JP-7855028-B2 - IR non-contact temperature detection in dispensers

Inventors

• トーマス シー．プレンティス
• スコット エー．リード
• パッツィー エー．マテロ
• フェルナンド ジェイ．アギアール

Assignees

• イリノイ トゥール ワークス インコーポレイティド

Dates

Publication Date

20260507

Application Date

20240606

Priority Date

20190319

Claims (6)

1. A method for dispensing assembly material onto an electronic circuit board, The electronic circuit board is sent to a dispensing system, and the dispensing system is Frame and, A preheating station coupled to the frame and configured to house and heat the electronic circuit board, the preheating station having a first non-contact sensor positioned to measure the temperature of the electronic circuit board, A dispensing station comprising: a dispensing unit gantry coupled to the frame and configured to move in the X-axis and Y-axis directions; at least one dispensing unit coupled to the dispensing unit gantry and configured to move in the Z-axis direction by a carriage, configured to dispense material onto the electronic substrate positioned on a substrate support; and a second non-contact sensor, which is an infrared temperature sensor, positioned above the electronic substrate on the dispensing station and mounted on the carriage to move toward the electronic substrate in the X-axis, Y-axis and Z-axis directions for measuring the temperature of the electronic substrate; Having, Moving the electronic circuit board to the position before dispensing within the preheating station, The first non-contact sensor, positioned above the electronic substrate, measures the temperature of the electronic substrate at the position before dispensing, When the electronic circuit board is at an appropriate temperature, the electronic circuit board is moved to the dispensing position within the dispensing station , Dispensing a viscous assembly material onto the aforementioned electronic substrate, In order to confirm that the electronic substrate is at an appropriate temperature, the temperature of the electronic substrate at the dispensing position is measured by the second non-contact sensor positioned above the electronic substrate, Includes, A method further comprising positioning the first non-contact sensor relative to the electronic substrate by a first adjustable bracket .
2. The method according to claim 1, wherein the first non-contact sensor is an infrared temperature sensor.
3. Moving the electronic circuit board to the position after dispensing within the post-heating station , In order to confirm that the electronic substrate is at an appropriate temperature, the temperature of the electronic substrate at the position after dispensing is measured by a third non-contact sensor positioned above the electronic substrate, The method according to claim 1, further comprising:
4. The method according to claim 3 , further comprising positioning the third non-contact sensor relative to the electronic substrate by a second adjustable bracket.
5. The method according to claim 1, further comprising providing temperature feedback for the electronic substrate as part of a temperature control system.
6. The method according to claim 5, wherein providing temperature feedback includes the temperature control system turning off heating to the electronic substrate when the electronic substrate reaches a desired target temperature, and the temperature control system turning on heating when the temperature falls below a lower limit temperature.

Description

[Related applications] This application claims priority under § 119(e) of the United States Patent Act to U.S. Provisional Patent Application No. 62/792,087, filed on 14 January 2019, entitled “IR Non-Contact Temperature Sensing in a Dispenser,” which, by reference, constitutes an entire part of this specification. This application also claims priority to U.S. Patent Application No. 15/831,800, filed on 5 December 2017, entitled “Material Temperature Sensor for Stencil Printer,” which, by reference, constitutes an entire part of this specification. This disclosure relates to apparatus and processes for dispensing materials, and more particularly to apparatus and processes for dispensing solder paste in a dispenser. Several types of dispensing systems exist for dispensing precise amounts of liquid or paste for a variety of applications. One such application is the assembly of integrated circuit chips and other electronic components onto circuit boards. In this application, an automated dispensing system is used to dispense dots of liquid epoxy resin, solder paste, or any other related material onto a circuit board. The automated dispensing system is also used to dispense underfill and encapsulation wires that can be used to mechanically fix components to the circuit board. An exemplary dispensing system described above is manufactured and distributed by ITW EAE, Inc., located in Glenview, Illinois, under the trademark name CAMALOT®. In a typical dispensing system, the pump and/or dispenser assembly is mounted on a mobile assembly or gantry, which moves the pump and dispenser assembly along three mutually orthogonal axes (X, Y, and Z axes) using servo motors controlled by a computer system or controller. To dispense a dot of liquid to a desired location on a circuit board or other substrate, the pump and dispenser assembly is moved along the horizontal X and Y axes on the same plane until it is positioned above the desired location. In one embodiment, the pump and/or dispenser assembly is then lowered along the vertical Z axis until the nozzle/needle of the pump and dispenser assembly is positioned at the appropriate dispensing height above the electronic substrate. The pump and/or dispenser assembly dispenses a dot of liquid, is then raised along the Z axis, moved along the X and Y axes towards a new location, and lowered along the Z axis to dispense the next dot of liquid. In another embodiment, the material is ejected from the pump and dispenser assembly without raising or lowering the nozzle/needle of the pump and dispenser assembly. For applications such as the sealing or underfill described above, the pump and dispenser assembly is typically controlled to dispense the material line as the pump and dispenser assembly moves along the desired path of the line in the X and Y axes. It is known that IR temperature sensors are used to monitor the temperature of the solder paste supply cartridge in stencil printers, motivated by the need to ensure that the paste has reached the appropriate temperature for print deposition. Similarly, the application of material temperature sensing in the pump and dispenser assemblies of dispensing systems is known, motivated by the need to ensure that materials stored at a temperature lower than the appropriate application temperature have actually warmed up to the appropriate temperature for deposition. One aspect of this disclosure relates to a dispensing system comprising: an optional preheating station configured to house an electronic substrate; a dispensing station configured to dispense material onto an electronic substrate received from the optional preheating station; an optional postheating station configured to house an electronic substrate from the dispensing station; and a non-contact sensor positioned above the electronic substrate on at least one of the optional preheating station, dispensing station, and optional postheating station. Embodiments of the dispensing system may further include a non-contact sensor positioned above the electronic substrate on an optional preheating station to ensure the electronic substrate is at an appropriate temperature before being moved to the dispensing station. The non-contact sensor may be mounted on an adjustable mechanism that moves toward and away from a temperature measurement target. The non-contact sensor may be positioned above the dispensing station to ensure the electronic substrate is at an appropriate temperature at the dispensing station. The non-contact sensor may be mounted on an adjustable mechanism associated with the dispensing station. The non-contact sensor may be positioned above the electronic substrate on an optional postheating station to ensure the electronic substrate is at an appropriate temperature at the optional postheating station. The non-contact sensor may be an infrared temperature sensor. Another aspect of this disclosure relates to a dispensing system configured to dispense viscous assembly