JP-7855016-B2 - PCB transfer device and PCB transfer method

JP7855016B2JP 7855016 B2JP7855016 B2JP 7855016B2JP-7855016-B2

Inventors

新井理恵
西部幸伸
加藤峻
二ツ川進治

Assignees

芝浦メカトロニクス株式会社

Dates

Publication Date: 20260507
Application Date: 20221216
Priority Date: 20211228

Claims (8)

A trolley housing section having a housing chamber for receiving and housing a trolley for transporting substrates, which is equipped with a tank containing multiple substrates together with liquid, A removal device that takes the substrate from the tank mounted on the substrate transport trolley housed in the aforementioned storage chamber and passes it to an adjacent processing device, It has, The trolley housing section is a substrate transfer device having a positioning mechanism for positioning the substrate transport trolley in a fixed position .
The substrate transfer device according to claim 1, wherein the extraction device extracts the substrates from the tank in which the cassette containing a plurality of substrates is housed in an inclined state, and transfers them to the processing device.
The substrate transfer device according to claim 1 , wherein the positioning mechanism has a separation mechanism that separates the tank from the substrate transport trolley to a position where the substrate can be removed by the removal device.
The aforementioned trolley housing section is, A drainage section for discharging liquid from the aforementioned tank, A liquid supply unit that supplies liquid to the tank, A substrate transfer device according to any one of claims 1 to 3 .
The extraction device includes a gripping portion for gripping the substrate, A substrate transfer device according to any one of claims 1 to 3 , further comprising a cleaning unit for cleaning the gripping unit.
A substrate transfer device according to any one of claims 1 to 3 , further comprising a blower that generates a downflow from above the storage chamber and the extraction device.
A trolley housing section having a housing chamber for receiving and housing a trolley for transporting substrates, which is equipped with a tank containing multiple substrates together with liquid, A removal device that takes the substrate from the tank mounted on the substrate transport trolley housed in the aforementioned storage chamber and passes it to an adjacent processing device, It has, The aforementioned trolley housing section is, A drainage section for discharging liquid from the aforementioned tank, A liquid supply unit that supplies liquid to the tank, A substrate transfer device having the following features.
A substrate transport trolley equipped with a tank containing multiple substrates together with liquid is housed in a storage chamber of the trolley storage section, and the substrate transport trolley is positioned in a fixed position by a positioning mechanism of the trolley storage section. A method for transferring substrates, characterized in that the substrate is removed from the tank mounted on the substrate transport trolley housed in the storage chamber by an extraction device and passed to an adjacent processing device.

Description

The present invention relates to a substrate transfer apparatus and a substrate transfer method. In the semiconductor manufacturing process, the surface of a substrate such as a wafer is polished using a polishing device (CMP device), and then the slurry consisting of the polishing agent used for polishing is washed using a washing device. A typical washing device is installed adjacent to the polishing device, and the substrate is transported from the polishing device to the washing device by a transport device (see Patent Document 1). Here, immediately after cleaning, slurry used in the CMP polishing process remains on the surface of the substrate. This slurry will stick to the substrate surface once it dries, making it impossible to remove with the cleaning equipment afterward. For this reason, the polishing equipment and the conveying equipment are placed adjacent to each other, and the conveying equipment, such as a robot, transports the substrate while its surface is still wet with liquid, thereby preventing the substrate surface from drying out. Patent No. 4451429 This is a front perspective view showing the substrate transport trolley and substrate transfer device of the embodiment.This is a rear perspective view showing the substrate transfer device of the embodiment.This is a front perspective view showing a cross-section of a part of the substrate transfer device of the embodiment.This is a rear perspective view showing a cross-section of a portion of the substrate transfer device according to the embodiment.This is a plan view showing the circuit board transport trolley housed in the storage chamber.This is a side view cross-sectional image showing the cassette stored inside the tank.These are a front side perspective view (A) and a rear side perspective view (B) of the trolley used for transporting circuit boards.These are a front side perspective view (A) and a rear side perspective view (B) of a section of the tank of the circuit board transport trolley, with parts of it cut away.This is a perspective view showing the drive coupler.These are a bottom view (A) and a side perspective view (B) of the trolley used for transporting circuit boards.This is a front perspective view showing the containment chamber inside the docking module.This is a plan view showing the separation mechanism inside the containment chamber.This is a rear perspective view with a portion of the drainage section cut away.These are front side perspective views (A) and rear side perspective views (B) showing the circuit board transport trolley housed in the storage chamber.These are a front side perspective view (A) and a rear side perspective view (B) illustrating the circuit board removal operation by the removal device.These are a rear perspective view (A) with a portion of the cleaning section cut away, a side cross-sectional view (B), and a side cross-sectional view (C) showing the spraying state.This is a perspective view showing the exterior of the cleaning unit.This is a front view showing the air blower unit. Hereinafter, embodiments of the present invention will be described with reference to the drawings. [overview] As shown in Figures 1 to 3, the substrate transport trolley 1 of this embodiment is a trolley used by an operator to transport the substrate W between the polishing device (not shown) and the substrate transfer device 2. The substrate transfer device 2 of this embodiment is a device that transfers the substrate W from the substrate transport trolley 1 to the cleaning device 3, as shown in Figures 3 and 4. The cleaning device 3 is a device that cleans the surface of the substrate W, which has been polished by the polishing device, using a brush while supplying a cleaning solution to the surface of the substrate W. In the following explanation, the side into which the substrate transport trolley 1 is brought in is referred to as the front, and the side into which the substrate is handed over to the cleaning device 3 is referred to as the rear. When the operator brings the substrate transport trolley 1 into the substrate transport device 2, the far side is the rear and the near side is the front. The front side is sometimes referred to as the front and the rear side as the back. As shown in Figures 5 and 6, multiple substrates W polished in the polishing apparatus are stacked and housed in a box-shaped cassette (FOUP) 4 with a certain gap between them. The cassette 4 has a housing with a space for housing the substrates inside, and partitions 41 provided on the inner walls of the housing so as to face each other and support the vicinity of the edges of the substrates. The partitions 41 maintain a gap between the multiple substrates W in the cassette 4. The cassette 4 has a pair of inner walls with a pair of partitions 41 facing each other, and a pair of walls connecting these inner walls and facing the main surface of the stacked substrates W, and is open so as to be open to the peripheral edge surfaces o