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JP-7855417-B2 - processing equipment

JP7855417B2JP 7855417 B2JP7855417 B2JP 7855417B2JP-7855417-B2

Inventors

  • 中塚 敦

Assignees

  • 株式会社ディスコ

Dates

Publication Date
20260508
Application Date
20220620

Claims (4)

  1. A holding unit for holding the workpiece, A processing unit equipped with a processing tool for processing the workpiece, The system includes a processing water supply unit that supplies processing water to the workpiece, A processing apparatus that processes a workpiece held by a holding unit while supplying processing water to the workpiece using a processing water supply unit, A water case that receives the processing water supplied to the workpiece held by the holding unit and which falls below the holding unit, The system further comprises a discharge path connected to the water case, which serves as a path for discharging the processed water from the water case, The water case comprises a bottom plate, side plates erected from the outer circumference of the bottom plate, and a porous plate provided above the bottom plate. A processing apparatus characterized in that the upper surface of the porous plate, which is provided above the bottom plate, is inclined to become lower toward the discharge passage.
  2. The porous plate is connected to a fluid supply source that provides a fluid containing either air or water, or both. The processing apparatus according to claim 1, characterized in that when the fluid supply source is activated, the fluid that has passed through the porous plate is ejected onto the upper surface of the porous plate.
  3. The processing apparatus according to claim 2, characterized in that a dispersion plate is provided between the bottom plate of the water case and the porous plate, the dispersion plate having a dispersion supply path that serves as a route for supplying the fluid supplied from the fluid supply source to the porous plate while dispersing it.
  4. The water case is equipped with a water supply nozzle that supplies water to the upper surface of the porous plate. The processing apparatus according to any one of claims 1 to 3, characterized in that when water is supplied from the water supply nozzle to the upper surface of the porous plate, the water flows along the inclined upper surface toward the discharge passage.

Description

This invention relates to a processing apparatus comprising a holding unit for holding a workpiece and a processing unit for processing the workpiece held by the holding unit, wherein the processing unit processes the workpiece while supplying processing water. In the manufacturing process of device chips used in various electronic devices such as mobile phones and personal computers, a disc-shaped wafer is used, in which devices are formed in multiple regions demarcated by multiple intersecting division lines (streets). By thinning this wafer and then dividing it along the division lines, multiple device chips, each containing a device, are obtained. For example, a grinding machine is used for thinning the wafer, and a cutting machine is used for dividing the wafer. Grinding and cutting machines, and other processing devices, comprise a holding unit for holding a workpiece, a processing unit for processing the workpiece held by the holding unit, and a processing water supply unit for supplying processing water, such as pure water, to the workpiece being processed. When a workpiece is processed by the processing device, fine processing debris is generated from the workpiece and the processing tool. This debris, along with the processing water, falls into a water case surrounding the holding unit, flows along the inclined bottom surface of the water case, and is discharged outside the processing device through an outlet. When processing a workpiece using a processing machine, relatively large and heavy scraps can sometimes be generated when the ends of the workpiece separate. These scraps tend not to flow easily when they fall into the water case and tend to accumulate at the bottom. In particular, if the scraps include surfaces that formed the flat front and back surfaces of the workpiece, or if the scraps are generated during the grinding process of one side of the workpiece, the scraps may have a flat surface. When this flat surface comes into contact with the flat bottom surface of the water case, the scraps will adhere strongly to it. Therefore, processing devices equipped with a water supply mechanism that supplies water to the bottom of the water case, and processing devices with a specially designed bottom surface, have been developed (see Patent Documents 1, 2, and 3). However, in all of these processing devices, scraps that fall into the water case sometimes remain on the floor, and further improvement in the ability to remove scraps was desired. Furthermore, a processing device was developed that incorporates a unit for mechanically removing scrap material into the bottom of the water case (see Patent Document 4). However, this unit requires power to operate, and regular maintenance is necessary to prevent malfunction, resulting in significant operating costs. Japanese Patent Publication No. 2006-218551Japanese Patent Publication No. 2015-5544Japanese Patent Publication No. 2019-192846Japanese Patent Publication No. 2021-109278 This is a schematic perspective view of the processing equipment.This is a schematic perspective view showing the water case and retaining unit.This is a schematic cross-sectional view of a water case.This is a schematic perspective view showing a cut water case.Figure 5(A) is a schematic perspective view showing the upper surface of the dispersion plate, and Figure 5(B) is a schematic perspective view showing the lower surface of the dispersion plate.This is a schematic cross-sectional view of a water case.This is a schematic perspective view showing a water case related to another example of a case that has been cut. The embodiments of the present invention will be described in detail below with reference to the attached drawings. Note that, for the sake of clarity, the size and shape of each structure may be simplified in the drawings, or their external features may be emphasized. Therefore, the structures are not limited to the shapes, sizes, angles, and arrangements shown in the drawings. First, the workpiece processed by the processing apparatus according to this embodiment will be described. Figure 1 includes a schematic perspective view of the workpiece 1. The workpiece 1 is, for example, a disc-shaped wafer made of a material such as silicon, and has a surface 1a and a surface 1b that are generally parallel to each other and flat. Multiple division lines (not shown) are set on the surface 1a of the workpiece 1, arranged in a grid pattern so as to intersect with each other. A device (not shown), such as an IC or LSI, is formed in each region demarcated by the division lines on the surface 1a of the workpiece 1. There are no restrictions on the material, structure, size, etc., of the workpiece 1. For example, workpiece 1 may be a substrate made of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass (quartz glass, borosilicate glass, etc.), etc. Furthermore, there are no restrictions on the type, quantity, shape, structure, size, arrangement