JP-7855229-B2 - Braking device

Inventors

• 國柄 智章
• 高 楊
• 竹原 尚吾

Assignees

• 西進商事株式会社

Dates

Publication Date

20260508

Application Date

20220907

Priority Date

20220825

Claims (6)

1. In a braking device in which a circular substrate having multiple planned braking lines formed in a grid pattern on its lower surface and multiple chip regions formed thereon is placed inside a retaining frame, the retaining frame and the upper surface of the substrate are covered with an adhesive sheet, and a protective sheet is attached to the lower surface of the substrate, the substrate is braked along the planned braking lines to be braked, A plurality of cutting means, including upper and lower contact portions, are positioned above and below the braking line of the braking target and are in contact with the upper and lower surfaces of the substrate so as to be able to move toward and away from it. A moving means for sequentially moving the substrate together with the holding frame to the respective positions of the plurality of cutting means, The system comprises a stress-applying means that applies bending stress to the substrate by having the upper and lower contact portions contact the substrate as it is sequentially moved to each of the plurality of cutting means, and applying bending stress to the planned braking line of the substrate to be braked, thereby braking the substrate , The braking device comprises the upper and lower contact portions, each having a different length, included in the plurality of cutting means .
2. Each of the aforementioned multiple cutting means is The lower contact portion further comprises a support having two contact surfaces that contact the lower surface of the substrate, with the braking target's planned braking line in between. The aforementioned substrate is The braking device according to claim 1, characterized in that the upper contact portion is moved by the moving means so that it is positioned above the braking target line located between the two contact surfaces of the support.
3. The first cutting means has a first upper contact portion that is smaller than the inner dimensions of the retaining frame and longer than the diameter of the substrate, and does not interfere with the retaining frame, The second cutting means has a second upper contact portion which is smaller than the inner dimensions of the retaining frame and shorter than the diameter of the substrate and does not interfere with the retaining frame. Equipped with, The braking line is divided into a first region where the length is greater than or equal to a predetermined length shorter than the diameter of the substrate, and a second region where the length is shorter than the predetermined length. The first upper contact portion is used for braking the braking line in the first region. The braking device according to claim 1 , wherein the second upper contact portion is used for braking the braking line of the second region.
4. The first cutting means has a first lower contact portion that is smaller than the inner dimensions of the retaining frame and longer than the diameter of the substrate, and does not interfere with the retaining frame. The second cutting means has a second lower contact portion that is smaller than the inner dimensions of the retaining frame and shorter than the diameter of the substrate, and does not interfere with the retaining frame. The first lower contact portion is used for braking the braking line in the first region. The braking device according to claim 3, wherein the second lower contact portion is used for braking the braking line of the second region.
5. The braking device according to any one of claims 1 to 4, wherein the moving means has a rotation function for rotating the substrate together with the holding frame.
6. Between the lower contact portion and the substrate, The braking device according to any one of claims 1 to 4, wherein an elastic buffer layer is provided to absorb the excess stress generated in the substrate after braking by the bending stress provided by the stress-applying means.

Description

This invention relates to a braking device that brakes a substrate along a designated braking line, selected from a plurality of braking lines formed vertically and horizontally on the underside of the substrate. Conventionally, a braking device for braking a substrate (wafer) into multiple semiconductor chips is described in Patent Document 1. In this type of conventional braking device, as shown in Figure 8 (a magnified cross-sectional front view of the blade area) and Figure 9 (a plan view), a grid of scoring lines, which serve as the planned braking lines 50a, are formed on the lower surface of a nearly circular substrate 50 using a diamond blade or the like. This forms multiple chip regions on the substrate 50. A protective sheet 51 is attached to the lower surface of the substrate 50, while an adhesive sheet 52 is attached to the upper surface. The adhesive sheet 52 is stretched over a nearly annular holding frame 53 (see Figure 9) with an inner dimension larger than the substrate 50. The substrate 50 is held in place by the adhesive sheet 52, the protective sheet 51, and the holding frame 53. Then, with the protective sheet 51 facing downwards, the substrate 50 is placed on the receiving portion 54. As shown by the arrow in Figure 8, the blade 55 is pressed against the braking line 50a of the substrate 50 from above the adhesive sheet 52, applying bending stress. This causes the substrate 50 to be cut along the braking line 50a. This cutting process is repeated along all the braking lines 50a, thereby braking the substrate 50 to multiple semiconductor chips. At this time, the receiving portion 54 has a space below the blade 55, supporting both sides of the braking line 50a. Japanese Patent Publication No. 2012-222198 (see paragraphs 0002-0005 and Figure 7) This is a front view of a first embodiment of the braking device according to the present invention.This is a partial plan view of Figure 1.Figure 2 is a front view.This is a cross-sectional view, enlarged from a portion of Figure 3.This is an explanatory diagram of the operation, and (a) to (c) are plan views of different states.This is a front view of a part of the second embodiment of the present invention in a certain state.Figure 6 is a front view in a different state.This is a front view of a conventional example.This is a plan view of a conventional example.This is a plan view of a different state from the conventional example. (First Embodiment) A first embodiment of the braking device according to the present invention will be described with reference to Figures 1 to 5. (Device configuration) Figure 1 shows the braking device 1 of this embodiment, comprising a mounting base 2 on which a substrate is placed, a drive mechanism 4 that moves the mounting base 2 along a pair of long guide rails 3 in the left-right direction, and first, second, and third support parts 6a, 6b, and 6 installed at three locations along the length of the guide rails 3, each supporting three types of first, second, and third blades 5a, 5b, and 5c with different blade lengths in the front-rear direction so that they can move up and down. Here, the first to third blades 5a to 5c have different blade lengths in the front-rear direction and are arranged in parallel, with the first blade 5a having the longest blade length and the third blade 5c having the shortest blade length, corresponding to the "upper contact part" of the cutting means of different lengths in the present invention, and are located above the planned braking line of the substrate to be braked, which will be described later, and contact the upper surface of the substrate so that they can move toward and away from it. As shown in Figures 1 and 2, the mounting base 2 comprises a pair of left and right traveling bodies 2a that travel along both guide rails 3, a base plate 2b having a substantially rectangular shape in plan view and mounted across both traveling bodies 2a, a circular plate-shaped rotating plate 2c rotatably mounted on the base plate 2b, and a support table 2d fixed on the rotating plate 2c and supporting a holding frame described later. Here, as shown in Figure 2, the rotating plate 2c is rotated by a rotating mechanism comprising a gear 2c1 formed on its periphery, three gears 2c2 arranged on the base plate 2b around the rotating plate 2c at the three vertices of an equilateral triangle in plan view and meshing with the gear 2c1 on the periphery of the rotating plate 2c, and a motor (not shown) that rotates one of the gears 2c2. When the motor rotates, the gears 2c2 rotate, and the rotation of these gears 2c2 is transmitted to the gear 2c1 on the periphery of the rotating plate 2c, causing the rotating plate 2c to rotate. This rotating mechanism, together with the drive mechanism 4 described in detail below, constitutes the "means of movement" in this invention. The drive mechanism 4 comprises a ball screw 11 that is elongated on both sides, with its left and right ends rotatably supported