JP-7855337-B2 - Tape crimping device

JP7855337B2JP 7855337 B2JP7855337 B2JP 7855337B2JP-7855337-B2

Inventors

内保貴
齋藤良信
柿沼良典

Assignees

株式会社ディスコ

Dates

Publication Date: 20260508
Application Date: 20211118

Claims (5)

A tape crimping device for crimping tape, which is crimped onto a frame having a central opening for housing a wafer, onto the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contacting, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that creates a vacuum in the closed state of the upper chamber and the lower chamber, and an atmospheric opening section that opens the upper chamber and the lower chamber to the atmosphere, With the tape of the tape-attached frame positioned on the back surface of the wafer supported on the wafer table, the lifting mechanism is operated to maintain the closed state while creating a vacuum in the upper and lower chambers, and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressure roller disposed in the upper chamber. The wafer table includes a positive pressure generating means that supplies air to a concave region to create a positive pressure greater than the air pressure in the upper chamber and the lower chamber. A tape crimping device in which, by operating the lifting mechanism to close it, the pressing roller is brought into contact with the tape-attached frame, and when the pressing roller rolls to press the tape on the tape-attached frame against the back surface of the wafer, the positive pressure generating means is activated when the pressing roller presses the wafer through the tape.
A tape crimping device for crimping tape, which is crimped onto a frame having a central opening for housing a wafer, onto the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a circular concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contact, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that reduces the pressure in the upper chamber and the lower chamber in the closed state, and an atmospheric vent section that opens the upper chamber and the lower chamber to the atmosphere, The holding surface of the wafer table has a ring member that is positioned along the periphery of a circularly concave region and attracts and holds the excess outer region of the wafer. With the tape of the tape-attached frame positioned on the back surface of the wafer supported on the wafer table, the lifting mechanism is operated to maintain the closed state and reduce the pressure in the upper and lower chambers to an extent that the suction holding state of the wafer by the ring member is maintained , and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressure roller disposed in the upper chamber. A tape crimping apparatus including a positive pressure generating means that supplies air to a concave region of the wafer table to create a positive pressure greater than the air pressure in the upper chamber and the lower chamber.
The tape crimping device according to claim 2 , wherein the positive pressure generating means is activated when the pressing roller presses the wafer through the tape.
The tape crimping device according to claim 1 or 2 , wherein a ring-shaped reinforcing portion is formed in a convex shape on the back surface corresponding to the excess area on the outer edge of the wafer.
The tape crimping device according to claim 2, wherein the ring member is made of rubber.

Description

This invention relates to a tape crimping device for crimping a tape, which is crimped onto a frame having a central opening for housing a wafer, onto the back surface of a wafer. A wafer, in which multiple devices such as ICs and LSIs are formed on its surface, with a device area demarcated by streets and an outer peripheral surplus area surrounding the device area, is then ground on its back surface to the desired thickness. Afterward, it is divided into individual device chips using a dicing device or laser processing device, and each divided device chip is used in electrical devices such as mobile phones and personal computers. The applicant proposed a technique to facilitate the transport of ground wafers by leaving a ring-shaped reinforcing portion on the back surface corresponding to the excess outer region, performing a predetermined process, then pressing a dicing tape onto the back surface of the wafer and supporting the wafer with a frame, and finally removing the ring-shaped reinforcing portion from the wafer (see, for example, Patent Document 1). However, the technology disclosed in Patent Document 1 has problems with productivity, as it is difficult to press dicing tape onto the back surface of a wafer with a ring-shaped reinforcing portion formed on its outer circumference to integrate it with the frame, and it is also difficult to cut and remove the ring-shaped reinforcing portion from the wafer. Therefore, the applicant developed a processing apparatus for removing a convex ring-shaped reinforcing portion from a wafer in which a convex ring-shaped reinforcing portion is formed on the back surface corresponding to the excess outer region, and filed a patent application on July 17, 2020 (Japanese Patent Application No. 2020-123301). This processing device, A wafer cassette table on which a wafer cassette containing multiple wafers is placed, A wafer unloading means for unloading wafers from wafer cassettes placed on a wafer cassette table, A wafer table that supports the surface side of the wafer that has been unloaded by the wafer unloading means, A frame housing means for housing multiple ring-shaped frames, each having an opening for housing wafers, A frame unloading means for unloading frames from a frame storage means, A frame table that supports the frame that has been removed by the frame removal means, A tape crimping means is positioned above the frame table and presses tape onto the frame, A tape-attached frame transport means that transports the frame with the tape attached to it to a wafer table, positions the opening of the frame on the back surface of the wafer supported on the wafer table, and places the tape-attached frame on the wafer table. A tape-pressing means for pressing the tape of a tape-attached frame onto the back surface of a wafer, A frame unit unloading means for unloading a frame unit from a wafer table, in which the tape of the tape-attached frame and the back surface of the wafer are pressed together by a tape-pressure means, A reinforcement removal means for cutting and removing a ring-shaped reinforcement from a wafer of a frame unit that has been unloaded by a frame unit unloading means, A ringless unit removal means for removing the ringless unit, from which the ring-shaped reinforcing part has been removed, from the reinforcing part removal means, The system includes a frame cassette table on which a frame cassette containing a ringless unit, which has been unloaded by a ringless unit unloading means, is placed. The above-described tape crimping means comprises an upper chamber, a lower chamber housing a wafer table, a lifting mechanism that raises and lowers the upper chamber to create a closed state where it is in contact with the lower chamber and an open state where it is separated from the lower chamber, a vacuum section that creates a vacuum in the upper and lower chambers in the closed state, and an atmospheric release section that opens the upper and lower chambers to the atmosphere. With the tape of the tape-attached frame positioned on the back surface of the wafer supported by the wafer table, the lifting mechanism is activated to maintain the closed state while creating a vacuum in the upper and lower chambers, and a pressure roller disposed in the upper chamber presses the tape of the tape-attached frame to the back surface of the wafer, thereby ensuring tight contact of the tape to the back surface of the wafer. Japanese Patent Publication No. 2010-62375 A perspective view of a tape crimping device configured according to the present invention.Figure 1 is an exploded perspective view of the tape crimping device.Figure 1 is a cross-sectional view of the tape crimping device.(a) Perspective view of a wafer with reinforcement, (b) Perspective view of a wafer without reinforcement.Perspective view of a frame with tape.A schematic diagram showing the state in which tape pressure is initiated.A schematic diagram showing the state after the tape has