JP-7855414-B2 - Substrate fixing device and method for manufacturing a substrate fixing device
Inventors
- 春原 昌宏
- 西川 里駆
Assignees
- 新光電気工業株式会社
Dates
- Publication Date
- 20260508
- Application Date
- 20220616
Claims (3)
- base plate and A ceramic plate fixed to the base plate and adsorbing the substrate by electrostatic force, It has an adhesive layer that bonds the base plate and the ceramic plate together, The aforementioned adhesive layer is A plurality of linear heat transfer elements are arranged adjacent to each other such that their longitudinal direction faces the stacking direction of the ceramic plate and the base plate, The heat transfer element is filled between adjacent heat transfer elements and has a resin that adheres to the ceramic plate and the base plate, The outer surface of the adhesive layer is Located on the inner side of the outer surface of the ceramic plate, the recess is formed together with the adhesive surfaces of the ceramic plate and the base plate that face each other on the outer circumference of the substrate fixing device. A sealing member is placed in the recess to close the recess. The adhesive layer comprises a first resin and a second resin, which are separated from each other, as the resin. The first resin is One end of the heat transfer element is covered and bonded to the ceramic plate, The second resin is The other end of the heat transfer element is covered and bonded to the base plate, The sealing member maintains the distance between the ceramic plate and the base plate such that a gap is formed between the first resin and the second resin. A substrate fixing device characterized by the following features.
- A first adhesive is placed between the ceramic plate and the adhesive layer, The present invention further comprises a second adhesive disposed between the base plate and the pre-adhesive layer, The substrate fixing device according to claim 1, wherein the adhesive layer is bonded to the ceramic plate via the first adhesive and to the base plate via the second adhesive.
- The substrate fixing device according to claim 2, wherein at least one of the ceramic plate, the first adhesive, and the second adhesive incorporates a heat-generating electrode.
Description
This invention relates to a substrate fixing device and a method for manufacturing a substrate fixing device. Generally, substrate fixing devices used to hold and adsorb wafers, such as when manufacturing semiconductor components, are also called electrostatic chucks (ESCs), and they are equipped with a ceramic plate containing electrodes. The substrate fixing device has a structure in which the ceramic plate is bonded to a base plate. By applying a voltage to the electrodes embedded in the ceramic plate, electrostatic force is used to adsorb the wafer onto the ceramic plate. By adsorbing and holding the wafer onto the ceramic plate, processes such as microfabrication and etching can be performed efficiently. In such substrate fixing devices, the ceramic plate is bonded to the base plate using, for example, a silicone resin-based adhesive. When the ceramic plate and base plate are bonded with an adhesive, the relatively high thermal resistance in the thickness direction of the adhesive can hinder heat transfer from the ceramic plate (which holds the wafer) to the base plate, potentially reducing the speed of wafer temperature control. To address this, a technique has been proposed to improve heat transfer from the ceramic plate to the base plate by using an adhesive layer composed of an aggregate of carbon nanotubes with high longitudinal thermal conductivity, instead of the adhesive. Japanese Patent Publication No. 2021-111688 Figure 1 is a perspective view showing the configuration of a substrate fixing device according to the first embodiment.Figure 2 is a schematic diagram showing a cross-section of the substrate fixing device according to the first embodiment.Figure 3 is a flowchart showing a method for manufacturing a substrate fixing device according to the first embodiment.Figure 4 shows a specific example of a ceramic plate.Figure 5 shows a specific example of the adhesive layer lamination process.Figure 6 shows a specific example of the ceramic plate lamination process.Figure 7 is a schematic diagram showing a cross-section of the substrate fixing device according to the second embodiment.Figure 8 is a flowchart showing a method for manufacturing a substrate fixing device according to the second embodiment.Figure 9 shows a specific example of the adhesive layer lamination process.Figure 10 shows a specific example of the ceramic plate lamination process.Figure 11 shows a first modified example of the substrate fixing device according to the second embodiment.Figure 12 shows a second modified example of the substrate fixing device according to the second embodiment.Figure 13 is a schematic diagram showing a cross-section of a substrate fixing device according to the third embodiment.Figure 14 is a flowchart showing a method for manufacturing a substrate fixing device according to the third embodiment.Figure 15 shows a specific example of the adhesive layer lamination process.Figure 16 shows a specific example of the ceramic plate lamination process.Figure 17 shows a specific example of an intermediate structure.Figure 18 is a schematic diagram showing a cross-section of the substrate fixing device according to the fourth embodiment.Figure 19 is a flowchart showing a method for manufacturing a substrate fixing device according to the fourth embodiment.Figure 20 shows a specific example of the sealing member placement process. The embodiments of the substrate fixing device and the method for manufacturing the substrate fixing device disclosed in this application will be described in detail below with reference to the drawings. Note that the disclosed technology is not limited by these embodiments. (First Embodiment) Figure 1 is a perspective view showing the configuration of a substrate fixing device 100 according to the first embodiment. The substrate fixing device 100 shown in Figure 1 has a structure in which a ceramic plate 120 is bonded to a base plate 110. The base plate 110 is a circular metal component, such as aluminum. The base plate 110 is the substrate for fixing the ceramic plate 120. The base plate 110 is attached, for example, to semiconductor manufacturing equipment, enabling the substrate fixing device 100 to function as a semiconductor holding device for holding wafers. The ceramic plate 120 is a circular member made of insulating ceramic. The diameter of the ceramic plate 120 is smaller than the diameter of the base plate 110, and the ceramic plate 120 is fixed to the center of the base plate 110. That is, the lower surface of the ceramic plate 120 becomes the adhesive surface that adheres to the base plate 110, and the ceramic plate 120 is fixed by this adhesion. The upper surface of the ceramic plate 120 is the adsorption surface that adsorbs objects to be adsorbed, such as wafers. The ceramic plate 120 incorporates conductive electrodes, and utilizes the electrostatic force generated when a voltage is applied to these electrodes to attract objects such as wafers to its adsorptio