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JP-7855504-B2 - Cooling devices for electronic equipment

JP7855504B2JP 7855504 B2JP7855504 B2JP 7855504B2JP-7855504-B2

Inventors

  • 眞田 強

Assignees

  • 東芝テック株式会社

Dates

Publication Date
20260508
Application Date
20221220

Claims (3)

  1. A heat sink that dissipates heat generated by electronic devices by passing air introduced from the outside through multiple fins, A first air blower having a first discharge surface that discharges air introduced from the outside toward the heat sink, A second air blower having the same size as the first air blower and a second discharge surface that discharges air introduced from the outside toward the heat sink, An exhaust port for discharging the air that has passed between the fins to the outside, The heat sink is provided with a top plate that covers the gap between at least a portion of the upper part of the heat sink and the first and second air blowers , The sum of the diameters of the first discharge surface and the second discharge surface is greater than the width of the heat sink, and the first discharge surface and the second discharge surface are arranged symmetrically with respect to a plane parallel to the fin, passing through the center position in the width direction of the heat sink, with an angle of 90 degrees or more between them on the upstream side of the fin. The exhaust port is equipped with a branching wall that splits the air that has passed between the fins of the heat sink into an upper exhaust port and a lower exhaust port, so as to avoid a portion of the area downstream of itself. Cooling device for electronic equipment.
  2. The space between the outer edge of the first air blower and the outer edge of the heat sink in the width direction, and the space between the outer edge of the second air blower and the outer edge of the heat sink in the width direction, are covered by a housing having a first wall portion that restricts the airflow discharged from the first discharge surface and the second discharge surface to be directed toward the heat sink. Cooling device for electronic equipment according to claim 1.
  3. Between the inner edges of the first and second air blowers and the central position in the width direction of the heat sink, there is a second wall portion that guides the air discharged from the first and second discharge surfaces to the heat sink without mixing them. Cooling device for electronic equipment according to claim 2.

Description

Embodiments of the present invention relate to a cooling device for electronic equipment. Conventionally, electronic devices such as PCs (Personal Computers) contain components that generate high temperatures, such as CPUs (Central Processing Units). Generally, heat sinks are attached to such components for heat dissipation. Heat is dissipated by a fan located upstream of the heat sink drawing in air, which is then exhausted downstream. (For example, Patent Document 1) Recently, there has been a strong demand for miniaturization of electronic devices, and consequently, there is a need for smaller cooling fans that blow air onto heatsinks. However, miniaturizing the cooling fan reduces the amount of cooling air it can discharge, which degrades the cooling performance of the heatsink and is therefore undesirable. Figure 1 is a perspective view showing an example of a fan duct according to an embodiment.Figure 2 is a perspective view showing an example of a housing that forms a fan duct.Figure 3 is a perspective view showing an example of the schematic structure of an electronic device to which a fan duct is attached.Figure 4 is a perspective view showing an example of a ventilation hole provided in an electronic device.Figure 5 is a plan view showing an example of the arrangement of intake fans in a fan duct.Figure 6 is a front view showing an example of the arrangement of intake fans in a fan duct.Figure 7 is a side view showing an example of the arrangement of intake fans in a fan duct.Figure 8 is a plan view showing a second example of the arrangement of intake fans in a fan duct.Figure 9 is a plan view showing a third example of the arrangement of intake fans in a fan duct.Figure 10 is a plan view showing an example of the arrangement of the intake fan in a fan duct of a modified embodiment.Figure 11 is a plan view showing a second example of the arrangement of the suction fan in a fan duct of a modified embodiment.Figure 12 is a plan view showing a third example of the arrangement of the suction fan in a fan duct, which is a modified example of the embodiment.Figure 13 is a plan view showing a fourth example of the arrangement of the suction fan in a fan duct, which is a modified example of the embodiment. An embodiment of the cooling device described herein, applied to a fan duct 1, will be described with reference to the drawings. (Outline structure of the fan duct) The schematic structure of a fan duct 1, which is an example of a cooling device of this disclosure, will be explained using Figures 1 and 2. Figure 1 is a perspective view showing an example of a fan duct of the embodiment. Figure 2 is a perspective view showing an example of a housing forming the fan duct. For the sake of explanation, a three-dimensional coordinate system XYZ is set in Figures 1 and 2. In the three-dimensional coordinate system XYZ, the width direction (left-right direction) of the fan duct 1 is the X-axis direction, the depth direction (front-back direction) is the Y-axis direction, and the height direction (up-down direction) is the Z-axis direction. As shown in Figure 1, the fan duct 1 has a roughly box-shaped housing 9 and is a cover member that encloses the heat sink 2 and the intake fans 3 and 4 that blow air onto the heat sink 2. The fan duct 1 is a component that combines the functions of both an intake duct and an exhaust duct, passing the air drawn in by the intake fans 3 and 4 from the intake port 11 through the fins 22 of the heat sink 2 installed inside the ventilation pipe (duct) and discharging it from the exhaust port 12. Intake fans 3 and 4 draw in air from outside the fan duct 1, introduce the drawn-in air into the fan duct 1, and blow it in the negative direction of the Y-axis. Intake fan 3 is an example of the first blowing section in this disclosure. Intake fan 4 is an example of the second blowing section in this disclosure. Intake ports 11 are provided on the fan duct 1 at positions upstream of the blowing direction of intake fan 3 and intake fan 4, and exhaust ports 12 are provided at positions downstream. The intake fan 3 has a first discharge surface that discharges air introduced from the outside toward the heat sink 2. The intake fan 4 also has a second discharge surface that discharges air introduced from the outside toward the heat sink 2. Intake fans 3 and 4 are the same size and are arranged symmetrically along the X-axis, passing through the center of the heatsink 2 in the width direction, with an angle of 90 degrees or more, with respect to a plane parallel to the fins 22 (a plane parallel to the YZ plane). Further details will be described later (see Figures 5 and 6). The heatsink 2 is attached to a heat-generating electronic component, such as the CPU (Central Processing Unit). The heat generated by the CPU is conducted through the heatsink 2. This heat is then dissipated into the surrounding air. This prevents malfunctions caused by CPU overheating. The heatsink 2 consists of a base po