Search

JP-7855220-B2 - Display device and method for manufacturing the same

JP7855220B2JP 7855220 B2JP7855220 B2JP 7855220B2JP-7855220-B2

Inventors

  • 福田 加一

Assignees

  • 株式会社Magnolia White

Dates

Publication Date
20260508
Application Date
20220405

Claims (16)

  1. The lower electrode and A rib having a pixel aperture that overlaps with the lower electrode, A partition wall positioned above the rib, An upper electrode facing the lower electrode, The system comprises an organic layer located between the lower electrode and the upper electrode, which emits light in accordance with the potential difference between the lower electrode and the upper electrode, The aforementioned partition wall is The first conductive part, A conductive second portion is positioned on the first portion and in contact with the upper electrode, A third part positioned on top of the second part, It has, The lower end of the second portion protrudes more than the first portion in the width direction of the partition wall, The third portion protrudes in the width direction more than the upper end of the second portion. Display device.
  2. The partition wall surrounds the pixel aperture. The display device according to claim 1.
  3. The organic layer is composed of a plurality of layers, including a hole injection layer covering the lower electrode. The hole injection layer is spaced apart from the second portion. The display device according to claim 1.
  4. The first portion is thicker than the hole injection layer. The display device according to claim 3.
  5. The first part is thinner than the second part. The display device according to claim 4.
  6. The length by which the lower end of the second portion protrudes from the first portion is at least twice the thickness of the first portion. The display device according to claim 3.
  7. The gap between the lower end of the second portion and the rib is blocked by a layer among the plurality of layers that is placed on top of the hole injection layer. The display device according to claim 3.
  8. The plurality of layers include a hole transport layer, an electron blocking layer, an emissive layer, a hole blocking layer, an electron transport layer, and an electron injection layer, each disposed on top of the hole injection layer. The display device according to claim 7.
  9. The first portion is formed of molybdenum, The second part is made of aluminum, The aforementioned third part is made of titanium. The display device according to any one of claims 1 to 8.
  10. The first portion is formed of molybdenum, The second part is made of aluminum, The third portion includes a titanium layer and a conductive oxide layer disposed on the titanium layer. The display device according to any one of claims 1 to 8.
  11. The first part is made of aluminum, The second portion includes a titanium layer and an aluminum layer disposed on the titanium layer. The aforementioned third part is made of titanium. The display device according to any one of claims 1 to 8.
  12. The first portion is formed of a conductive oxide, The second portion includes a titanium layer and an aluminum layer disposed on the titanium layer. The aforementioned third part is made of titanium. The display device according to any one of claims 1 to 8.
  13. Form the lower electrode, A rib is formed to cover at least a portion of the lower electrode, A partition wall is formed on the rib, having a conductive first portion, a conductive second portion positioned above the first portion, and a third portion positioned above the second portion, wherein the lower end of the second portion protrudes in the width direction more than the first portion, and the third portion protrudes in the width direction more than the upper end of the second portion. An organic layer covering the lower electrode is formed through the pixel aperture provided in the rib, An upper electrode is formed that covers the organic layer and contacts the second portion. A method for manufacturing a display device.
  14. The aforementioned organic layer is formed by stacking multiple layers, including a hole injection layer. The hole injection layer is spaced apart from the second portion. A method for manufacturing a display device according to claim 13.
  15. The gap between the lower end of the second portion and the rib is sealed by a layer formed after the hole injection layer among the plurality of layers. A method for manufacturing a display device according to claim 14.
  16. The formation of the aforementioned partition wall is Forming the first layer which forms the basis of the first portion, A second layer, which will serve as the base for the second portion, is formed on the first layer. A third layer, which will serve as the base for the third portion, is formed on top of the second layer. A resist is placed on the third layer, By etching, the portions of the first layer, the second layer, and the third layer exposed from the resist are removed, and the widths of the first layer and the second layer are reduced, thereby forming the first portion, the second portion, and the third portion. Including, A method for manufacturing a display device according to any one of claims 13 to 15.

