JP-7854830-B2 - Manufacturing method for substrate laminates

Inventors

• 西平 成義
• 宗包 早紀
• 藤下 彩佳
• 斉藤 譲

Assignees

• 株式会社カネカ

Dates

Publication Date

20260507

Application Date

20220330

Claims (13)

1. Step A involves forming a pattern of the first curable resin composition on a first substrate using a printing method, Step B involves partially curing the pattern of the first curable resin composition, Step C involves forming a pattern of the second curable resin composition on the pattern of the semi-cured first curable resin composition using a printing method, Step D involves forming a laminate pattern of the curable resin composition by flat molding the pattern of the first curable resin composition, which has been partially cured in step B and the pattern of the second curable resin composition formed in step C, The process includes step E, which involves arranging the first and second substrates through the pattern of the laminate of the curable resin composition and curing the pattern of the laminate of the curable resin composition, A method for manufacturing a substrate laminate, comprising partially curing the pattern of the laminate of the curable resin composition before step E.
2. The process further includes step F, which partially cures the pattern of the second curable resin composition formed in step C, The method for manufacturing a substrate laminate according to claim 1, wherein step C and step F are repeated multiple times, step D is performed, and step F is omitted in the last cycle of the multiple repeated cycles.
3. The method for manufacturing a substrate laminate according to claim 2, wherein in at least one of the steps F, partial curing is performed while the substrate is being molded in a flat form.
4. A method for manufacturing a substrate laminate according to any one of claims 1 to 3, wherein the step of partially curing the pattern of the laminate of the curable resin composition is performed in step D.
5. A method for manufacturing a substrate laminate according to any one of claims 1 to 4, wherein in step B, the pattern of the first curable resin composition is molded in a flat shape while partial curing is performed.
6. A method for manufacturing a substrate laminate according to any one of claims 1 to 5, wherein the printing method is screen printing.
7. A method for manufacturing a substrate laminate according to any one of claims 1 to 6, wherein the surface roughness Ra 2 of the flat type is 5 μm or less.
8. A method for manufacturing a substrate laminate according to any one of claims 1 to 7, wherein either the first substrate or the second substrate is a transparent substrate.
9. The method for manufacturing a substrate laminate according to claim 8, wherein the other substrate of the first substrate and the second substrate is a semiconductor element substrate.
10. A method for manufacturing a substrate laminate according to any one of claims 1 to 9, wherein either the first substrate or the flat type is transparent.
11. A method for producing a substrate laminate according to any one of claims 1 to 10, wherein the first curable resin composition and/or the second curable resin composition contains at least one of a glycidyl group or an alicyclic epoxy group.
12. A method for producing a substrate laminate according to any one of claims 1 to 11, wherein the first curable resin composition and/or the second curable resin composition is a polysiloxane-based compound.
13. A method for manufacturing a substrate laminate according to any one of claims 1 to 12, wherein the first curable resin composition and/or the second curable resin composition is a photosensitive resin.

Description

This invention relates to a method for manufacturing a substrate laminate. In MEMS sensors such as image sensors, acceleration sensors, and pressure sensors, it is necessary to create a hollow space by bonding a semiconductor element substrate and a sealing substrate made of glass, metal, ceramic, etc., using an adhesive placed around the semiconductor element, in order to adjust light transmittance and ensure the movement of mechanical parts. In this case, methods are used to form the adhesive layer pattern using a liquid adhesive by dispensing or screen printing (Patent Document 1). Japanese Patent Publication No. 2013-115104 This figure shows step A, in which a pattern is formed on a first substrate according to one embodiment of the present invention.This figure shows steps A to E according to one embodiment of the present invention. (1. Substrate Laminate) The substrate laminate according to the present invention is obtained by going through the following steps: step A (Figure 2(a)) of forming a pattern of a first curable resin composition on a first substrate using a printing method; step B (Figure 2(b)) of semi-curing the pattern of the first curable resin composition; step C (Figure 2(c)) of forming a pattern of a second curable resin composition on the semi-cured pattern of the first curable resin composition using a printing method; step D (Figure 2(d)) of forming a pattern of a laminate of curable resin compositions by flat molding the pattern of the first curable resin composition on which the pattern of the second curable resin composition is formed; and step E (Figure 2(e)) of bonding the first substrate and the second substrate via the pattern of the laminate of curable resin compositions and curing them. In step D, after forming a pattern of the second curable resin composition (before semi-curing), it is preferable to mold the pattern of the laminate of curable resin composition with a flat mold and semi-cur it while pressing with the flat mold (Figure 2(d')). Semi-curing may be done before step E or after molding with a flat mold, but it is preferable to semi-cur it while molding with a flat mold in step D. Examples of usable substrates include semiconductor element substrates, silicon wafers, glass substrates, transparent resin substrates, colored resin substrates, and ceramic substrates. In the manufacturing of the image sensor described later, a semiconductor element substrate is used as either the first or second substrate, and a glass substrate is used as the other substrate. The substrate shape can be round or square. From a productivity standpoint, it is preferable to use a square substrate of 100mm x 100mm or larger, a substrate created by rearranging substrates that have been individually pieced into an area of 100mm x 100mm or larger, or a round substrate of 4 to 12 inches. Furthermore, the size and shape of the first and second substrates may be the same or different. The curable resin used to form a pattern on the substrate of the substrate laminate of the present invention functions as an adhesive layer that bonds the first substrate and the second substrate. The width and height of the adhesive layer can be set as appropriate, and by selecting them appropriately, a substrate laminate with a hollow structure can be easily obtained. In particular, when using the substrate laminate for CMOS/CCD sensors, if the adhesive layer is too low, there is a possibility of damaging the sensor substrate during assembly. Also, if the adhesive layer is too high, a good pattern may not be obtained. From these points of view, the height of the adhesive layer is 1 μm to 1000 μm, preferably 50 μm to 500 μm, and more preferably 50 μm to 300 μm. The height of the adhesive layer may also be 200 μm or less, or 150 μm or less. Regarding the width of the adhesive layer, if it is too narrow, sufficient adhesive strength may not be obtained, and if the width of the adhesive layer is too wide, there is a risk of not having enough space to place the sensor substrate. From these points of view, the width of the adhesive layer is 1 μm to 1000 μm, preferably 50 μm to 300 μm. Furthermore, the surface roughness Ra 1 of the upper surface of the adhesive layer formed on the first substrate, i.e., the surface in contact with the second substrate, is preferably 5 μm or less, more preferably 3 μm or less, and even more preferably 1 μm or less. Setting it to 5 μm or less improves bonding performance and enhances adhesive reliability, and is also effective in reducing height variations. Surface roughness can be measured using a 3D measuring laser microscope. (2. Method for manufacturing a substrate laminate) (First Embodiment) An embodiment of the method for manufacturing the substrate laminate of the present invention will be described in detail below. The method for preparing the curable resin used as the adhesive layer is not particularly limited and can be prepared by various methods. The various components may be