JP-7855097-B1 - Electronic equipment and fans

JP7855097B1JP 7855097 B1JP7855097 B1JP 7855097B1JP-7855097-B1

Abstract

[Problem] To provide an electronic device that can improve cooling performance. [Solution] The electronic device comprises a housing, a circuit board on which a heating element is mounted and housed within the housing, an impeller, a fan housing housing the impeller, and a fan housed within the housing, wherein the fan housing has a housing member made of a thermal conductive material, and the housing member has a protruding portion that protrudes outward from the fan housing and is thermally connected to the heating element. [Selection Diagram] Figure 3

Inventors

鶴身侑大
北村昌宏
渡邊諒太

Assignees

レノボ・ジャパン合同会社

Dates

Publication Date: 20260507
Application Date: 20250203

Claims (7)

It is an electronic device, The casing and A circuit board with a heating element mounted and housed within the aforementioned enclosure, The fan comprises an impeller and a fan housing that houses the impeller, and the fan housed within the housing, Equipped with, The fan housing has a housing member made of a heat conductive material, The housing member is a plate-shaped member that forms one surface in the thickness direction of the fan housing, and at least a part of it constitutes the upper surface of the fan housing that covers the impeller. The housing member has a projection that extends outward toward the upper surface , The aforementioned protrusion is thermally connected to the heating element by contacting it on at least one of its surfaces. An electronic device characterized by the following features.
The electronic device according to claim 1, The aforementioned fan enclosure is A second housing member that forms the other surface in the thickness direction, Multiple screws connecting the housing member and the second housing member, It has, An electronic device characterized in that at least one of the plurality of screws is located at the base end of the protruding portion.
The electronic device according to claim 1, A step in the thickness direction is provided between the upper surface of the fan housing and the heating element. The electronic device is characterized in that the protruding portion has a bent shape capable of absorbing the step difference.
An electronic device according to any one of claims 1 to 3 , An electronic device characterized in that a fixing portion is provided at the tip of the protruding portion, which is fixed to the substrate.
It is an electronic device, The casing and A circuit board with a heating element mounted and housed within the aforementioned enclosure, The fan comprises an impeller and a fan housing that houses the impeller, and the fan housed within the housing, Equipped with, The fan housing has a housing member made of a heat conductive material, The housing member has a protruding portion that extends outward toward the outside of the fan housing and is thermally connected to the heating element. The aforementioned substrate has a second heating element mounted in a position different from the aforementioned heating element. The fans are provided in pairs so as to straddle the second heat-generating element between them, and each fan has an air outlet on one side of the fan housing facing each other. The housing has an exhaust port located between the pair of fans, with reference to the direction in which the pair of fans are arranged. The electronic device is characterized in that the protruding portion is provided on at least one of the pair of fans and protrudes from a side of the fan housing that is different from the one side.
The electronic device according to claim 1 or 5 , Furthermore, it is equipped with an external connection terminal located on the outer wall of the housing, The electronic device is characterized by including the heating element and a control IC for the external connection terminal.
A fan for mounting on electronic equipment containing a heat-generating element, impeller and, A fan housing containing the impeller, Equipped with, The fan housing has a housing member made of a heat conductive material, The housing member is a plate-shaped member that forms one surface in the thickness direction of the fan housing, and at least a part of it constitutes the upper surface of the fan housing that covers the impeller. The housing member has a projection that extends outward toward the upper surface, The aforementioned protrusion is thermally connected to the heating element by contacting it on at least one of its surfaces. A fan characterized by these features.

Description

This invention relates to an electronic device equipped with a fan. Electronic devices such as notebook PCs are equipped with circuit boards that have heat-generating components such as ICs mounted on them. Such electronic devices are sometimes configured to cool these heat-generating components using a cooling module with a fan (see, for example, Patent Document 1). The cooling module absorbs the heat generated by the heat-generating components and dissipates it to the outside. Patent No. 7371170 Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above.Figure 2 is a schematic plan view showing the internal structure of the enclosure.Figure 3 is a schematic perspective view of the protruding part of the fan and its surrounding area.Figure 4 is a schematic side cross-sectional view of the protruding portion and its surrounding area. The following describes preferred embodiments of the electronic device according to the present invention in detail with reference to the attached drawings. Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 in this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. Although this embodiment illustrates a notebook PC as the electronic device 10, the electronic device may be other than a notebook PC, such as a tablet PC, smartphone, or portable game console. The lid 11 is a thin, flat, box-shaped enclosure. The lid 11 houses a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display. The housing 12 is a thin, flat box. The keyboard device 18 and touchpad 19 face the top surface (surface 12a) of the housing 12. Hereinafter, the housing 12 and its mounted components will be described using the operator's posture when operating the keyboard device 18 as a reference. The width direction (left and right) of the housing 12 will be referred to as X1 and X2 directions, the depth direction (front and back) as Y1 and Y2 directions, and the thickness direction (up and down) as Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and Z direction. For convenience of explanation, the surface 12a side (Z1 side) may be referred to as the bottom, and the opposite side (Z2 side) as the top in the thickness direction of the housing 12 (see Figures 3 and 4). These directions are defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10. The housing 12 is composed of a cover material 20 that forms the top surface and the four sides, and a cover material 21 that forms the bottom surface. The cover material 20 is formed by creating vertical walls 20B on the four edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the cover material 20 has a roughly bathtub shape with an open bottom. The cover material 21 has a roughly flat shape and acts as a lid to close the bottom opening of the cover material 20. The cover materials 20 and 21 are overlapped in the thickness direction and detachably connected to each other. The vertical walls 20B may also be formed on the cover material 21. In this case, the cover material 20 may consist only of the cover plate 20A. The hinge 14 is installed in a concave hinge groove 12b formed on the rear edge of the housing 12, connecting the housing 12 and the lid 11. Figure 2 is a schematic plan view showing the internal structure of the housing 12. Figure 2 is a view of the inside of the housing 12 from the bottom side after removing the cover material 21. As shown in Figure 2, the cooling module 24, the circuit board 25, and the battery device 26 are housed inside the casing 12. Various other electronic and mechanical components are also installed inside the casing 12. The circuit board 25 is the motherboard of the electronic device 10. The circuit board 25 is positioned closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that powers the electronic device 10. The battery device 26 is positioned closer to the Y1 side of the circuit board 25 and extends in the X direction. The circuit board 25 of this embodiment has a CPU (Central Processing Unit) 25a and a GPU (Graphics Processing Unit) 25b mounted on it. The CPU 25a is a processing unit that performs calculations related to the main control and processing of the electronic device 10. The GPU 25b is a processing unit that performs calculations necessary for image rendering, such as 3D graphics. The circuit board 25 also has various electronic components mounted on