JP-7855405-B2 - Electronic components and methods for manufacturing electronic components

Inventors

• 井上 順之
• 岡藤 有輝

Assignees

• ＴＤＫ株式会社

Dates

Publication Date

20260508

Application Date

20220527

Claims (5)

1. A base body having an end face, Multiple internal electrodes arranged within the aforementioned body, The system comprises an external electrode positioned on the end face and electrically connected to the plurality of internal electrodes, The end face is formed such that the first groove includes a plurality of first groove portions that are spaced apart from each other, and the second groove includes a plurality of second groove portions that are spaced apart from each other and intersect with the plurality of first groove portions. The plurality of first groove portions and the plurality of second groove portions each have a first depth at each of the plurality of intersecting positions, and each of the plurality of non-intersecting positions has a second depth that is smaller than the first depth. The plurality of internal electrodes are arranged within the substrate so as to face each other. Each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions . Each of the aforementioned plurality of first groove portions extends along the first direction, Each of the aforementioned plurality of second groove portions extends along a second direction perpendicular to the first direction, An electronic component in which the angle between the direction in which the plurality of internal electrodes face each other and the first direction is 22.5 degrees .
2. The electronic component according to claim 1, wherein the plurality of first groove portions and the plurality of second groove portions are orthogonal to each other.
3. A base body having an end face, Multiple internal electrodes arranged within the aforementioned body, The system comprises an external electrode positioned on the end face and electrically connected to the plurality of internal electrodes, The end face is formed such that the first groove includes a plurality of first groove portions that are spaced apart from each other, and the second groove includes a plurality of second groove portions that are spaced apart from each other and intersect with the plurality of first groove portions. The plurality of first groove portions and the plurality of second groove portions each have a first depth at each of the plurality of intersecting positions, and each of the plurality of non-intersecting positions has a second depth that is smaller than the first depth. Each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions . An electronic component in which each of the plurality of first groove portions and the plurality of second groove portions exhibits a wave shape when viewed from a direction perpendicular to the end face .
4. The electronic component is a multilayer ceramic capacitor, as described in any one of claims 1 to 3 .
5. A method for manufacturing an electronic component according to claim 1 or 3 , The process of forming the first groove and the second groove on the end face by irradiating the end face with laser light, The step includes arranging the external electrode on the end face, The forming step includes forming the first grooves, which include the plurality of first groove portions, and the second grooves, which include the plurality of second groove portions, thereby exposing each of the plurality of internal electrodes from the end face at the corresponding position. A method for manufacturing an electronic component, comprising the step of arranging, which includes the step of forming the external electrode on the end face such that each of the plurality of internal electrodes is physically connected to the external electrode at the corresponding position.

Description

This invention relates to electronic components and methods for manufacturing electronic components. Known electronic components comprise a body with an end face, a plurality of internal electrodes arranged within the body, and an external electrode arranged on the end face (for example, Patent Document 1). The external electrode is electrically connected to the plurality of internal electrodes. Each of the plurality of internal electrodes is exposed from the end face. Multiple grooves are formed on the end face, spaced apart from each other and intersecting with the exposed plurality of internal electrodes. Japanese Patent Publication No. 2000-277381 Figure 1 is a perspective view showing an electronic component according to one embodiment.Figure 2 shows the cross-sectional configuration of the electronic component according to this embodiment.Figure 3 shows multiple internal electrodes, a first groove, and a second groove.Figure 4 is a perspective view showing multiple internal electrodes, a first groove, and a second groove.Figure 5 shows multiple internal electrodes, a first groove, and a second groove.Figure 6 shows multiple internal electrodes, a first groove, and a second groove.Figure 7 is a flowchart showing the method for manufacturing electronic components according to this embodiment. The embodiments of the present invention will be described in detail below with reference to the attached drawings. In this description, the same reference numerals will be used for elements that are identical or have the same function, and redundant explanations will be omitted. The configuration of the electronic component according to this embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view showing the electronic component according to this embodiment. Figure 2 is a diagram showing the cross-sectional configuration of the electronic component according to this embodiment. Figure 3 is a diagram showing multiple internal electrodes, a first groove, and a second groove. Figure 4 is a perspective view showing multiple internal electrodes, a first groove, and a second groove. As shown in Figures 1 and 2, the electronic component 1 comprises a base body 3, an external electrode 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. In this embodiment, the electronic component 1 includes a pair of external electrodes 5. In this embodiment, the electronic component 1 is a multilayer ceramic capacitor. The base body 3 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes, for example, a rectangular parallelepiped with chamfered corners and edges, and a rectangular parallelepiped with rounded corners and edges. The base body 3 has a pair of end faces 3a, a pair of side faces 3c, and a pair of side faces 3e. In this embodiment, the pair of end faces 3a face each other in a first direction D1, the pair of side faces 3c face each other in a second direction D2, and the pair of side faces 3e face each other in a third direction D3. The pair of end faces 3a, the pair of side faces 3c, and the pair of side faces 3e constitute the outer surface of the base body 3. The pair of side faces 3c and the pair of side faces 3e are adjacent to the pair of end faces 3a and extend in the first direction D1 to connect the pair of end faces 3a. The first direction D1 is the length direction of the base body 3, the second direction D2 is the width direction of the base body 3, and the third direction D3 is the height direction of the base body 3. The length of the base body 3 is between 0.4 mm and 7.5 mm. The width of the base body 3 is between 0.2 mm and 6.3 mm. The height of the base body 3 is between 0.2 mm and 2.8 mm. In this embodiment, the length of the base body 3 is 5.7 mm, the width of the base body 3 is 5.0 mm, and the height of the base body 3 is 2.6 mm. The base body 3 is composed of multiple dielectric layers stacked on top of each other. Each dielectric layer is stacked in a third direction D3. The base body 3 contains multiple stacked dielectric layers. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material is, for example, a dielectric ceramic of the BaTiO3 system, Ba(Ti,Zr)O3 system, (Ba,Ca) TiO3 system, CaZrO3 system, or (Ca,Sr) ZrO3 system. Each dielectric layer is integrated to such an extent that the boundaries between each dielectric layer are not visible. As shown in Figure 2, internal electrodes 7 and 9 are positioned at different locations in the third direction D3. Within the substrate 3, internal electrodes 7 and 9 are alternately arranged facing each other with a gap in the third direction D3. Multiple internal electrodes 7 and 9 face each other in the third direction D3. Internal electrodes 7 and 9 have different polarities. Internal electrode 7 has one end 7a exposed to one of a pair of end faces 3a. Internal electrode