 悟史
• 安陪 裕滋
• 田中 樹
• 佐藤 祐太
• 實井 祐介

Assignees

• 株式会社ＳＣＲＥＥＮホールディングス

Dates

Publication Date

20260507

Application Date

20240322

Claims (5)

1. A parameter correction device that corrects parameters for controlling a coating apparatus so that the discharge characteristics measured when a processing liquid is discharged from a nozzle become the target discharge characteristics, A regression model construction unit constructs a regression model that uses training data, which takes as input the feature difference, which is the difference between the feature quantity of the reference discharge characteristic measured by discharge using a reference parameter and the feature quantity of the discharge characteristic measured by discharge using peripheral parameters in which some values of the reference parameter are changed, and outputs the parameter difference, which is the difference between the reference parameter and the peripheral parameter, to output a correction amount for correcting the reference parameter from the feature difference. A correction unit inputs the difference between the feature quantity of the reference discharge characteristic and the feature quantity of the discharge characteristic measured by discharge using the reference parameter after the time the reference discharge characteristic was measured into the regression model, and corrects the reference parameter according to the correction amount output from the regression model. A parameter correction device equipped with the following features.
2. A parameter correction device according to claim 1, An abnormality determination unit that determines whether or not the discharge characteristics are abnormal. Furthermore, The correction unit is a parameter correction device that corrects the reference parameters when the determination unit determines that the discharge characteristics are abnormal.
3. A parameter correction device according to claim 1 or claim 2, The discharge characteristics are the discharge pressure applied to the processing liquid, and this is a parameter correction device.
4. A parameter correction method for correcting parameters for controlling a coating apparatus so that the discharge characteristics measured when the processing liquid is discharged become the target discharge characteristics, The process involves constructing a regression model that outputs a correction amount for correcting the reference parameter from the feature difference, using training data that takes as input the feature difference, which is the difference between the feature quantity of the reference discharge characteristic measured by discharge using a reference parameter and the feature quantity of the discharge characteristic measured by discharge using peripheral parameters in which some values of the reference parameter are changed, and outputs the parameter difference, which is the difference between the reference parameter and the peripheral parameter. The process involves inputting the difference between the feature quantities of the reference discharge characteristics and the feature quantities of the discharge characteristics measured by discharge using the reference parameters after the time the reference discharge characteristics were measured into the regression model, and correcting the reference parameters according to the correction amount output from the regression model. A parameter correction method, including the following.
5. It is a computer program, A computer program that causes the computer to execute the parameter correction method described in claim 4.

Description

The subject matter disclosed herein relates to parameter correction devices, parameter correction methods, and computer programs. In the manufacturing process of flat panel displays, a device called a coater is used. A coater is a substrate processing device that uses a pump to discharge a processing liquid from a slit nozzle, coating the entire substrate being transported with the processing liquid. In recent years, with the increasing demand for higher product quality, such coaters are required to apply the processing liquid so that the film thickness is uniform across the entire substrate. For example, Patent Document 1 describes how the parameters for controlling the pump are adjusted and optimized by repeatedly measuring the discharge characteristics when the processing liquid is discharged. In other words, the optimization process described in Patent Document 1 includes a simulated dispensing process in which the processing liquid is dispensed to a surface other than the substrate, a dispensing characteristic measurement process in which the dispensing characteristics of the processing liquid in the simulated dispensing process are measured, a state quantity derivation process in which the deviation of the measured dispensing characteristics from the target characteristics is derived, and a learning process in which a learning model is constructed by machine learning the changes in the state quantity due to parameter changes. While the state quantity exceeds a predetermined tolerance range, the parameters are changed based on the learning model, and the simulated dispensing process, dispensing characteristic measurement process, state quantity derivation process, and learning process are repeatedly executed. When the state quantity enters the tolerance range, the last changed parameters are set as the parameters for dispensing the processing liquid in the processing liquid supply process. Japanese Patent Publication No. 2020-040046 This diagram schematically shows the overall configuration of the coating apparatus according to the embodiment.This figure shows the configuration of the processing liquid supply mechanism included in the coating apparatus shown in Figure 1.Figure 2 is a graph showing an example of the movement pattern of the operating disk in the pump.This is a block diagram showing an example of the configuration of a control unit.This figure shows an example of a discharge pressure waveform.This is a diagram illustrating an example of a feature.This is a diagram to illustrate other examples of features.This diagram shows the flow of the regression model construction process by the control unit.This diagram shows the flow of the correction process for reference parameters performed by the control unit.This is a block diagram that conceptually illustrates the functions of the control unit. The embodiments of the present invention will be described below with reference to the attached drawings. Note that the components described in these embodiments are merely illustrative and are not intended to limit the scope of the present invention to them alone. In the drawings, for ease of understanding, the dimensions and number of parts may be exaggerated or simplified as needed. <1. Embodiments> Figure 1 is a schematic diagram showing the overall configuration of a coating apparatus 1 according to an embodiment. The coating apparatus 1 is a substrate processing apparatus that coats a processing liquid onto the upper surface Sf of a substrate S. The coating apparatus 1 also functions as a discharge characteristic monitoring device that monitors the discharge characteristics of the processing liquid. Specifically, the discharge characteristics are physical quantities related to discharge, such as discharge pressure and discharge flow rate. In the following description, the case where the discharge characteristic is discharge pressure will be explained. The substrate S is, for example, a glass substrate for a liquid crystal display device. The substrate S may also be various types of substrates for electronic devices, such as semiconductor wafers, photomask glass substrates, plasma display glass substrates, magnetic/optical disk glass or ceramic substrates, organic EL glass substrates, solar cell glass or silicon substrates, other flexible substrates, and printed circuit boards. The coating apparatus 1 is, for example, a slit coater. In Figure 1, an XYZ coordinate system is defined to explain the arrangement of each element of the coating apparatus 1. The transport direction of the substrate S is the "X direction". In the X direction, the direction in which the substrate S moves (downstream in the transport direction) is the +X direction, and the opposite direction (upstream in the transport direction) is the -X direction. Furthermore, the direction perpendicular to the X direction is the Y direction, and the direction perpendicular to both the X and Y directions is the Z direction. In the following