JP-7855422-B2 - Substrate fixing device and method for manufacturing a substrate fixing device

JP7855422B2JP 7855422 B2JP7855422 B2JP 7855422B2JP-7855422-B2

Inventors

春原昌宏
西川里駆

Assignees

新光電気工業株式会社

Dates

Publication Date: 20260508
Application Date: 20220621

Claims (5)

base plate and A ceramic plate is bonded to the base plate via an adhesive layer and attracts the substrate by electrostatic force, The adhesive surface of the ceramic plate, the adhesive surface of the base plate, and at least one of the adhesive layers, is disposed in a central region that overlaps with the central part of the ceramic plate in a plan view or in an outer peripheral region that overlaps with the outer peripheral part of the ceramic plate in a plan view, and comprises a thermal conductive member whose thermal conductivity in the lamination direction between the base plate and the ceramic plate is higher than the thermal conductivity in the planar direction perpendicular to the lamination direction. The aforementioned heat conductive member is Carbon nanotubes arranged such that their longitudinal direction faces the stacking direction, A resin that coats the carbon nanotube with both longitudinal ends of the carbon nanotube exposed. It has, The aforementioned heat conductive member is Displaced within the central region or the outer peripheral region of the adhesive layer, The aforementioned resin is The first surface that is bonded to the adhesive surface of the ceramic plate, A second surface which is bonded to the adhesive surface of the base plate, The side surface that connects the first surface and the second surface and is covered by the adhesive layer It has, The carbon nanotube mentioned above is One end surface is exposed from the first surface of the resin and contacts the adhesive surface of the ceramic plate, and the other end surface is exposed from the second surface of the resin and contacts the adhesive surface of the base plate. A substrate fixing device characterized by the following features.
base plate and A ceramic plate is bonded to the base plate via an adhesive layer and attracts the substrate by electrostatic force, A thermal conductive member is disposed in at least one of the bonding surfaces of the ceramic plate, the bonding surface of the base plate, and inside the adhesive layer, in a central region that overlaps with the central part of the ceramic plate in a plan view, or in an outer peripheral region that overlaps with the outer peripheral part of the ceramic plate in a plan view, wherein the thermal conductivity in the lamination direction between the base plate and the ceramic plate is higher than the thermal conductivity in the planar direction perpendicular to the lamination direction. It has, The adhesive layer is A first adhesive for bonding the heat conductive member to the central region or the outer peripheral region of the bonding surface of the ceramic plate, A second adhesive is laminated between the adhesive surface of the ceramic plate and the adhesive surface of the base plate, and covers the heat conductive member and the first adhesive. It has, The first adhesive is, A substrate fixing device characterized by having a higher thermal conductivity than the second adhesive.
base plate and A ceramic plate is bonded to the base plate via an adhesive layer and attracts the substrate by electrostatic force, A thermal conductive member is disposed in at least one of the bonding surfaces of the ceramic plate, the bonding surface of the base plate, and inside the adhesive layer, in a central region that overlaps with the central part of the ceramic plate in a plan view, or in an outer peripheral region that overlaps with the outer peripheral part of the ceramic plate in a plan view, wherein the thermal conductivity in the lamination direction between the base plate and the ceramic plate is higher than the thermal conductivity in the planar direction perpendicular to the lamination direction. It has, A recess is formed in the central region or the outer peripheral region of the adhesive surface of the ceramic plate. The aforementioned heat conductive member is A substrate fixing device characterized by being positioned within the recess.
base plate and A ceramic plate is bonded to the base plate via an adhesive layer and attracts the substrate by electrostatic force, A thermal conductive member is disposed in at least one of the bonding surfaces of the ceramic plate, the bonding surface of the base plate, and inside the adhesive layer, in a central region that overlaps with the central part of the ceramic plate in a plan view, or in an outer peripheral region that overlaps with the outer peripheral part of the ceramic plate in a plan view, wherein the thermal conductivity in the lamination direction between the base plate and the ceramic plate is higher than the thermal conductivity in the planar direction perpendicular to the lamination direction. It has, The aforementioned heat conductive member is At least one of the central regions located within the adhesive surface of the ceramic plate, the adhesive surface of the base plate, and the adhesive layer, The aforementioned ceramic plate is A substrate fixing device characterized by having a heat-generating electrode built into the outer periphery.
base plate and A ceramic plate is bonded to the base plate via an adhesive layer and attracts the substrate by electrostatic force, A thermal conductive member is disposed in at least one of the bonding surfaces of the ceramic plate, the bonding surface of the base plate, and inside the adhesive layer, in a central region that overlaps with the central part of the ceramic plate in a plan view, or in an outer peripheral region that overlaps with the outer peripheral part of the ceramic plate in a plan view, wherein the thermal conductivity in the lamination direction between the base plate and the ceramic plate is higher than the thermal conductivity in the planar direction perpendicular to the lamination direction. It has, The aforementioned heat conductive member is Displaced within the adhesive surface of the ceramic plate, the adhesive surface of the base plate, and at least one of the outer peripheral regions inside the adhesive layer, The aforementioned ceramic plate is A substrate fixing device characterized by having a heat-generating electrode built into the central part.

