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JP-7854790-B2 - Electronic components

JP7854790B2JP 7854790 B2JP7854790 B2JP 7854790B2JP-7854790-B2

Inventors

  • 塚本 和寛

Assignees

  • ＴＤＫ株式会社

Dates

Publication Date
20260507
Application Date
20211012

Claims (14)

  1. A first body comprising multiple stacked dielectric layers, It comprises a second body mounted on the first body as a single component smaller than the first body , The second body includes a first circuit portion and a second circuit portion, each provided inside the second body and configured using at least one elastic wave element, and electrically isolated from each other, and also has a first terminal, a second terminal, a third terminal, and a fourth terminal arranged on the outer surface of the second body. The first circuit portion is provided between the first terminal and the second terminal in the circuit configuration. The second circuit portion is provided between the third terminal and the fourth terminal in the circuit configuration. The first body includes at least one ground conductor layer located between the first circuit portion and the second circuit portion when viewed from a first direction parallel to the direction in which the first body and the second body are aligned. The electronic component is characterized in that the second body does not have terminals other than the first to fourth terminals that are connected to ground.
  2. The electronic component according to claim 1, characterized in that the first direction is a single direction parallel to the stacking direction of the plurality of dielectric layers.
  3. The electronic component according to claim 1 or 2, characterized in that the second terminal and the fourth terminal are arranged so as to sandwich the at least one ground conductor layer when viewed from the first direction.
  4. The electronic component according to any one of claims 1 to 3, characterized in that the at least one ground conductor layer protrudes outside the second body when viewed from the first direction.
  5. The electronic component according to any one of claims 1 to 4, characterized in that the at least one ground conductor layer is provided inside the first body.
  6. The first body has a first surface on which the second body is mounted and a second surface on the opposite side thereof. The electronic component according to claim 5, characterized in that the at least one ground conductor layer is positioned closer to the first surface than to the second surface.
  7. The electronic component according to any one of claims 1 to 6, characterized in that the at least one ground conductor layer includes multiple ground conductor layers.
  8. The electronic component according to claim 7, further characterized in that the first body includes a plurality of through-holes connecting the plurality of ground conductor layers to each other.
  9. The plurality of ground conductor layers include a first ground conductor layer, a second ground conductor layer, and a third ground conductor layer, which are arranged at different positions in the first direction. The plurality of through-holes include a plurality of first through-holes that electrically connect the first ground conductor layer and the second ground conductor layer, and a plurality of second through-holes that electrically connect the second ground conductor layer and the third ground conductor layer. The electronic component according to claim 8, characterized in that the plurality of first through-holes and the plurality of second through-holes are arranged so as not to overlap when viewed from the first direction.
  10. The electronic component according to any one of claims 1 to 9, characterized in that the first body includes a third circuit portion and a fourth circuit portion arranged to sandwich the at least one ground conductor layer when viewed from the first direction.
  11. The first circuit portion is electrically connected to the third circuit portion. The electronic component according to claim 10, characterized in that the second circuit portion is electrically connected to the fourth circuit portion.
  12. The first circuit portion and the third circuit portion constitute a first filter that selectively passes signals within a first passband. The electronic component according to claim 11, characterized in that the second circuit portion and the fourth circuit portion constitute a second filter that selectively passes signals with frequencies within a second passband higher than the first passband.
  13. The first main body further includes a common port, a first signal port, and a second signal port. The first circuit portion is provided between the common port and the first signal port in terms of the circuit configuration. The electronic component according to any one of claims 1 to 12, characterized in that the second circuit portion is provided between the common port and the second signal port in the circuit configuration.
  14. The electronic component according to any one of claims 1 to 13, characterized in that the second body is not provided with terminals connected to both the first circuit portion and the second circuit portion.

Description

This invention relates to an electronic component in which a body containing an elastic wave element is mounted on another body. In small mobile communication devices, a common configuration is used in which an antenna is provided for use across multiple applications with different systems and frequency bands, and the multiple signals transmitted and received by this antenna are separated using a demultiplexer. Generally, a demultiplexer that separates a first signal with a frequency within a first frequency band from a second signal with a frequency higher than the first frequency band comprises a common port, a first signal port, a second signal port, a first filter provided in the first signal path from the common port to the first signal port, and a second filter provided in the second signal path from the common port to the second signal port. Patent documents 1 and 2 disclose a demultiplexer equipped with two filters, each containing an LC resonator and an elastic wave resonator, as the first and second filters, respectively. An elastic wave resonator is a resonator constructed using elastic wave elements. An elastic wave element is an element that utilizes elastic waves. Elastic wave elements include surface acoustic wave elements that utilize surface acoustic waves and bulk elastic wave elements that utilize bulk elastic waves. In the demultiplexer disclosed in patent documents 1 and 2, two physically separated elastic wave resonators are mounted on a laminate containing an LC resonator. Japanese Patent Publication No. 2017-112525Japanese Patent Publication No. 2017-135445 This is a diagram showing the configuration of an electronic component according to one embodiment of the present invention.This is a perspective view showing an electronic component according to one embodiment of the present invention.This is a perspective view showing the first body in one embodiment of the present invention.This is a plan view showing an electronic component according to one embodiment of the present invention.This is an explanatory diagram showing a plurality of ground conductor layers and a plurality of through-holes in one embodiment of the present invention.This is a block diagram showing the configuration of the electronic component of the first comparative example.This is a block diagram showing the configuration of the electronic component in the second comparative example.This is a circuit diagram showing the circuit configuration in the model of the embodiment used in the simulation.This is a characteristic curve showing the frequency characteristics of the isolation obtained through simulation.This is a characteristic diagram showing the pass-through attenuation characteristics of the first filter, as determined by simulation.This is a characteristic diagram showing the pass-through attenuation characteristics of the second filter, as determined by simulation. The embodiments of the present invention will be described in detail below with reference to the drawings. First, the general configuration of an electronic component 100 according to one embodiment of the present invention will be described with reference to Figure 1. Figure 1 is a block diagram showing the configuration of the electronic component 100. The electronic component 100 according to this embodiment is a triplexer comprising a first filter 4, a second filter 5, and a third filter 6. The first filter 4 is configured to selectively pass a first signal with a frequency within a first passband. The second filter 5 is configured to selectively pass a second signal with a frequency within a second passband higher than the first passband. The third filter 6 is configured to selectively pass a third signal with a frequency within a third passband lower than the first passband. The first filter 4 includes the third circuit section 10. The second filter 5 includes the fourth circuit section 20. The third filter 6 includes the fifth circuit section 30. The third through fifth circuit sections 10, 20, and 30 are each LC circuits including at least one inductor and at least one capacitor. The first filter 4 further includes a first circuit section 41 electrically connected to the third circuit section 10. The second filter 5 further includes a second circuit section 42 electrically connected to the fourth circuit section 20. The first and second circuit sections 41 and 42 are electrically isolated from each other. Furthermore, the first and second circuit sections 41 and 42 are each constructed using at least one elastic wave element. The elastic wave element may be, for example, a bulk elastic wave element or a surface acoustic wave element. The first and second circuit sections 41 and 42 may each be elastic wave resonators. The first circuit section 41 and the third circuit section 10 constitute one filter circuit (the first filter 4). The second circuit section 42 and the fourth circuit section 20 constitute another filter circuit (the second