JP-7855503-B2 - Cooling devices for electronic equipment

JP7855503B2JP 7855503 B2JP7855503 B2JP 7855503B2JP-7855503-B2

Inventors

眞田強

Assignees

東芝テック株式会社

Dates

Publication Date: 20260508
Application Date: 20221220

Claims (4)

A heat sink that dissipates heat generated by electronic devices by passing air introduced from the outside through multiple fins, A first air blower having a first discharge surface that discharges air introduced from the outside toward the heat sink, A second air blower having the same size as the first air blower and a second discharge surface that discharges air introduced from the outside toward the heat sink, The first air blower and the second air blower are installed in a housing that covers the heat sink and has an exhaust port for discharging air that has passed between the fins to the outside, The sum of the diameters of the first discharge surface and the second discharge surface is greater than the width of the heat sink, and the first discharge surface and the second discharge surface are arranged symmetrically with respect to a plane parallel to the fin, passing through the center of the heat sink in the width direction, with an angle of 90 degrees or more between them on the upstream side of the fin. A first wall portion is provided, which forms part of the housing and is installed between the outer edge of the first air blower and the outer edge of the heat sink in the width direction, and between the outer edge of the second air blower and the outer edge of the heat sink in the width direction, and which guides the air discharged from the first discharge surface and the second discharge surface to the heat sink. Both are formed inside the aforementioned housing. A second wall portion is installed between the inner edges of the first and second air blowers and the central position in the width direction of the heat sink, and guides the air discharged from the first and second discharge surfaces to the heat sink without mixing them, A first separating wall connects the central position of the first discharge surface, which passes through the position between the first discharge surface and the position between the first wall and the second wall on the side of the first air blower, to the fins of the heat sink, and an intermediate position between the outer edge of the heat sink on the side of the first wall on the side of the first air blower and the position of the fins reached by the second wall , The heat sink comprises a second separating wall connecting the central position of the second discharge surface, which passes through the position between the second discharge surface and the position between the first wall and the second wall on the side of the second air blower, to the fins of the heat sink, and an intermediate position between the outer edge of the heat sink on the side of the first wall on the side of the second air blower and the position of the fins reached by the second wall, Cooling device for electronic equipment.
The first separation wall and the second separation wall are installed so as not to equally divide the cross-sectional area of the flow path downstream of the first discharge surface and the second discharge surface. Cooling device for electronic equipment according to claim 1.
Multiple first and second separation walls are installed. Cooling device for electronic equipment according to claim 2 .
The first separation wall and the second separation wall are thinner than the second wall portion. Cooling device for electronic equipment according to claim 1.

Description

Embodiments of the present invention relate to a cooling device for electronic equipment. Conventionally, electronic devices such as PCs (Personal Computers) contain components that generate high temperatures, such as CPUs (Central Processing Units). Generally, heat sinks are attached to such components for heat dissipation. Heat is dissipated by a fan located upstream of the heat sink drawing in air, which is then exhausted downstream. (For example, Patent Document 1) Recently, there has been a strong demand for miniaturization of electronic devices, and consequently, there is a need for smaller cooling fans that blow air onto heatsinks. However, miniaturizing the cooling fan reduces the amount of cooling air it can discharge, which degrades the cooling performance of the heatsink, making it undesirable. Figure 1 is a perspective view showing an example of a fan duct according to an embodiment.Figure 2 is a perspective view showing an example of a housing that forms a fan duct.Figure 3 is a perspective view showing an example of the schematic structure of an electronic device to which a fan duct is attached.Figure 4 is a perspective view showing an example of a ventilation hole provided in an electronic device.Figure 5 is a plan view showing an example of the arrangement of intake fans in a fan duct.Figure 6 is a front view showing an example of the arrangement of intake fans in a fan duct.Figure 7 is a side view showing an example of the arrangement of intake fans in a fan duct.Figure 8 is a plan view showing a second example of the arrangement of intake fans in a fan duct.Figure 9 is a plan view showing a third example of the arrangement of intake fans in a fan duct.Figure 10 is a plan view showing a fourth example of the arrangement of intake fans in a fan duct.Figure 11 is a plan view showing an example of a modified fan duct of the embodiment.Figure 12 is a plan view showing a second example of a modified fan duct of the embodiment. An embodiment of the cooling device described herein, applied to a fan duct 1, will be described with reference to the drawings. (Outline structure of the fan duct) The schematic structure of a fan duct 1, which is an example of a cooling device of this disclosure, will be explained using Figures 1 and 2. Figure 1 is a perspective view showing an example of a fan duct of the embodiment. Figure 2 is a perspective view showing an example of a housing forming the fan duct. For the sake of explanation, a three-dimensional coordinate system XYZ is set in Figure 1. In the three-dimensional coordinate system XYZ, the width direction (left-right direction) of the fan duct 1 is the X-axis direction, the depth direction (front-back direction) is the Y-axis direction, and the height direction (up-down direction) is the Z-axis direction. As shown in Figure 1, the fan duct 1 has a roughly box-shaped housing 9 and is a cover member that encloses the heat sink 2 and the intake fans 3 and 4 that blow air onto the heat sink 2. The fan duct 1 is a component that combines the functions of both an intake duct and an exhaust duct, passing the air drawn in by the intake fans 3 and 4 from the intake port 11 through the fins 22 of the heat sink 2 installed inside the ventilation pipe (duct) and discharging it from the exhaust port 12. Intake fans 3 and 4 draw in air from outside the fan duct 1, introduce the drawn-in air into the fan duct 1, and blow it in the negative direction of the Y-axis. Intake fan 3 is an example of the first blowing section in this disclosure. Intake fan 4 is an example of the second blowing section in this disclosure. Intake ports 11 are provided on the fan duct 1 at positions upstream of the blowing direction of intake fan 3 and intake fan 4, and exhaust ports 12 are provided at positions downstream. The intake fan 3 has a first discharge surface that discharges air introduced from the outside toward the heat sink 2. The intake fan 4 also has a second discharge surface that discharges air introduced from the outside toward the heat sink 2. Intake fans 3 and 4 are the same size and are positioned symmetrically along the X-axis, passing through the center of the heatsink 2 in the width direction, with an angle of 90 degrees or more, with respect to a plane parallel to the fins 22 (a plane parallel to the YZ plane). Further details will be described later (see Figures 5 and 6). The heatsink 2 is attached to a heat-generating electronic component, such as the CPU (Central Processing Unit). The heat generated by the CPU is conducted through the heatsink 2. This heat is then dissipated into the surrounding air. This prevents malfunctions caused by CPU overheating. The heatsink 2 consists of a base portion 21 and multiple fins 22. The fins 22 are erected on the base portion 21. The multiple fins 22 are adjacent to each other at predetermined intervals. The base portion 21 is in contact with the CPU, and heat from the CPU is conducted to it. The fins 22 dissipate the heat condu