JP-7855035-B2 - Manufacturing method for wiring circuit boards

Inventors

• 福島 健太
• 柴田 周作
• 玉木 優作

Assignees

• 日東電工株式会社

Dates

Publication Date

20260507

Application Date

20240830

Claims (9)

1. The process of preparing the metal support substrate, The process of forming a base insulating layer on one side in the thickness direction of the metal support substrate, A method for manufacturing a wiring circuit board, comprising the steps of forming a conductor layer on one side in the thickness direction of the base insulating layer and preparing the metal support substrate, the step of preheating the metal support substrate.
2. The base insulating layer contains a resin, The step of forming the base insulating layer includes the step of obtaining the resin by thermal curing the raw material of the resin, The method for manufacturing a wiring circuit board according to claim 1, wherein the temperature during preheating of the metal support substrate is higher than the temperature during the thermal curing step in the process of forming the base insulating layer.
3. The method for manufacturing a wiring circuit board according to claim 2, wherein the resin is a polyimide resin.
4. Furthermore, the process includes forming a cover insulating layer on one side in the thickness direction of the base insulating layer and the conductor layer, The cover insulating layer contains resin, The step of forming the cover insulating layer includes the step of obtaining the resin by thermal curing the raw material of the resin, The method for manufacturing a wiring circuit board according to claim 1, wherein the temperature during preheating of the metal support substrate is higher than the temperature during the thermal curing step in the process of forming the cover insulating layer.
5. The method for manufacturing a wiring circuit board according to claim 1, wherein the metal support substrate is made of a copper alloy.
6. The method for manufacturing a wiring circuit board according to claim 1, wherein the metal support substrate is made of rolled metal.
7. The method for manufacturing a wiring circuit board according to claim 1, wherein the thickness of the metal support substrate is 25 μm or more and 100 μm or less.
8. In the process of preparing the metal support substrate, The metal support substrate is wound onto the preheating core. The metal support substrate, which is wound around the preheating core, is preheated. A method for manufacturing a wiring circuit board according to claim 1.
9. In the process of preparing the metal support substrate, The metal support substrate is conveyed by a roll-to-roll method while preheating is performed. A method for manufacturing a wiring circuit board according to claim 1.

Description

This invention relates to a method for manufacturing a wiring circuit board. Conventionally, a suspension substrate comprises a metal support substrate, a base insulating layer formed on the metal support substrate, a plurality of wirings formed on the base insulating layer, and a cover layer that covers the wiring. Furthermore, in suspension substrates, metal materials with higher conductivity than stainless steel are used as the metal support substrate; more specifically, copper alloy spring materials are used (see, for example, Patent Document 1). Japanese Patent Publication No. 2013-168206 Figure 1 is a cross-sectional view of a wiring circuit board obtained by one embodiment of the manufacturing method for wiring circuit boards according to the present invention.Figure 2A shows the process of preparing the metal support substrate, Figure 2B shows the process of preheating the metal support substrate, Figure 2C shows the process of forming a base insulating layer on one side in the thickness direction of the metal support substrate, Figure 2D shows the process of forming a conductor layer on one side in the thickness direction of the base insulating layer, and Figure 2E shows the process of forming a cover insulating layer on one side in the thickness direction of the base insulating layer and the conductor layer. 1. Overall Configuration of Wired Circuit Board (1) A wired circuit board obtained by one embodiment of the manufacturing method of the wired circuit board of the present invention will be described below with reference to Figure 1. In Figure 1, the wiring circuit board 1 has thickness. The wiring circuit board 1 extends in the planar direction. The planar direction is perpendicular to the thickness direction. The wiring circuit board 1 has a plate shape. The thickness of the wiring circuit board 1 is, for example, 10 μm or more. Furthermore, the thickness of the wiring circuit board 1 is, for example, 500 μm or less, preferably 300 μm or less, and more preferably 200 μm or less. In Figure 1, the wiring circuit board 1 comprises a metal support substrate 2, a base insulating layer 3 disposed on one side of the metal support substrate 2 in the thickness direction, a conductor layer 4 disposed on one side of the base insulating layer 3 in the thickness direction, and a cover insulating layer 5 disposed on one side of the base insulating layer 3 in the thickness direction so as to cover the conductor layer 4. The wiring circuit board 1 includes a plurality of divided sections 11A and 11B. Each of the divided sections 11A and 11B is arranged on one side of the metal support substrate 2 in the thickness direction. The divided sections 11A and 11B are divided in the planar direction. In the planar direction, divided section 11B is spaced apart from divided section 11A. Divided section 11A comprises a base insulating layer 3A, a conductor layer 4A, and a cover insulating layer 5A. Divided section 11B comprises a base insulating layer 3B, a conductor layer 4B, and a cover insulating layer 5B. (2) Metal support substrate The metal support substrate 2 is positioned at the other end of the wiring circuit board 1 in the thickness direction. The metal support substrate 2 forms the other end surface of the wiring circuit board 1 in the thickness direction. The metal support substrate 2 extends in the plane direction. Both the one surface and the other surface of the metal support substrate 2 in the thickness direction are flat surfaces. The metal support substrate 2 is in contact with the other surface of the divided parts 11A and 11B in the thickness direction. The metal support substrate 2 is made of, for example, a metal, preferably a metal rolled by a known method (hereinafter referred to as "rolled metal"). Examples of metals include stainless steel and copper alloys. These can be used individually or in combination of two or more. Preferably, copper alloys are used as the metal. In other words, the metal support substrate 2 preferably contains a copper alloy, and more preferably consists of a copper alloy. A copper alloy is an alloy containing copper. A copper alloy contains a primary metal consisting of copper and a secondary metal that can alloy with copper. "Alloyable" means that an alloy can be formed. The alloy may be a solid solution, a eutectic, an intermetallic compound, or a composite of these. In copper alloys, the second metal is an additive metal added to copper, which is the first metal. That is, the second metal is a metal other than copper. Examples of the second metal include titanium, nickel, and silicon. These can be used individually or in combination of two or more. In other words, the copper alloy may be a two-component alloy or an alloy of three or more components. The second metal is preferably titanium. When the second metal is titanium, the copper alloy is a copper-titanium alloy. When a copper-titanium alloy is used, the wiring circuit board 1 has superior mechanical strength