Description

Embodiments of the present invention relate to a display device and a method for manufacturing the same. In recent years, display devices using organic light-emitting diodes (OLEDs) as display elements have been put into practical use. This display element comprises a lower electrode, an organic layer covering the lower electrode, and an upper electrode covering the organic layer. In manufacturing the display devices described above, technologies that suppress the decline in reliability are necessary. Japanese Patent Publication No. 2000-195677Japanese Patent Publication No. 2004-207217Japanese Patent Publication No. 2008-135325Japanese Patent Publication No. 2009-32673Japanese Patent Publication No. 2010-118191International Publication No. 2018/179308U.S. Patent Application Publication No. 2022/0077251 Figure 1 shows an example of the configuration of a display device according to the first embodiment.Figure 2 shows an example of the sub-pixel layout according to the first embodiment.Figure 3 is a schematic cross-sectional view of the display device along the line III-III in Figure 2.Figure 4 is a schematic cross-sectional view of the partition wall according to the first embodiment.Figure 5 is a schematic cross-sectional view of the rib, partition wall, organic layer, and upper electrode according to the first embodiment.Figure 6A shows the process of forming a partition wall according to the first embodiment.Figure 6B shows the process following Figure 6A.Figure 6C shows the process that follows Figure 6B.Figure 6D shows the process that follows Figure 6C.Figure 7A shows the process of forming a display element according to the first embodiment.Figure 7B shows the process that follows Figure 7A.Figure 7C shows the process that follows Figure 7B.Figure 8 is a schematic cross-sectional view of the partition wall according to the second embodiment.Figure 9A shows the process of forming a partition wall according to the second embodiment.Figure 9B shows the process that follows Figure 9A.Figure 9C shows the process that follows Figure 9B.Figure 9D shows the process that follows Figure 9C.Figure 9E shows the process that follows Figure 9D.Figure 10 is a schematic cross-sectional view of the partition wall according to the third embodiment.Figure 11A shows the process of forming a partition wall according to the third embodiment.Figure 11B shows the process that follows Figure 11A.Figure 11C shows the process that follows Figure 11B.Figure 11D shows the process that follows Figure 11C.Figure 12 is a schematic cross-sectional view of the partition wall according to the fourth embodiment.Figure 13A shows the process of forming a partition wall according to the fourth embodiment.Figure 13B shows the process that follows Figure 13A.Figure 13C shows the process that follows Figure 13B.Figure 13D shows the process that follows Figure 13C.Figure 13E shows the process that follows Figure 13D.Figure 14 is a schematic cross-sectional view of the partition wall according to the fifth embodiment.Figure 15A shows the process of forming a partition wall according to the fifth embodiment.Figure 15B shows the process that follows Figure 15A.Figure 15C shows the process that follows Figure 15B.Figure 16 is a schematic cross-sectional view of the partition wall according to the sixth embodiment.Figure 17A shows the process of forming a partition wall according to the sixth embodiment.Figure 17B shows the process that follows Figure 17A.Figure 17C shows the process that follows Figure 17B.Figure 17D shows the process that follows Figure 17C.Figure 18 is a schematic cross-sectional view of the partition wall according to the seventh embodiment.Figure 19A shows the process of forming a partition wall according to the seventh embodiment.Figure 19B shows the process that follows Figure 19A.Figure 19C shows the process that follows Figure 19B.Figure 20 is a schematic cross-sectional view of the partition wall according to the eighth embodiment.Figure 21A shows the process of forming a partition wall according to the eighth embodiment.Figure 21B shows the process that follows Figure 21A.Figure 21C shows the process that follows Figure 21B.Figure 21D shows the process that follows Figure 21C.Figure 22 is a schematic cross-sectional view of the partition wall according to the ninth embodiment.Figure 23A shows the process of forming a partition wall according to the ninth embodiment.Figure 23B shows the process that follows Figure 23A.Figure 23C shows the process that follows Figure 23B.Figure 23D shows the process that follows Figure 23C.Figure 24 is a schematic cross-sectional view of the partition wall according to the tenth embodiment.Figure 25A shows the process of forming a partition wall according to the tenth embodiment.Figure 25B shows the process that follows Figure 25A.Figure 25C shows the process that follows Figure 25B.Figure 25D shows the process that follows Figure 25C.Figure 25E shows the process that follows Figure 25D.F