JP-7854779-B2 - Window manufacturing method

JP7854779B2JP 7854779 B2JP7854779 B2JP 7854779B2JP-7854779-B2

Inventors

金柔利
徐佑昔
金敏基
金柄範
李會官

Assignees

三星ディスプレイ株式會社

Dates

Publication Date: 20260507
Application Date: 20201204
Priority Date: 20191210

Claims (9)

The steps include providing an initial window having a first compressive stress value, The process includes a cleaning step of cleaning the initial window to provide a window having a second compressive stress value, The aforementioned cleaning step is The pickling step involves pickling the initial window, The process includes an alkaline cleaning step of alkaline cleaning the acid-pickled initial window, The absolute value of the difference between the first compressive stress value and the second compressive stress value satisfies ΔCS in the following equation 3-1a. A window manufacturing method characterized in that the cleaning step is a step in which the ΔCS in the following formula 3-1a is controlled to be 120 or less. [Formula 3-1a] ΔCS (MPa) = 2T (℃) + 4t (min) - 108 In formula 3-1a, T is the temperature of the pickling step, t is the holding time of the pickling step, and the words in parentheses represent the following units of the corresponding parameters. The unit of ΔCS is megapascal (MPa), the unit of T is Celsius (°C), and the unit of t is minutes (min). The holding time t in the pickling step is 1 minute or more and less than 20 minutes. The temperature T of the pickling step is 50°C or higher and 65°C or lower.
The difference between the first compressive stress value and the second compressive stress value is proportional to the amount of cleaning in the cleaning step. The window manufacturing method according to claim 1, characterized in that the cleaning amount is the amount of the initial window removed per unit area from the surface of the initial window.
The window manufacturing method according to claim 2 , characterized in that the amount of washing satisfies the following formula 6-1a . [Formula 6-1 a ] L AB (mg/cm 2 ) = 0.01T (°C) + 0.02t (min) -0.583 In formula 6-1a, L AB is the washing amount, and mg/cm² ( milligrams/square centimeter) in parentheses represents the unit of L AB .
The washing amount is the sum of the first washing amount in the pickling step and the second washing amount in the alkaline washing step. The first washing amount is 30 wt% or more and 40 wt% or less based on the total weight of the washing amount. The window manufacturing method according to claim 2 , characterized in that the second washing amount is twice the first washing amount.
The step of providing the initial window is, The steps include providing the base glass, The step of strengthening the provided base glass, The window manufacturing method according to claim 1, characterized in that the base glass is LAS (Lithium Aluminum-Silicate) glass or NAS (Sodium Aluminum-Silicate) glass.
The window manufacturing method according to claim 5 , characterized in that the step of strengthening the base glass is a step of chemical strengthening with a strengthening molten salt containing at least one of KNO3 and NaNO3 .
The window manufacturing method according to claim 6 , characterized in that the step of strengthening the base glass is performed at a temperature of 350°C or higher and 450°C or lower.
The window manufacturing method according to claim 1 , characterized in that the pickling step is to provide a pickling solution containing at least one of nitric acid ( HNO₃ ), sulfuric acid ( H₂SO₄ ), and hydrochloric acid (HCl).
The window manufacturing method according to claim 1, characterized in that the alkaline cleaning step is a step of providing an alkaline cleaning solution containing at least one of sodium hydroxide (NaOH) and potassium hydroxide (KOH).

Description

This invention relates to a window manufacturing method, and more particularly to a window manufacturing method including a cleaning step. The electronic device includes a window, a housing, and electronic elements. The electronic device includes various elements activated by electrical signals, such as display elements, touch elements, or detection elements. The window protects the electronic component and provides the user with an active area. Through this, the user can provide input to the electronic component or receive information generated by the electronic component via the window. Furthermore, the electronic component is reliably protected from external shocks through the window. Recently, the trend towards slimmer electronic components has led to a demand for lighter and thinner windows. To compensate for the resulting structural weakness, research is being conducted on window manufacturing methods that possess excellent strength and surface durability. Korean Published Patent No. 10-2018-0055711 This is a perspective view of an electronic device according to one embodiment.Figure 1 is an exploded perspective view of the electronic device shown.This is a perspective view showing a window according to one embodiment.This is a cross-sectional view showing a window according to one embodiment.This is a flowchart illustrating a simplified window manufacturing method according to one embodiment.This is a flowchart illustrating a simplified window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This is a schematic cross-sectional view illustrating the steps of a window manufacturing method according to one embodiment.This graph shows the change in the amount of washing in relation to the process temperature during the pickling step.This graph shows the change in the amount of cleaning in relation to the process temperature during the alkaline cleaning step.This graph shows the relationship between the amount of cleaning and the change in compressive stress value.This graph compares the window intensity before and after the cleaning step.This graph compares the window's breakage strength before and after the cleaning step.This graph shows the impact strength of the window in relation to the change in compressive stress value.This graph shows the change in compressive stress value with increasing pickling time at each pickling temperature.This graph shows the change in compressive stress value with respect to the process holding time during the pickling step.This graph shows the results of measuring the change in compressive stress value with respect to the process holding time during the pickling step under specific temperature conditions, along with the corresponding relationship.This graph shows the results of measuring compressive stress values in response to changes in process temperature during the pickling step, and the relationship between these values and the amount of change.This graph shows the amount of cleaning as the pickling time increases for each pickling temperature.This graph shows the results of measuring the amount of washing relative to the process holding time in the pickling step under specific temperature conditions, along with the corresponding relationship.This graph shows the results of measuring the amount of washing in response to changes in the process temperature during the pickling step, along with the corresponding relationship. Because the present invention can be modified in various ways and take on various forms, specific embodiments are illustrated in the drawings and described in detail herein. However, this should not be understood as limiting the present invention to any particular disclosure, but rather as including all modifications, equivalents, or substitutions that fall within the spirit and technical scope of the present invention. In this specification, when a component (or region, layer, part, etc.) is referred to as "on top of," "combined with," or "combined with" another component, it means that it is directly placed on top of, connected to, or combined with the other component, or that a third component may be placed between them. On the other hand, in this specification, "directly arranged" means that there are no add