Description

This invention relates to a substrate fixing device and a method for manufacturing a substrate fixing device. Generally, substrate fixing devices used to hold and adsorb wafers, such as when manufacturing semiconductor components, are also called electrostatic chucks (ESCs), and they are equipped with a ceramic plate containing electrodes. The substrate fixing device has a structure in which the ceramic plate is bonded to a base plate. By applying a voltage to the electrodes embedded in the ceramic plate, electrostatic force is used to adsorb the wafer onto the ceramic plate. By adsorbing and holding the wafer onto the ceramic plate, processes such as microfabrication and etching can be performed efficiently. In such substrate fixing devices, the ceramic plate is bonded to the base plate using, for example, a silicone resin-based adhesive. When the ceramic plate and base plate are bonded with an adhesive, the relatively high thermal resistance in the thickness direction of the adhesive can hinder heat transfer from the ceramic plate (which holds the wafer) to the base plate, potentially reducing the speed of wafer temperature control. To address this, a technique has been proposed to improve heat transfer from the ceramic plate to the base plate by using an adhesive layer composed of an aggregate of carbon nanotubes with high longitudinal thermal conductivity, instead of the adhesive. Japanese Patent Publication No. 2021-111688 Figure 1 is a perspective view showing the configuration of a substrate fixing device according to the first embodiment.Figure 2 is a schematic diagram showing a cross-section of the substrate fixing device according to the first embodiment.Figure 3 is a plan view showing a specific example of the arrangement of the heat conductive member and heater electrode.Figure 4 is a flowchart showing a method for manufacturing a substrate fixing device according to the first embodiment.Figure 5 shows a specific example of a ceramic plate.Figure 6 shows a specific example of the heat conductive member bonding process.Figure 7 shows a specific example of the second adhesive application process.Figure 8 shows a first modified example of the substrate fixing device according to the first embodiment.Figure 9 shows a second modified example of the substrate fixing device according to the first embodiment.Figure 10 shows a third modified example of the substrate fixing device according to the first embodiment.Figure 11 is a schematic diagram showing a cross-section of a substrate fixing device according to the second embodiment.Figure 12 is a plan view showing a specific example of the arrangement of the heat conductive member and heater electrode.Figure 13 is a flowchart showing a method for manufacturing a substrate fixing device according to the second embodiment.Figure 14 shows a specific example of a ceramic plate.Figure 15 shows a specific example of the heat conductive member bonding process.Figure 16 shows a first modified example of the substrate fixing device according to the second embodiment.Figure 17 shows a second modified example of the substrate fixing device according to the second embodiment.Figure 18 shows a third modified example of the substrate fixing device according to the second embodiment. The embodiments of the substrate fixing device and the method for manufacturing the substrate fixing device disclosed in this application will be described in detail below with reference to the drawings. Note that the disclosed technology is not limited by these embodiments. (First Embodiment) Figure 1 is a perspective view showing the configuration of a substrate fixing device 100 according to the first embodiment. The substrate fixing device 100 shown in Figure 1 has a structure in which a ceramic plate 120 is bonded to a base plate 110. The base plate 110 is a circular metal component, such as aluminum. The base plate 110 is the substrate for fixing the ceramic plate 120. The base plate 110 is attached, for example, to semiconductor manufacturing equipment, enabling the substrate fixing device 100 to function as a semiconductor holding device for holding wafers. The ceramic plate 120 is a circular member made of insulating ceramic. The diameter of the ceramic plate 120 is smaller than the diameter of the base plate 110, and the ceramic plate 120 is fixed to the center of the base plate 110. That is, the lower surface of the ceramic plate 120 becomes the adhesive surface that adheres to the base plate 110, and the ceramic plate 120 is fixed by this adhesion. The upper surface of the ceramic plate 120 is the adsorption surface that adsorbs objects to be adsorbed, such as wafers. The ceramic plate 120 incorporates conductive electrodes, and utilizes the electrostatic force generated when a voltage is applied to these electrodes to attract objects such as wafers to its adsorption surface. Furthermore, the ceramic plate 120 incorporates heater electrodes, which generate heat when a voltage i